BGA Programmable Logic Devices (PLD) 2,054

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP20K100EFI484-3

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

4 Dedicated Inputs, 246 I/O

4

Tin Lead

Bottom

S-PBGA-B484

3

No

e0

220 °C (428 °F)

246

EPM240GM100I3ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 80 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

80

EPM570GF256A3N

Altera

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

17 mm

Yes

160

EPM7512AEFC256-12

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

71.9 MHz

20 s

220 °C (428 °F)

17 mm

Yes

212

EP20K1500EBC652-1

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.84 ns

51840

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

5A

3.5 mm

45 mm

No

e0

160 MHz

20 s

480

220 °C (428 °F)

45 mm

488

EPM570GF256I4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

440

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPF10K200SFC672-2

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.6 ns

9984

Yes

2.625 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

470

220 °C (428 °F)

27 mm

470

EPF10K200SFC484-1

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.3 ns

9984

Yes

2.625 V

CMOS

369

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

369 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

369

220 °C (428 °F)

23 mm

369

EP1K30FI256-2N

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

85 °C (185 °F)

171 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

37.5 MHz

30 s

171

260 °C (500 °F)

17 mm

171

EP2A40F672C7N

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.55 ns

Yes

1.575 V

CMOS

1.5

Grid Array

Macrocell

1.425 V

1 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

40 s

245 °C (473 °F)

27 mm

492

EPF10K30EFC256-3X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

176 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

176

EPF10K50SFC256-2X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EP20K200CFC484-9

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

376 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

376

EP1M350F780C7N

Altera

Loadable PLD

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Mixed

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 486 I/O

0

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B780

3.5 mm

29 mm

No

e1

40 s

245 °C (473 °F)

29 mm

486

EPM570M256I4N

Altera

Flash PLD

Ball

256

BGA

Rectangular

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

0 Dedicated Inputs, 160 I/O

0

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPF10K200EBI600-1

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

10 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPM2210GM100I3ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

0

EPF10K30AFC484-1N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

1728 Logic Elements; 216 Labs

e1

80 MHz

40 s

260 °C (500 °F)

23 mm

246

EP20K600CF33C7ES

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

1.6 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

85 °C (185 °F)

4 Dedicated Inputs, 708 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1020

No

e1

708

EPM1270GM100I3ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

0

EP2A25F672C7N

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.69 ns

Yes

1.575 V

CMOS

1.5

Grid Array

Macrocell

1.425 V

1 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

40 s

245 °C (473 °F)

27 mm

492

EPM2210GF324I4

Altera

Flash PLD

Ball

324

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1700

CMOS

1.5/3.3,1.8 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B324

3

No

e0

220 °C (428 °F)

Yes

EP20K1000CB652C7

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.49 ns

38400

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

3.5 mm

45 mm

No

e0

480

220 °C (428 °F)

45 mm

488

EPF10K100EFI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EP20K100FI400-3

Altera

Loadable PLD

Ball

400

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B400

3

No

e1

220 °C (428 °F)

EPM2210GM100C4N

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B100

No

e1

0

EPM2210F100C4N

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 0 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e1

0

EP20K200EBC672-3

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

376

EP2A15F672C7

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.69 ns

16640

Yes

1.575 V

CMOS

480

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

480

220 °C (428 °F)

27 mm

492

EPM570GF256C4

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

160

EPM570GM100C5ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 76 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

76

EP20K1000EFC784

Altera

Loadable PLD

Other

Ball

784

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EPM7128AFI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

116.3 MHz

220 °C (428 °F)

17 mm

Yes

100

EP20K200FC672V

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

382

EP20K200FC484-1X

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

2.5 ns

8320

Yes

2.625 V

CMOS

376

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

20 s

376

220 °C (428 °F)

23 mm

382

EPF6024ABC256-2

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

218

3.3

2.5/3.3,3.3 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Macrocell

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 218 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

Can Also Be Used 24000 Logic Gates

e0

153 MHz

20 s

218

220 °C (428 °F)

27 mm

218

EPM2210GF256I3N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 204 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

17 mm

Yes

204

EP20K200BC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

382

EPF8820BI225-2

Altera

Loadable PLD

Industrial

Ball

225

BGA

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Grid Array

Registered

4.5 V

1.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 148 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B225

2.3 mm

27 mm

No

820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e1

27 mm

148

EPM3512AFI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 208 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

208

EP20K200FC484-1XV

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

2.5 ns

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

220 °C (428 °F)

23 mm

382

EP20K1000CB652C7N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

1.49 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

40 s

245 °C (473 °F)

45 mm

488

EPF6024ABI256-3

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

218

3.3

2.5/3.3,3.3 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Macrocell

3 V

1.27 mm

4 Dedicated Inputs, 218 I/O

4

Tin Lead

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

Also Configurable with 5 V VCC

e0

133 MHz

218

220 °C (428 °F)

27 mm

218

EP20K1000EFI672-2X

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

2.13 ns

38400

Yes

1.89 V

CMOS

500

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

4 Dedicated Inputs, 508 I/O

4

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

20 s

500

220 °C (428 °F)

27 mm

508

EPF10K50EFC256-2N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

2880

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

2880 Logic Elements

e1

140 MHz

191

17 mm

191

EPM7128ABI256-12

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

128 Macrocells

e1

100 MHz

27 mm

100

EPM7128BFI100-4N

Altera

EE PLD

Industrial

Ball

100

BGA

Square

Plastic/Epoxy

4 ns

Yes

128

CMOS

1.8/3.3,2.5 V

Grid Array

BGA100,10X10,40

Programmable Logic Devices

Yes

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

No

e1

Yes

EP20K60EFC324-3

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

3.56 ns

2560

Yes

1.89 V

CMOS

188

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e0

160 MHz

20 s

188

220 °C (428 °F)

19 mm

196

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.