DIP Programmable Logic Devices (PLD) 1,674

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PALCE22V10H-7PC/5

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

132

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Dual

R-PDIP-T24

5.08 mm

7.62 mm

No

10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms

e0

100 MHz

10

30.734 mm

10

PLDC20G10B-15PC

Cypress Semiconductor

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

90

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 11 I/O

10

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.826 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e0

45.4 MHz

10

31.75 mm

11

5962-8867005LX

Defense Logistics Agency

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

Yes

50 MHz

10

5962-8984102LA

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

31.2 MHz

10

AT22V10-15PI

Atmel

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

5.08 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

e0

50 MHz

10

32 mm

10

ATF16V8B-15GM

Atmel

Flash PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

e0

45 MHz

8

24.35 mm

8

ATF22V10B-15PC

Atmel

Flash PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

132

2.54 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

5.06 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Register Preload; Power-Up Reset; Shared Input/Clock

e0

55.5 MHz

10

32 mm

10

ATF750C-15PC

Atmel

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

10

CMOS

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

No

Macrocell

4.75 V

2.54 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

1

5.334 mm

7.62 mm

No

e0

55 MHz

31.877 mm

No

10

ATV750-20GM/883

Atmel

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

10

CMOS

MIL-STD-883

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

No

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 10 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

10 Macrocells; Variable Product Terms

e0

55 MHz

32 mm

No

10

EP22V10PC-7

Altera

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

9 ns

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

132

2.54 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.32 mm

7.62 mm

No

Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock

e0

109.8 MHz

10

220 °C (428 °F)

31.68 mm

10

EP320IPC-35

Altera

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

72

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

No

e0

25 MHz

8

220 °C (428 °F)

EP330PC-15

Rochester Electronics

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

16 ns

No

5.25 V

CMOS

5

In-Line

Macrocell

4.75 V

2.54 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

4.318 mm

7.62 mm

8 Macrocells; 1 External Clock; Shared Input/Clock

e0

83.3 MHz

26.162 mm

8

GAL16V8B-10LPI

Lattice Semiconductor

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

4.57 mm

7.62 mm

No

Register Preload; Power-Up Reset

e0

58.8 MHz

8

26.125 mm

8

GAL16V8D-10LP

Lattice Semiconductor

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

5.334 mm

7.62 mm

No

Programmable Output Polarity

e0

66.7 MHz

8

26.162 mm

8

GAL16V8D-15LD/883

Lattice Semiconductor

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-STD-883

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

5.08 mm

7.62 mm

No

e0

41.6 MHz

8

25.27 mm

8

GAL16V8Z-15QP

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

75 °C (167 °F)

7 Dedicated Inputs, 8 I/O

7

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

4.57 mm

7.62 mm

No

Register Preload; Power-Up Reset

e0

40 MHz

8

26.125 mm

8

GAL20RA10B-15LP

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

80

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 10 I/O

10

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Dual

R-PDIP-T24

5.334 mm

7.62 mm

No

Register Preload; Power-Up Reset

e0

45 MHz

30 s

10

225 °C (437 °F)

31.75 mm

10

GAL20RA10B-20LP

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

20 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

80

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 10 I/O

10

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Dual

R-PDIP-T24

5.334 mm

7.62 mm

No

Register Preload; Power-Up Reset

e0

33.3 MHz

10

31.75 mm

10

GAL20V8A-15LP

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.57 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Register Preload; Shared Input/Clock

e0

45.5 MHz

8

31.855 mm

8

GAL20V8B-15LD/883

Lattice Semiconductor

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-STD-883

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 8 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

1

5.08 mm

7.62 mm

No

1 External Clock; Register Preload

41.6 MHz

8

31.875 mm

8

GAL20V8B-15QPN

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T24

5.334 mm

7.62 mm

No

e3

45.5 MHz

8

260 °C (500 °F)

