BGA Programmable Logic Devices (PLD) 2,054

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K200SBI600-1

Altera

Loadable PLD

Industrial

Ball

600

BGA

Square

Plastic/Epoxy

9 ns

9984

Yes

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

470 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPM2210GF324I4N

Altera

Flash PLD

Ball

324

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 272 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

19 mm

Yes

272

EPF10K30EFI484-1

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

8 ns

1728

Yes

2.7 V

CMOS

220

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

220 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

220

220 °C (428 °F)

23 mm

220

EP20K600EFC33-2N

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.25 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 588 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

40 s

245 °C (473 °F)

33 mm

588

EPF6024AFC256-1N

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 219 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

172 MHz

17 mm

219

EPM2210GF100I5ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

0

EPF10K100EFC484-2XN

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

338 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

40 s

260 °C (500 °F)

23 mm

338

EPM1270F256I4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

980

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPF10K10AFC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.8 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

1.86 mm

23 mm

No

e1

23 mm

150

EPF10K50EBC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EP20K100FC672-1

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e1

220 °C (428 °F)

27 mm

252

EP20K600CF672C7N

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.48 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

e1

40 s

245 °C (473 °F)

27 mm

508

EPF10K100EBC672-1

Altera

Loadable PLD

Commercial

Ball

672

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

70 °C (158 °F)

4 Dedicated Inputs, 338 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

338

EP20K1500EBC652-3N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.32 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

160 MHz

45 mm

488

EPM240M100C4ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

0 Dedicated Inputs, 80 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

It can also operate at 3.3 V

e0

80

EPM7384AEFC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

384

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EP1M120FI484-6

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 303 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B484

2.1 mm

23 mm

No

e1

23 mm

303

EPF10K30EFC256-3N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

1728

Yes

2.625 V

CMOS

176

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

176 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

176

17 mm

176

EPF10K30EFI256-1X

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

8 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

176 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

176

EP20K200EFC484-2X

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.97 ns

8320

Yes

1.89 V

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

160 MHz

20 s

368

220 °C (428 °F)

23 mm

376

EP20K400BC652-3N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

3.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 502 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

45 mm

502

EPM1270GF256A4N

Altera

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

17 mm

Yes

212

EP20K200FC484-1V

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

0.3 ns

8320

Yes

2.625 V

CMOS

376

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

100 MHz

376

220 °C (428 °F)

23 mm

382

EP20K400BI672-2

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs, 502 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

502

EP20K200EFI484-2

Altera

Loadable PLD

Ball

484

BGA

Square

Plastic/Epoxy

8320

Yes

CMOS

368

1.8

1.8,1.8/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

1 mm

4 Dedicated Inputs, 376 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B484

3

No

e1

368

220 °C (428 °F)

376

EPM2210GF100C5ES

Altera

Flash PLD

Ball

100

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

0 Dedicated Inputs, 0 I/O

0

Tin Lead

Bottom

S-PBGA-B100

No

e0

0

EP20K100EFI196-3

Altera

Loadable PLD

Ball

196

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

4 Dedicated Inputs, 143 I/O

4

Tin Lead

Bottom

S-PBGA-B196

3

No

e0

220 °C (428 °F)

143

EP20K200BI672-1

Altera

Loadable PLD

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

4 Dedicated Inputs, 382 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

382

EP20K100FI196-1

Altera

Loadable PLD

Ball

196

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B196

3

2.1 mm

15 mm

No

e1

220 °C (428 °F)

15 mm

EPM7128ALBI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

128

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

No

e0

220 °C (428 °F)

Yes

EPF10K30AFC484-3

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.9 ns

1728

Yes

3.6 V

CMOS

246

3.3

2.5/3.3,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

1728 Logic Elements; 216 Labs

e0

80 MHz

20 s

246

220 °C (428 °F)

23 mm

246

EPF10K30ABC484-1

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

1.3 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

70 °C (158 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

246

EPF10K30EFC256-1N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

176 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

17 mm

176

EPF10K50SFI672-1X

Altera

Loadable PLD

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

8 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

254 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

27 mm

254

EPF10K50EFI484-2

Altera

Loadable PLD

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

10 ns

2880

Yes

2.7 V

CMOS

254

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

254 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

254

220 °C (428 °F)

23 mm

254

EP1M120F484C6N

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Mixed

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 303 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

245 °C (473 °F)

23 mm

303

EP20K200BC672-3

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

382

EPF10K30ABC484-2

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

1.5 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

70 °C (158 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

246

EPM570GF256A4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

440

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EP20K600CB652C9

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2 ns

24320

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA652,35X35,50

Field Programmable Gate Arrays

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B652

3

2 mm

45 mm

No

e0

480

220 °C (428 °F)

45 mm

488

EP20K160EFI784

Altera

Loadable PLD

Ball

784

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

4 Dedicated Inputs

4

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EPM7512AEBC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

163.9 MHz

20 s

220 °C (428 °F)

27 mm

Yes

212

EP20K1000CF672C9

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.02 ns

38400

Yes

1.89 V

CMOS

500

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

500

220 °C (428 °F)

27 mm

508

EP20K1000EFC33-2N

Altera

Loadable PLD

Other

Ball

1020

BGA

Square

Plastic/Epoxy

2.13 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 708 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

40 s

245 °C (473 °F)

33 mm

708

EPF10K30EFC484-1N

Altera

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

220 I/O

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

40 s

260 °C (500 °F)

23 mm

220

EP1M120F484C8AN

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Mixed

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 303 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

245 °C (473 °F)

23 mm

303

EP1K30FI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12.5 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 171 I/O

6

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

171

220 °C (428 °F)

17 mm

171

EPF10K100EFI256-3X

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

16 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.