44 Programmable Logic Devices (PLD) 1,332

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
CY37064VP44-83JI	Infineon Technologies	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes		64	CMOS				3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQCC-J44				No		e0						Yes
CY37064P44-100AI	Infineon Technologies	EE PLD	Industrial	Gull Wing	44	QFP	Square	Plastic/Epoxy	12 ns	Yes		64	CMOS					3.3/5,5 V	Flatpack	QFP44,.47SQ,32	Programmable Logic Devices	Yes				.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44				No		e0						Yes
CY37064P44-100YMB	Infineon Technologies	EE PLD	Military	J Bend	44	QCCJ	Square	Ceramic	12 ns	Yes		64	CMOS	38535Q/M;38534H;883B				3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes				1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Quad	S-XQCC-J44				No		e0						Yes
CY37064P44-100JI	Infineon Technologies	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes		64	CMOS					3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQCC-J44				No		e0						Yes
CY37064VP44-83AI	Infineon Technologies	EE PLD	Industrial	Gull Wing	44	QFP	Square	Plastic/Epoxy	15 ns	Yes		64	CMOS				3.3	3.3 V	Flatpack	QFP44,.47SQ,32	Programmable Logic Devices	Yes				.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G44				No		e0						Yes
PA7572FI-20L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS		24	PLA-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices		Macrocell	4.5 V	124	.8 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	12 mm	No		e3	66.6 MHz	40 s	24	260 °C (500 °F)	12 mm		24
PA7572F-20	Diodes Incorporated	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS		24	PLA-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices		Macrocell	4.75 V	124	.8 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	12 mm	No			66.6 MHz		24	245 °C (473 °F)	12 mm		24
PA7572JI-20L	Diodes Incorporated	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS		24	PLA-TYPE	5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.5 V	124	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.369 mm	16.586 mm	No		e3	66.6 MHz		24	260 °C (500 °F)	16.586 mm		24
PA7572FI-20	Diodes Incorporated	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS		24	PLA-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices		Macrocell	4.5 V	124	.8 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	12 mm	No			66.6 MHz		24	245 °C (473 °F)	12 mm		24
PA7572F-20L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS		24	PLA-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices		Macrocell	4.75 V	124	.8 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	12 mm	No		e3	66.6 MHz	40 s	24	260 °C (500 °F)	12 mm		24
PA7572JI-20	Diodes Incorporated	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS		24	PLA-TYPE	5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.5 V	124	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.369 mm	16.586 mm	No			66.6 MHz		24	245 °C (473 °F)	16.586 mm		24
PA7572J-20	Diodes Incorporated	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS		24	PLA-TYPE	5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.75 V	124	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44		4.369 mm	16.586 mm	No		e0	66.6 MHz		24		16.586 mm		24
PA7572J-20L	Diodes Incorporated	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS		24	PLA-TYPE	5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.75 V	124	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.369 mm	16.586 mm	No		e3	66.6 MHz		24	260 °C (500 °F)	16.586 mm		24
XC9536XV-7PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	36	CMOS				2.5	1.8/3.3,2.5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.37 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e3		30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XCR3032C-12PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.63 V	32	CMOS				3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	47 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XC9536XV-5VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	2.62 V	36	CMOS				2.5	1.8/3.3,2.5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.37 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	222.2 MHz	30 s		260 °C (500 °F)	10 mm	Yes	34
XC7336-7WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	12 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	125 MHz				16.51 mm	No	32
XC7236-25WC44I	Xilinx	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	36	CMOS				5	5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)		Quad	S-CQCC-J44		4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks		33 MHz				16.51 mm	No	30
XC7336-15PQ44C	Xilinx	OT PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Flatpack	QFP44,.5SQ,20	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	2.35 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	10 mm	No	32
XC7236A-16WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.25 V	36	CMOS				5	3/5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 30 I/O	2	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V		60 MHz				16.51 mm	No	30
XCR5032-7PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			91 MHz				16.5862 mm		32
XCR3032-10VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	13 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			57 MHz				10 mm		32
XC7336Q-12VQ44C	Xilinx	OT PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	19 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	80 MHz	30 s		240 °C (464 °F)	10 mm	No	32
XCR3032XL-10PCG44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS				3.3	3/3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e3	95 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	36
XC7336Q-15PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XCR3032XL-7VQG44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS				3.3	3/3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	119 MHz	30 s		260 °C (500 °F)	10 mm	Yes	36
XC7336-5PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes		36	CMOS					3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3			No		e0		30 s		225 °C (437 °F)		No
XCR5032C-10PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	32	CMOS				5	5 V	Chip Carrier	QFP44,.5SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	59 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XC7236-30PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	48 ns	Yes	5.5 V	36	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks	e0	25 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	30
XA9572XL-15VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15.5 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm		34
XC9536XV-7VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	36	CMOS				2.5	1.8/3.3,2.5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.37 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	125 MHz	30 s		260 °C (500 °F)	10 mm	Yes	34
XCR3032C-10PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.63 V	32	CMOS				3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	58.8 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XCR5064-10VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	64	CMOS				5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	77 MHz	30 s		240 °C (464 °F)	10 mm	No	32
XC2C64-5PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS				1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e0		30 s		225 °C (437 °F)	16.5862 mm	Yes	33
XC9536XV-3VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V						2.5		Flatpack, Thin Profile				Registered	2.4 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3					10 mm		34
XC9536XV-4VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V						2.5		Flatpack, Thin Profile				Registered	2.4 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3					10 mm		34
XC9536XV-3PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	3.5 ns	Yes	2.62 V						2.5		Chip Carrier				Macrocell	2.37 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e3		30 s		245 °C (473 °F)	16.5862 mm		34
XC2C64-5PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	1.9 V		CMOS				1.8		Chip Carrier				Macrocell	1.7 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 33 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e3		30 s		245 °C (473 °F)	16.5862 mm		33
XC7354-10WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	22 ns	Yes	5.25 V	54	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 25 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops	e0	76.9 MHz				16.51 mm	No	25
XC7336-15PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XCR3032-12VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			47 MHz				10 mm		32
XC9536F-15PC44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	56 MHz				16.5862 mm		34
XA9572XL-10VQG44Q	Xilinx	Flash PLD	Automotive	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	AEC-Q100			3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	125 °C (257 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm	Yes	34
XCR3032A-6VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	118 MHz	30 s		240 °C (464 °F)	10 mm		32
XC9536F-15PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	56 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9536F-7VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	83 MHz	30 s		240 °C (464 °F)	10 mm	Yes	34
XCR5032-7VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V		CMOS				5		Flatpack, Thin Profile				Macrocell	4.5 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			91 MHz				10 mm		32
XCR3064A-12PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	64	CMOS				3	3/3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.