BGA Programmable Logic Devices (PLD) 2,054

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K10AFC484-1

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

1.86 mm

23 mm

No

e1

23 mm

150

EP20K100EFC484-2

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

160 MHz

220 °C (428 °F)

23 mm

246

EPM2210F256I4N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

2.625 V

1700

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

0 Dedicated Inputs, 204 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

17 mm

Yes

204

EP20K100EFI324-2XN

Altera

Loadable PLD

Ball

324

BGA

Square

Plastic/Epoxy

2.02 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 246 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e1

245 °C (473 °F)

19 mm

246

EPM7128AEFI256-5

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

192.3 MHz

220 °C (428 °F)

17 mm

Yes

100

EP20K160EFC484-2N

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.93 ns

6400

Yes

1.89 V

CMOS

308

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 316 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

160 MHz

30 s

308

260 °C (500 °F)

23 mm

316

EP1M120F484C7

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

4800

Yes

1.89 V

CMOS

303

1.8

1.5/3.3,1.8 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 303 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

303

220 °C (428 °F)

23 mm

303

EPM1270GF256A5N

Altera

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

17 mm

Yes

212

EPF10K200SFI484-3X

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

369 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

369

EP20K160EFI672

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

1 mm

4 Dedicated Inputs, 324 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

324

EP20K200CF484I-7

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

1.6 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 376 I/O

4

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

368

220 °C (428 °F)

23 mm

376

EP20K300EFC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.29 ns

11520

Yes

1.89 V

CMOS

400

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 408 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

400

220 °C (428 °F)

27 mm

408

EP20K200EBC484-2

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

376

EPF10K50SFI672-1

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

8 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

254 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

254

220 °C (428 °F)

27 mm

254

EP20K200FI484-3

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

376

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 382 I/O

4

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

376

220 °C (428 °F)

23 mm

382

EP20K200EFC484-3

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

2.33 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

160 MHz

20 s

368

220 °C (428 °F)

23 mm

376

EP20K600CF672C8ES

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

508

EP1K100FI484

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 333 I/O

6

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

333

EPM7128ALBC256-6

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

128

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

No

e0

220 °C (428 °F)

Yes

EPM1270GM100I5N

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B100

No

e1

0

EPM7128BBI100-10

Altera

EE PLD

Ball

100

BGA

Square

Plastic/Epoxy

10 ns

Yes

128

CMOS

1.8/3.3,2.5 V

Grid Array

BGA100,10X10

Programmable Logic Devices

Yes

1.5 mm

Tin Lead

Bottom

S-PBGA-B100

No

e0

220 °C (428 °F)

Yes

EPM570M256C5N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

8.7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

Yes

160

EPM7128BFI256-7N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

4 ns

Yes

2.625 V

128

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3.5 mm

17 mm

No

e1

243.9 MHz

17 mm

Yes

100

EP20K300EFC672-3

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

3.06 ns

11520

Yes

1.89 V

CMOS

400

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 408 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

400

220 °C (428 °F)

27 mm

408

EPM570GF100I5ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 76 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

76

EP20K300EBC652-1X

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.68 ns

11520

Yes

1.89 V

CMOS

400

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 408 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

160 MHz

400

220 °C (428 °F)

45 mm

408

EP20K200FC484V

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

382

EPF10K100AFI484-3

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

17 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 369 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

369

EPM7256BFC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

2.625 V

256

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e1

188.7 MHz

17 mm

Yes

164

EPM3128AFC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 98 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

220 °C (428 °F)

17 mm

Yes

98

EPF10K10ABC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

150

EPM7128ALBI256-6

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

128

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

No

e0

220 °C (428 °F)

Yes

EPF10K100ABC484-2

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

3.6 V

CMOS

369

3.3

2.5/3.3,3.3 V

Grid Array

BGA484,22X22,50

Field Programmable Gate Arrays

Mixed

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 369 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

No

e0

369

220 °C (428 °F)

369

EPF10K200SFC484-1N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.3 ns

9984

Yes

2.625 V

CMOS

369

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

369 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

40 s

369

260 °C (500 °F)

23 mm

369

EPM2210GF324C3N

Altera

Flash PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 272 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

19 mm

Yes

272

EPM7128AFC256-6

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

144.9 MHz

220 °C (428 °F)

17 mm

Yes

100

EPM7128ABI100-10

Altera

EE PLD

Industrial

Ball

100

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

128 Macrocells

e1

125 MHz

84

EPF10K250ABI600-2

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

17 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K100ABC600-2

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

3.6 V

CMOS

406

3.3

2.5/3.3,3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 406 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

20 s

406

220 °C (428 °F)

45 mm

406

EPM240M100C3N

Altera

Flash PLD

Other

Ball

100

BGA

Square

Plastic/Epoxy

4.7 ns

Yes

2.625 V

192

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA100,11X11,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e1

Yes

80

EPM570GM100A5N

Altera

Flash PLD

Automotive

Ball

100

BGA

Square

Plastic/Epoxy

8.7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA100,11X11,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 76 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e1

Yes

76

EPM7128AFI256-6

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

144.9 MHz

220 °C (428 °F)

17 mm

Yes

100

EP20K1000EFC33-3

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.32 ns

38400

Yes

1.89 V

CMOS

700

1.8

1.8,1.8/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 708 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

20 s

700

220 °C (428 °F)

33 mm

708

EPF10K30EBC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

70 °C (158 °F)

4 Dedicated Inputs, 220 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

220

EP1K30FC484-1

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

8 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Registered

2.375 V

1 mm

70 °C (158 °F)

6 Dedicated Inputs, 171 I/O

6

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

90 MHz

23 mm

171

EP1K100FC484-1N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

4992

Yes

2.625 V

CMOS

333

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

333 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

90 MHz

30 s

333

260 °C (500 °F)

23 mm

333

EPM1270GF256I3N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

6.2 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 212 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

17 mm

Yes

212

EP20K200FI672-3

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 382 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

382

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.