403 Programmable Logic Devices (PLD) 14

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K50GC403-4

Altera

Loadable PLD

Commercial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

0.6 ns

2880

No

5.25 V

CMOS

310

5

3.3/5,5 V

Grid Array, Interstitial Pitch

SPGA403M,37X37

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 310 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P403

1

5.026 mm

49.78 mm

No

2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

62.89 MHz

310

220 °C (428 °F)

49.78 mm

310

EPF10K50GI403-3

Altera

Loadable PLD

Industrial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

17.2 ns

No

5.25 V

CMOS

5

Grid Array, Interstitial Pitch

Registered

4.75 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 310 I/O

4

-40 °C (-40 °F)

Perpendicular

S-CPGA-P403

5.026 mm

49.78 mm

No

49.78 mm

310

EPF10K50GM403-4

Altera

Loadable PLD

Military

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

23.8 ns

No

5.5 V

CMOS

5

Grid Array, Interstitial Pitch

Registered

4.5 V

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 310 I/O

4

-55 °C (-67 °F)

Perpendicular

S-CPGA-P403

3.916 mm

49.78 mm

No

2880 Logic elements Configurable I/O operation with 3.3 V or 5 V

60.6 MHz

49.78 mm

310

EPF10K30GC403-5

Altera

Loadable PLD

Commercial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

27 ns

No

5.25 V

CMOS

5

Grid Array, Interstitial Pitch

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 248 I/O

4

0 °C (32 °F)

Perpendicular

S-CPGA-P403

3.916 mm

49.78 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

53.76 MHz

49.78 mm

248

EPF10K30GM403-4

Altera

Loadable PLD

Military

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

23.8 ns

No

5.5 V

CMOS

5

Grid Array, Interstitial Pitch

Registered

4.5 V

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 248 I/O

4

-55 °C (-67 °F)

Perpendicular

S-CPGA-P403

3.916 mm

49.78 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

60.6 MHz

49.78 mm

248

EPF10K50GC403-3

Altera

Loadable PLD

Commercial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

0.6 ns

2880

No

5.25 V

CMOS

310

5

3.3/5,5 V

Grid Array, Interstitial Pitch

SPGA403M,37X37

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 310 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P403

1

5.026 mm

49.78 mm

No

2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

66.67 MHz

310

220 °C (428 °F)

49.78 mm

310

EPF10K30GI403-5

Altera

Loadable PLD

Industrial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

27 ns

No

5.5 V

CMOS

5

Grid Array, Interstitial Pitch

Registered

4.5 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 248 I/O

4

-40 °C (-40 °F)

Perpendicular

S-CPGA-P403

3.916 mm

49.78 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

53.76 MHz

49.78 mm

248

EPF10K50GI403-4

Altera

Loadable PLD

Industrial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

21.1 ns

2880

No

5.25 V

CMOS

310

5

3.3/5,5 V

Grid Array, Interstitial Pitch

SPGA403M,37X37

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 310 I/O

4

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P403

1

5.026 mm

49.78 mm

No

2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

62.89 MHz

310

220 °C (428 °F)

49.78 mm

310

EPF10K50GI403-5

Altera

Loadable PLD

Industrial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

27 ns

2880

No

5.5 V

CMOS

310

5

3.3/5,5 V

Grid Array, Interstitial Pitch

SPGA403M,37X37

Field Programmable Gate Arrays

Registered

4.5 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 310 I/O

4

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-CPGA-P403

1

3.916 mm

49.78 mm

No

2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

57.8 MHz

310

220 °C (428 °F)

49.78 mm

310

EPF10K30GI403-4

Altera

Loadable PLD

Industrial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

23.8 ns

No

5.5 V

CMOS

5

Grid Array, Interstitial Pitch

Registered

4.5 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 248 I/O

4

-40 °C (-40 °F)

Perpendicular

S-CPGA-P403

3.916 mm

49.78 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

60.6 MHz

49.78 mm

248

EPF10K30GC403-4

Altera

Loadable PLD

Commercial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

23.8 ns

No

5.25 V

CMOS

5

Grid Array, Interstitial Pitch

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 248 I/O

4

0 °C (32 °F)

Perpendicular

S-CPGA-P403

3.916 mm

49.78 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

60.6 MHz

49.78 mm

248

EPF10K30GM403-5

Altera

Loadable PLD

Military

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

27 ns

No

5.5 V

CMOS

5

Grid Array, Interstitial Pitch

Registered

4.5 V

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 248 I/O

4

-55 °C (-67 °F)

Perpendicular

S-CPGA-P403

3.916 mm

49.78 mm

No

1728 Logic elements Configurable I/O operation with 3.3 V or 5 V

53.76 MHz

49.78 mm

248

EPF10K50GM403-5

Altera

Loadable PLD

Military

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

27 ns

No

5.5 V

CMOS

5

Grid Array, Interstitial Pitch

Registered

4.5 V

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 310 I/O

4

-55 °C (-67 °F)

Perpendicular

S-CPGA-P403

3.916 mm

49.78 mm

No

2880 Logic elements Configurable I/O operation with 3.3 V or 5 V

53.76 MHz

49.78 mm

310

EPF10K50GC403-5

Altera

Loadable PLD

Commercial

Pin/Peg

403

IPGA

Square

Ceramic, Metal-Sealed Cofired

27 ns

2880

No

5.25 V

CMOS

310

5

3.3/5,5 V

Grid Array, Interstitial Pitch

SPGA403M,37X37

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 310 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P403

1

3.916 mm

49.78 mm

No

2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e0

57.8 MHz

310

220 °C (428 °F)

49.78 mm

310

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.