Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
119 MHz |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
36 |
|||||||||
|
Xilinx |
Flash PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
72 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
72 Macrocells |
e3 |
125 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
34 |
||||||||
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
100 MHz |
30 s |
240 °C (464 °F) |
10 mm |
Yes |
34 |
||||||||||
Xilinx |
OT PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
e0 |
100 MHz |
30 s |
240 °C (464 °F) |
10 mm |
No |
32 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 33 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
Real Digital Design Technology |
e3 |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
33 |
|||||||||
Xilinx |
Flash PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
1.9 V |
32 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
1.27 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 33 I/O |
1 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
Fast Zero Power Design Technology |
e0 |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
33 |
||||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
3 ns |
Yes |
1.9 V |
CMOS |
1.8 |
Chip Carrier |
Macrocell |
1.7 V |
1.27 mm |
70 °C (158 °F) |
33 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
e0 |
500 MHz |
16.5862 mm |
33 |
||||||||||||||||||||
|
Xilinx |
Flash PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
2.6 V |
2.5 |
Chip Carrier |
Registered |
2.4 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e3 |
16.5862 mm |
34 |
|||||||||||||||||||
|
Xilinx |
Flash PLD |
Automotive |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
36 |
CMOS |
AEC-Q100 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
34 |
|||||||||
Xilinx |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
QFP44,.5SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e0 |
80 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
32 |
||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 33 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
Real Digital Design Technology |
e3 |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
33 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
55.6 MHz |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
34 |
|||||||||
|
Xilinx |
EE PLD |
Automotive |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
3 V |
.8 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
95 MHz |
30 s |
260 °C (500 °F) |
10 mm |
36 |
|||||||||||||||
Xilinx |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.5 V |
54 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 25 I/O |
8 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops |
e0 |
66.7 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
25 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
4 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
36 Macrocells |
e3 |
200 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
34 |
||||||||||||||
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
3 ns |
Yes |
1.9 V |
CMOS |
1.8 |
Flatpack, Thin Profile |
Macrocell |
1.7 V |
.8 mm |
70 °C (158 °F) |
33 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
e0 |
500 MHz |
10 mm |
33 |
||||||||||||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
2.62 V |
72 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
125 MHz |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
34 |
|||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
4 ns |
Yes |
1.9 V |
32 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
1.27 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 33 I/O |
1 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Real Digital Design Technology |
e0 |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
33 |
||||||||||
Xilinx |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.63 V |
32 |
CMOS |
3.3 |
3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.97 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
47 MHz |
30 s |
240 °C (464 °F) |
10 mm |
Yes |
32 |
||||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
30 s |
260 °C (500 °F) |
10 mm |
34 |
||||||||||||||||
Xilinx |
Flash PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e0 |
67 MHz |
16.5862 mm |
34 |
||||||||||||||||||
|
Xilinx |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
145 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
36 |
|||||||||
Xilinx |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 33 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
47 MHz |
16.5862 mm |
33 |
|||||||||||||||||||||
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
4 ns |
Yes |
2.62 V |
72 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
250 MHz |
30 s |
240 °C (464 °F) |
10 mm |
Yes |
34 |
||||||||||
|
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
56 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
34 |
|||||||||||||||
Xilinx |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
2.97 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e0 |
58 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
32 |
||||||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e4 |
119 MHz |
10 mm |
Yes |
36 |
|||||||||||
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
56 MHz |
30 s |
240 °C (464 °F) |
10 mm |
Yes |
34 |
||||||||||
Xilinx |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3/3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e0 |
95 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
36 |
||||||||||
Xilinx |
OT PLD |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
19 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP44,.5SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
2.35 mm |
10 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
e0 |
80 MHz |
30 s |
225 °C (437 °F) |
10 mm |
No |
32 |
|||||||||
Xilinx |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
23 ns |
Yes |
5.5 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-CQCC-J44 |
1 |
4.826 mm |
16.51 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
66.7 MHz |
16.51 mm |
No |
32 |
|||||||||||||
Xilinx |
OT PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
18 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
16 Dedicated Inputs, 17 I/O |
16 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
18 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 18 Flip Flops |
e0 |
125 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
17 |
|||||||||
Xilinx |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
40 ns |
Yes |
5.5 V |
36 |
CMOS |
5 |
3/5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 30 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-CQCC-J44 |
1 |
4.826 mm |
16.51 mm |
No |
PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
33 MHz |
16.51 mm |
No |
30 |
|||||||||||||
Xilinx |
UV PLD |
Commercial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
23 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-CQCC-J44 |
1 |
4.826 mm |
16.51 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
66.7 MHz |
16.51 mm |
No |
32 |
|||||||||||||
Xilinx |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
80 MHz |
30 s |
240 °C (464 °F) |
10 mm |
Yes |
32 |
||||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
4 ns |
Yes |
2.62 V |
72 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e0 |
250 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
34 |
||||||||||
Xilinx |
OT PLD |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
18 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP44,.5SQ,20 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
16 Dedicated Inputs, 17 I/O |
16 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
2.35 mm |
10 mm |
No |
18 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 18 Flip Flops |
e0 |
125 MHz |
30 s |
225 °C (437 °F) |
10 mm |
No |
17 |
|||||||||
Xilinx |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops |
e0 |
100 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
32 |
|||||||||
Xilinx |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
5.5 V |
36 |
CMOS |
5 |
3/5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 30 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-CQCC-J44 |
1 |
4.826 mm |
16.51 mm |
No |
PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
60 MHz |
16.51 mm |
No |
30 |
|||||||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 33 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Real Digital Design Technology |
e0 |
333 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
33 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
3 ns |
Yes |
1.9 V |
CMOS |
1.8 |
Chip Carrier |
Macrocell |
1.7 V |
1.27 mm |
70 °C (158 °F) |
33 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
500 MHz |
16.5862 mm |
33 |
||||||||||||||||||
Xilinx |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
32 ns |
Yes |
5.5 V |
54 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 25 I/O |
8 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops |
e0 |
55.6 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
25 |
|||||||||
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
2.62 V |
36 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.37 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
222.2 MHz |
30 s |
240 °C (464 °F) |
10 mm |
Yes |
34 |
||||||||||
|
Xilinx |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3/3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e4 |
95 MHz |
10 mm |
Yes |
36 |
|||||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
72 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
72 Macrocells |
e0 |
178.6 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
34 |
|||||||||
Xilinx |
Flash PLD |
Automotive |
Gull Wing |
44 |
QFP |
Square |
Plastic |
10 ns |
Yes |
72 |
CMOS |
2.5/3.3,3.3 V |
Flatpack |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
.8 mm |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
No |
e0 |
30 s |
240 °C (464 °F) |
Yes |
|||||||||||||||||||||
|
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
100 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
34 |
|||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
36 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V |
e0 |
178.6 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
Yes |
34 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.