BGA Programmable Logic Devices (PLD) 2,054

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM7256ABI256-6

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e1

200 MHz

27 mm

164

EPF10K50EBI484-3

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 254 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

254

EPM2210M100C4N

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 0 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e1

0

EP20K100FC324-1XN

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

2.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3.5 mm

19 mm

No

e1

19 mm

252

EPF10K50SFC672-3X

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

12.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

70 °C (158 °F)

254 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

254

EP20K400CF672C8ES

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

488

EP20K200EFG672ES

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 376 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

376

EP20K200FC484-1

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

2.5 ns

8320

Yes

2.625 V

CMOS

376

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

376

220 °C (428 °F)

23 mm

382

EPM240ZM68I7N

Altera

Flash PLD

Ball

68

BGA

Rectangular

Plastic/Epoxy

12 ns

Yes

1.89 V

192

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA68,9X9,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

0 Dedicated Inputs

0

Tin Silver Copper

Bottom

R-PBGA-B68

No

It can also operate at 3.3 V

e1

Yes

EP20K100FI784-3

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EP1K30FI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

8 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 171 I/O

6

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

90 MHz

23 mm

171

EP20K200CFI672-9

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

376 I/O

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

376

EP1K30FC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

171 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

90 MHz

20 s

171

220 °C (428 °F)

17 mm

171

EP20K100BI484-1

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs, 252 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

252

EP20K600EBC652-1X

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.57 ns

24320

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

160 MHz

20 s

480

220 °C (428 °F)

45 mm

488

EP20K1000EBC652-1X

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.84 ns

38400

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

160 MHz

20 s

480

220 °C (428 °F)

45 mm

488

EPF6016AFC256-1

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

171

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 171 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

172 MHz

20 s

171

220 °C (428 °F)

17 mm

171

EPM7128BBI100-4

Altera

EE PLD

Ball

100

BGA

Square

Plastic/Epoxy

4 ns

Yes

128

CMOS

1.8/3.3,2.5 V

Grid Array

BGA100,10X10

Programmable Logic Devices

Yes

1.5 mm

Tin Lead

Bottom

S-PBGA-B100

No

e0

220 °C (428 °F)

Yes

EPF10K50SFC484-3N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

254 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

40 s

260 °C (500 °F)

23 mm

254

EPM7128BFI256

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 100 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

100

EPM2210F256A4N

Altera

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

2.625 V

1700

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 204 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

17 mm

Yes

204

EPF10K70BM560-5

Altera

Loadable PLD

Military

Ball

560

BGA

Square

Plastic/Epoxy

27 ns

Yes

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

125 °C (257 °F)

4 Dedicated Inputs

4

-55 °C (-67 °F)

Tin Silver Copper

Bottom

S-PBGA-B560

No

3744 Logic elements Configurable I/O operation with 3.3 V or 5 V

e1

53.76 MHz

EP20K300EFC672-3X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

3.06 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 408 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

160 MHz

220 °C (428 °F)

27 mm

408

EP20K200EBC484-3

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

376

EP20K60EFC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 204 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

160 MHz

220 °C (428 °F)

27 mm

204

EPM7256ABC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

256 Macrocells

e1

125 MHz

27 mm

164

EPM7128ALBC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

128

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

No

e0

220 °C (428 °F)

Yes

EP20K400BC652-1N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 502 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

45 mm

502

EP20K400BC652-1VX

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 502 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

100 MHz

45 mm

502

EPF10K130EBC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

70 °C (158 °F)

4 Dedicated Inputs, 369 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

369

EPM2210F256I4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1700

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EP20K400FC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

3.1 ns

16640

Yes

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

502 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

20 s

496

220 °C (428 °F)

27 mm

502

EPM2210GF100I5N

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B100

No

e1

0

EPF10K130VBI600-4

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

24.2 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 470 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

470

EPF10K200SBC600-2

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.625 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

3

1.93 mm

45 mm

No

e0

20 s

470

220 °C (428 °F)

45 mm

470

EPM7256BFC256-5

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

2.625 V

256

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

188.7 MHz

20 s

220 °C (428 °F)

17 mm

Yes

164

EPF10K130EBC600-2N

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1.27 mm

70 °C (158 °F)

424 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e1

45 mm

424

EPM570ZM256I6N

Altera

Flash PLD

Ball

256

BGA

Rectangular

Plastic/Epoxy

9.5 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

0 Dedicated Inputs, 160 I/O

0

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPM1270M100C3N

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 0 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e1

0

EP20K200EFC672-2X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

368

220 °C (428 °F)

27 mm

376

EP20K200CF672I-7

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

1.6 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 376 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

376

EPM570GM256C5N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

8.7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

Yes

160

EPF10K130EFC672-2N

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

413 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

413

EPF10K130EBI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

85 °C (185 °F)

4 Dedicated Inputs, 369 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

369

EP20K1000EBC652-2N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.13 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

160 MHz

40 s

245 °C (473 °F)

45 mm

488

EP20K100EBC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

246

EPF10K130EFI672-3X

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

413 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

413

EP20K200EFC484-2

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

160 MHz

20 s

368

220 °C (428 °F)

23 mm

376

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.