31.75 mm

8

GAL22V10-25LP

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

132

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Dual

R-PDIP-T24

4.57 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Register Preload; Shared Input/Clock

e0

33.3 MHz

10

31.855 mm

10

GAL22V10-25LPI

Lattice Semiconductor

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

132

2.54 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

4.57 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Register Preload; Shared Input/Clock

e0

33.3 MHz

10

31.855 mm

10

GAL22V10B-25LP

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

132

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.953 mm

7.62 mm

No

Register Preload; Power-Up Reset

e0

33.3 MHz

10

31.877 mm

10

GAL22V10D-10LD/883

Lattice Semiconductor

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

1

5.08 mm

7.62 mm

No

e0

76.9 MHz

10

31.75 mm

10

P5C032-35

Intel

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

72

2.54 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

PAL with Macrocells; 8 Macrocells; 1 External Clock; Shared Input/Clock

e0

22.2 MHz

8

25.55 mm

8

PALC16L8-30DMB

Cypress Semiconductor

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

8

24.13 mm

6

PALCE16V8-10DMB

Cypress Semiconductor

Flash PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

CMOS

38535Q/M;38534H;883B

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset

e0

58 MHz

8

24.13 mm

8

PALCE16V8-15PC

Cypress Semiconductor

Flash PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

4.826 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset

e0

45.5 MHz

8

25.527 mm

8

PALCE20V8-15PC

Cypress Semiconductor

Flash PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.826 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

e0

45.5 MHz

8

31.75 mm

8

PALCE22V10-5PC

Cypress Semiconductor

Flash PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5 ns

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

132

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.826 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

e0

143 MHz

10

30.099 mm

10

PALCE22V10Q-10PC/5

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

132

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Dual

R-PDIP-T24

5.08 mm

7.62 mm

No

10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms

e0

83.3 MHz

10

30.734 mm

10

ATF22V10B-10GM/883

Microchip Technology

Flash PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

CMOS

MIL-STD-883

22

PAL-TYPE

5

Tube

In-Line

DIP24,.3

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

90 MHz

10

32 mm

No

10

ATF750C-10PU

Microchip Technology

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.5 V

10

CMOS

5

Tube

5 V

In-Line

DIP24,.3

Programmable Logic Devices

No

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T24

5.334 mm

7.62 mm

No

e3

83 MHz

31.877 mm

No

10

PAL16L8A-2MJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

TTL

16

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

16 MHz

8

24.195 mm

No

6

PAL16R8AMJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

8

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.195 mm

No

0

TIBPAL16L8-15MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

TTL

MIL-PRF-38535

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

50 MHz

8

24.195 mm

6

5962-01-406-5958

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

30 MHz

8

SN74LS334NP1

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

6

JM38510/50503BLA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

TTL

MIL-M-38510 Class B

5

In-Line

Mixed

4.75 V

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

28.5 MHz

32.005 mm

2

TICPAL22V10CJL

Texas Instruments

UV PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24(UNSPEC)

Programmable Logic Devices

Macrocell

4.75 V

132

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-GDIP-T24

No

Shared Input/Clock

10

10

TIBPAL16R8-5CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

7 ns

No

5.25 V

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset; Register Preload

111 MHz

8

24.195 mm

0

EP610PC-35

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

37 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

160

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 16 I/O

4

0 °C (32 °F)

Dual

R-PDIP-T24

No

Zero Standby Function; 16 Macrocells With Configurable I/O

28.6 MHz

16

16

82S105ACN

Texas Instruments

OT PLD

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

TTL

16

PLS-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

48

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T28

No

12.5 MHz

8

TIBPAL22V10-20MNT

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

20 ns

No

TTL

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

132

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

37 MHz

10

TIBPAL20R6-15CNT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

18 ns

No

5.25 V

TTL

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T24

5.08 mm

7.62 mm

No

Register Preload; Power-Up Reset

e4

37 MHz

8

31.64 mm

2

TICHAL16R8-35CN

Texas Instruments

Mask PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

5.5 V

CMOS

5

In-Line

Registered

4.5 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

1 External Clock

18 MHz

24.325 mm

0

8103610RX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-STD-883 Class B

5

In-Line

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

Yes

25 MHz

4

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.