BGA Programmable Logic Devices (PLD) 2,054

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K100BI560-5

Altera

Loadable PLD

Industrial

Ball

560

BGA

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

85 °C (185 °F)

4 Dedicated Inputs

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B560

No

4992 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

53.76 MHz

EPM7256AFC256-12

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

78.1 MHz

220 °C (428 °F)

17 mm

Yes

164

EPF10K50SFI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

8 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

254 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

254

220 °C (428 °F)

23 mm

254

EP20K400EBC672-1

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

No

e0

488

EP20K400EFC784-2

Altera

Loadable PLD

Other

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B784

3

No

e0

220 °C (428 °F)

EP1K50FI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12.5 ns

2880

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 186 I/O

6

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

186

220 °C (428 °F)

17 mm

186

EPF6016ABC256-2

Altera

Loadable PLD

Ball

256

BGA

Plastic/Epoxy

Yes

CMOS

204

3.3,3.3/5 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Tin Lead

Bottom

No

e0

204

220 °C (428 °F)

EPF10K50EFC484-2N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

70 °C (158 °F)

254 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

2880 Logic Elements

e1

140 MHz

40 s

260 °C (500 °F)

23 mm

254

EPM3256AFC256-10N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 161 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e1

17 mm

161

EP1K100FI484-3

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

16 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 333 I/O

6

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

333

EPM2210GF256A5

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

1700

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EPM2210GF324C5N

Altera

Flash PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 272 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

19 mm

Yes

272

EP20K400CB652C8N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.78 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

2 mm

45 mm

No

e1

45 mm

488

EPF10K10ABI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 150 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

150

EP20K1000EFC33-2X

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.13 ns

38400

Yes

1.89 V

CMOS

700

1.8

1.8,1.8/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 708 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

3.5 mm

33 mm

No

e0

20 s

700

220 °C (428 °F)

33 mm

708

EPF10K100ABI600-1

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

12.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 406 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

406

EPF10K100BM560-5

Altera

Loadable PLD

Military

Ball

560

BGA

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Tin Silver Copper

Bottom

S-PBGA-B560

No

4992 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

53.76 MHz

EP20K100EFC324-2

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

2.02 ns

4160

Yes

1.89 V

CMOS

238

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e0

160 MHz

20 s

238

220 °C (428 °F)

19 mm

246

EP20K60EFC324

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 204 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

2.1 mm

19 mm

No

e1

160 MHz

19 mm

204

EP20K100BC324-2

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

No

e1

252

EPF10K100EFC484-2

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

338

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

338

220 °C (428 °F)

23 mm

338

EP20K200CFI672-7

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

1.6 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

376 I/O

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

376

EPF10K50SFI672-2

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

9.5 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

254 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

254

220 °C (428 °F)

27 mm

254

EP20K200EFC484-1N

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.58 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

160 MHz

30 s

368

260 °C (500 °F)

23 mm

376

EPF10K50SFC256-1X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

191

220 °C (428 °F)

17 mm

191

EPM570M100C4ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 76 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

76

EPM7064AEFC256-4

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

222.2 MHz

220 °C (428 °F)

17 mm

Yes

68

EPM570M256A5N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

8.7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

5M1270ZF324A5N

Altera

Flash PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

980

CMOS

AEC-Q100

1.8,1.2/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

1 mm

105 °C (221 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

No

Yes

EP20K200BC484-2

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

382

EPF6016AFC256-3N

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 171 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

133 MHz

17 mm

171

EP2A40F1020C9N

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.05 ns

Yes

1.575 V

CMOS

1.5

Grid Array

Macrocell

1.425 V

1 mm

85 °C (185 °F)

735 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

40 s

245 °C (473 °F)

33 mm

735

EP1M120FC484-7

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 303 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

303

EPM1270GM256C3N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

6.2 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

212

EP20K30EFC672

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

160 MHz

27 mm

128

EPM1270M100C5N

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 0 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e1

0

EPF10K100EFC672-2X

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

12 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

338

EPM570F256A5

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

8.7 ns

Yes

440

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EP20K200EBC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

376

EPF10K100EFI484-3

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

16 ns

4992

Yes

2.7 V

CMOS

338

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

338 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

338

220 °C (428 °F)

23 mm

338

EP20K100BC324-3

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

No

e1

252

EP20K400CF672C7

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.48 ns

16640

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

480

220 °C (428 °F)

27 mm

488

EPF10K100BBC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

Grid Array

Mixed

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF8820ABI225-A-3

Altera

Loadable PLD

Industrial

Ball

225

BGA

Square

Plastic/Epoxy

1.8 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 152 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B225

2.3 mm

27 mm

No

Can also operate at 5 V supply

e1

27 mm

152

EP20K400FI672-2V

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

3.1 ns

16640

Yes

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

502 I/O

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

20 s

496

220 °C (428 °F)

27 mm

502

EPM2210GM100I5ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

0

EPF10K100EBI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EP20K200FC484-2XV

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

3 ns

8320

Yes

2.625 V

CMOS

376

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

376

220 °C (428 °F)

23 mm

382

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.