Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
64 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQCC-J44 |
No |
e0 |
Yes |
|||||||||||||||||||||||
Infineon Technologies |
EE PLD |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
64 |
CMOS |
3.3/5,5 V |
Flatpack |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
.8 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
No |
e0 |
Yes |
||||||||||||||||||||||||
Infineon Technologies |
EE PLD |
Military |
J Bend |
44 |
QCCJ |
Square |
Ceramic |
12 ns |
Yes |
64 |
CMOS |
38535Q/M;38534H;883B |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
1.27 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-XQCC-J44 |
No |
e0 |
Yes |
|||||||||||||||||||||||
Infineon Technologies |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
64 |
CMOS |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQCC-J44 |
No |
e0 |
Yes |
||||||||||||||||||||||||
Infineon Technologies |
EE PLD |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
64 |
CMOS |
3.3 |
3.3 V |
Flatpack |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
.8 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQFP-G44 |
No |
e0 |
Yes |
|||||||||||||||||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
24 |
PLA-TYPE |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Macrocell |
4.5 V |
124 |
.8 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
12 mm |
No |
e3 |
66.6 MHz |
40 s |
24 |
260 °C (500 °F) |
12 mm |
24 |
||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
24 |
PLA-TYPE |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Macrocell |
4.75 V |
124 |
.8 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
12 mm |
No |
66.6 MHz |
24 |
245 °C (473 °F) |
12 mm |
24 |
|||||||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
24 |
PLA-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
124 |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.369 mm |
16.586 mm |
No |
e3 |
66.6 MHz |
24 |
260 °C (500 °F) |
16.586 mm |
24 |
|||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
24 |
PLA-TYPE |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Macrocell |
4.5 V |
124 |
.8 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
12 mm |
No |
66.6 MHz |
24 |
245 °C (473 °F) |
12 mm |
24 |
|||||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
24 |
PLA-TYPE |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Macrocell |
4.75 V |
124 |
.8 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
12 mm |
No |
e3 |
66.6 MHz |
40 s |
24 |
260 °C (500 °F) |
12 mm |
24 |
||||||||
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
24 |
PLA-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
124 |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.369 mm |
16.586 mm |
No |
66.6 MHz |
24 |
245 °C (473 °F) |
16.586 mm |
24 |
|||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
24 |
PLA-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
124 |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.369 mm |
16.586 mm |
No |
e0 |
66.6 MHz |
24 |
16.586 mm |
24 |
||||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
24 |
PLA-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
124 |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.369 mm |
16.586 mm |
No |
e3 |
66.6 MHz |
24 |
260 °C (500 °F) |
16.586 mm |
24 |
|||||||||
Xilinx |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
5.5 V |
36 |
CMOS |
5 |
3/5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 30 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-CQCC-J44 |
1 |
4.826 mm |
16.51 mm |
No |
PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
60 MHz |
16.51 mm |
No |
30 |
|||||||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 33 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Real Digital Design Technology |
e0 |
333 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
33 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
3 ns |
Yes |
1.9 V |
CMOS |
1.8 |
Chip Carrier |
Macrocell |
1.7 V |
1.27 mm |
70 °C (158 °F) |
33 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
500 MHz |
16.5862 mm |
33 |
||||||||||||||||||
Xilinx |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
32 ns |
Yes |
5.5 V |
54 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 25 I/O |
8 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops |
e0 |
55.6 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
25 |
|||||||||
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.62 V |
36 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
222.2 MHz |
30 s |
240 °C (464 °F) |
10 mm |
Yes |
34 |
||||||||||
|
Xilinx |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3/3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e4 |
95 MHz |
10 mm |
Yes |
36 |
|||||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
72 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
72 Macrocells |
e0 |
178.6 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
34 |
|||||||||
Xilinx |
Flash PLD |
Automotive |
Gull Wing |
44 |
QFP |
Square |
Plastic |
10 ns |
Yes |
72 |
CMOS |
2.5/3.3,3.3 V |
Flatpack |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
.8 mm |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
No |
e0 |
30 s |
240 °C (464 °F) |
Yes |
|||||||||||||||||||||
|
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
100 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
34 |
|||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
36 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V |
e0 |
178.6 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
34 |
|||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
36 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e0 |
125 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
34 |
||||||||||
Xilinx |
OT PLD |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP44,.5SQ,20 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
2.35 mm |
10 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
e0 |
125 MHz |
30 s |
225 °C (437 °F) |
10 mm |
No |
32 |
|||||||||
Xilinx |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
e0 |
100 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
32 |
|||||||||
Xilinx |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.63 V |
32 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.97 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e0 |
57 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
32 |
||||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic |
10 ns |
Yes |
72 |
CMOS |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
No |
e0 |
30 s |
225 °C (437 °F) |
Yes |
|||||||||||||||||||||
Xilinx |
UV PLD |
Commercial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
19 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-CQCC-J44 |
1 |
4.826 mm |
16.51 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
80 MHz |
16.51 mm |
No |
32 |
|||||||||||||
Xilinx |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e0 |
118 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
32 |
||||||||||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15.5 ns |
Yes |
3.6 V |
CMOS |
AEC-Q100; TS 16949 |
3.3 |
Flatpack, Thin Profile |
Macrocell |
3 V |
.8 mm |
105 °C (221 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
30 s |
260 °C (500 °F) |
10 mm |
34 |
|||||||||||||||
Xilinx |
Flash PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
2.6 V |
2.5 |
Chip Carrier |
Registered |
2.4 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e0 |
16.5862 mm |
34 |
||||||||||||||||||||
Xilinx |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
22 ns |
Yes |
5.25 V |
54 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 25 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops |
e0 |
76.9 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
25 |
|||||||||
Xilinx |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Chip Carrier |
Macrocell |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks |
16.5862 mm |
32 |
||||||||||||||||||||||||
Xilinx |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e0 |
105 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
32 |
||||||||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.62 V |
72 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
222 MHz |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
34 |
|||||||||
Xilinx |
UV PLD |
Commercial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-CQCC-J44 |
1 |
4.826 mm |
16.51 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
100 MHz |
16.51 mm |
No |
32 |
|||||||||||||
Xilinx |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
22 ns |
Yes |
5.5 V |
54 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 25 I/O |
8 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J44 |
1 |
4.826 mm |
16.51 mm |
No |
54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops |
e0 |
76.9 MHz |
16.51 mm |
No |
25 |
|||||||||||
Xilinx |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
23 ns |
Yes |
5.5 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
e0 |
66.7 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
32 |
|||||||||
Xilinx |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
111 MHz |
30 s |
240 °C (464 °F) |
10 mm |
Yes |
32 |
||||||||||
Xilinx |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
16.5 ns |
Yes |
5.25 V |
54 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 25 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops |
e0 |
95.2 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
25 |
|||||||||
Xilinx |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
8.5 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
e0 |
167 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
32 |
|||||||||
Xilinx |
UV PLD |
Commercial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-CQCC-J44 |
1 |
4.826 mm |
16.51 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
100 MHz |
16.51 mm |
No |
32 |
|||||||||||||
|
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 33 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Real Digital Design Technology |
e3 |
333 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
33 |
||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e0 |
100 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
34 |
||||||||||
|
Xilinx |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
119 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
36 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
1.9 V |
32 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.8 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 33 I/O |
1 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
Real Digital Design Technology |
e3 |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
33 |
|||||||||
Xilinx |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 33 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
47 MHz |
16.5862 mm |
33 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.