Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms |
e0 |
100 MHz |
10 |
30.734 mm |
10 |
|||||||||||
Cypress Semiconductor |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
90 |
2.54 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 11 I/O |
10 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.826 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
45.4 MHz |
10 |
31.75 mm |
11 |
|||||||||||
Defense Logistics Agency |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
Yes |
50 MHz |
10 |
||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
No |
e0 |
31.2 MHz |
10 |
|||||||||||||||||||||||
Atmel |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
50 MHz |
10 |
32 mm |
10 |
|||||||||||
Atmel |
Flash PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
45 MHz |
8 |
24.35 mm |
8 |
|||||||||||
Atmel |
Flash PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
5.06 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Register Preload; Power-Up Reset; Shared Input/Clock |
e0 |
55.5 MHz |
10 |
32 mm |
10 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
10 |
CMOS |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
e0 |
55 MHz |
31.877 mm |
No |
10 |
||||||||||||
Atmel |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
10 |
CMOS |
MIL-STD-883 |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 10 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; Variable Product Terms |
e0 |
55 MHz |
32 mm |
No |
10 |
|||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
9 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.32 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock |
e0 |
109.8 MHz |
10 |
220 °C (428 °F) |
31.68 mm |
10 |
||||||||||
Altera |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
35 ns |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
72 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
No |
e0 |
25 MHz |
8 |
220 °C (428 °F) |
|||||||||||||||||||
Rochester Electronics |
OT PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
16 ns |
No |
5.25 V |
CMOS |
5 |
In-Line |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
4.318 mm |
7.62 mm |
8 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
83.3 MHz |
26.162 mm |
8 |
|||||||||||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
2.54 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
4.57 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
58.8 MHz |
8 |
26.125 mm |
8 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
Programmable Output Polarity |
e0 |
66.7 MHz |
8 |
26.162 mm |
8 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
5.08 mm |
7.62 mm |
No |
e0 |
41.6 MHz |
8 |
25.27 mm |
8 |
||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T20 |
4.57 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
40 MHz |
8 |
26.125 mm |
8 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
80 |
2.54 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
45 MHz |
30 s |
10 |
225 °C (437 °F) |
31.75 mm |
10 |
|||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
20 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
80 |
2.54 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
33.3 MHz |
10 |
31.75 mm |
10 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.57 mm |
7.62 mm |
No |
8 Macrocells; 1 External Clock; Register Preload; Shared Input/Clock |
e0 |
45.5 MHz |
8 |
31.855 mm |
8 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
1 |
5.08 mm |
7.62 mm |
No |
1 External Clock; Register Preload |
41.6 MHz |
8 |
31.875 mm |
8 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
e3 |
45.5 MHz |
8 |
260 °C (500 °F) |
31.75 mm |
8 |
||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
4.57 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Register Preload; Shared Input/Clock |
e0 |
33.3 MHz |
10 |
31.855 mm |
10 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.57 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Register Preload; Shared Input/Clock |
e0 |
33.3 MHz |
10 |
31.855 mm |
10 |
|||||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.953 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
33.3 MHz |
10 |
31.877 mm |
10 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 ns |
No |
5.5 V |
CMOS |
38535Q/M;38534H;883B |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
1 |
5.08 mm |
7.62 mm |
No |
e0 |
76.9 MHz |
10 |
31.75 mm |
10 |
||||||||||
Intel |
OT PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
35 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
72 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
5.08 mm |
7.62 mm |
No |
PAL with Macrocells; 8 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
22.2 MHz |
8 |
25.55 mm |
8 |
|||||||||||
Cypress Semiconductor |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
CMOS |
38535Q/M;38534H;883B |
16 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Combinatorial |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
e0 |
8 |
24.13 mm |
6 |
||||||||||||
Cypress Semiconductor |
Flash PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 ns |
No |
5.5 V |
CMOS |
38535Q/M;38534H;883B |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset |
e0 |
58 MHz |
8 |
24.13 mm |
8 |
||||||||||
Cypress Semiconductor |
Flash PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
4.826 mm |
7.62 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset |
e0 |
45.5 MHz |
8 |
25.527 mm |
8 |
|||||||||||
Cypress Semiconductor |
Flash PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.826 mm |
7.62 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
45.5 MHz |
8 |
31.75 mm |
8 |
|||||||||||
Cypress Semiconductor |
Flash PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
5 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.826 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
143 MHz |
10 |
30.099 mm |
10 |
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Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms |
e0 |
83.3 MHz |
10 |
30.734 mm |
10 |
|||||||||||
Microchip Technology |
Flash PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
22 |
PAL-TYPE |
5 |
Tube |
In-Line |
DIP24,.3 |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
90 MHz |
10 |
32 mm |
No |
10 |
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|
Microchip Technology |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.5 V |
10 |
CMOS |
5 |
Tube |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
e3 |
83 MHz |
31.877 mm |
No |
10 |
|||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
40 ns |
No |
5.5 V |
TTL |
16 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
No |
Combinatorial |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
e0 |
16 MHz |
8 |
24.195 mm |
No |
6 |
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Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.5 V |
TTL |
38535Q/M;38534H;883B |
8 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
No |
Registered |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
e0 |
25 MHz |
8 |
24.195 mm |
No |
0 |
||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
TTL |
MIL-PRF-38535 |
16 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Combinatorial |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
50 MHz |
8 |
24.195 mm |
6 |
|||||||||||||
Texas Instruments |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
TTL |
12 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Registered |
64 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
No |
30 MHz |
8 |
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Texas Instruments |
EE PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
TTL |
12 |
PLA-TYPE |
5 |
5 V |
In-Line |
DIP24,.6 |
Programmable Logic Devices |
32 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
No |
6 |
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Texas Instruments |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.25 V |
TTL |
MIL-M-38510 Class B |
5 |
In-Line |
Mixed |
4.75 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 2 I/O |
12 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
28.5 MHz |
32.005 mm |
2 |
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Texas Instruments |
UV PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24(UNSPEC) |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-GDIP-T24 |
No |
Shared Input/Clock |
10 |
10 |
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Texas Instruments |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
7 ns |
No |
5.25 V |
TTL |
8 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Registered |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
0 °C (32 °F) |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
Power-Up Reset; Register Preload |
111 MHz |
8 |
24.195 mm |
0 |
|||||||||||||
Texas Instruments |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
37 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
160 |
2.54 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
No |
Zero Standby Function; 16 Macrocells With Configurable I/O |
28.6 MHz |
16 |
16 |
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Texas Instruments |
OT PLD |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
TTL |
16 |
PLS-TYPE |
5 |
5 V |
In-Line |
DIP28,.6 |
Programmable Logic Devices |
48 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T28 |
No |
12.5 MHz |
8 |
||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
20 ns |
No |
TTL |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
132 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
No |
37 MHz |
10 |
||||||||||||||||||||||
|
Texas Instruments |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
18 ns |
No |
5.25 V |
TTL |
14 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Mixed |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 2 I/O |
12 |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e4 |
37 MHz |
8 |
31.64 mm |
2 |
||||||||||
Texas Instruments |
Mask PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
35 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Registered |
4.5 V |
2.54 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
5.08 mm |
7.62 mm |
No |
1 External Clock |
18 MHz |
24.325 mm |
0 |
||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
TTL |
MIL-STD-883 Class B |
5 |
In-Line |
Mixed |
4.5 V |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
Yes |
25 MHz |
4 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.