DIP Programmable Logic Devices (PLD) 1,674

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
ATF22V10C-15PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	55.5 MHz		10		31.877 mm		10
ATF22V10CQZ-20PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	38.5 MHz		10		32 mm		10
ATF22V10C-10PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	90 MHz		10		31.877 mm		10
ATF16V8BQL-15PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS			PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45 MHz		8		25.908 mm		8
ATF750CL-15PU	Microchip Technology	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	10	CMOS				5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	44 MHz				31.877 mm	No	10
GAL16V8D-25LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	37 MHz	30 s	8	260 °C (500 °F)	26.162 mm		8
ATF22V10C-7PX	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	125 MHz		10		31.877 mm		10
GAL16V8D-15LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45.5 MHz	5 s	8	260 °C (500 °F)	26.162 mm		8
ATF16V8CZ-15PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS			PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45 MHz		8		25.908 mm		8
GAL16V8D-25QPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	37 MHz		8	260 °C (500 °F)	26.162 mm		8
ATF16V8B-15PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45 MHz		8		25.908 mm		8
ATF22V10B-15GM/883	Microchip Technology	Flash PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883	22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	55.5 MHz		10		32 mm		10
GAL16V8D-15QPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45.5 MHz		8	260 °C (500 °F)	26.162 mm		8
GAL16V8D-25LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	37 MHz		8	260 °C (500 °F)	26.162 mm		8
ATF22V10CQZ-20PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				38.5 MHz				31.877 mm		10
ATF22V10CQZ-20PI	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				38.5 MHz				31.877 mm		10
GAL16V8D-15LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45.5 MHz		8	260 °C (500 °F)	26.162 mm		8
GAL22V10D-15LPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	55.5 MHz	30 s	10	260 °C (500 °F)	31.75 mm		10
GAL22V10D-15QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	10	CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	55.5 MHz		10		31.75 mm	No	10
5962-8867005LA	Defense Logistics Agency	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24				Yes		e0	50 MHz						10
GAL22V10D-10QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	83.3 MHz		10		31.75 mm		10
5962-8984103LA	Microchip Technology	Flash PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-PRF-38535; MIL-STD-883	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin/Lead - hot dipped	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	50 MHz		10		32 mm		10
ATF16V8C-7PC	Atmel	Flash PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 8 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No	8 Macrocells	e0	100 MHz		8		25.908 mm		8
GAL22V10D-25LPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	33.3 MHz		10		31.75 mm		10
PEEL18CV8P-15	Diodes Incorporated	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	74	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			7.62 mm	No		e0	41.6 MHz		8		26.162 mm		8
TICPAL22V10Z-25CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T24		5.08 mm	7.62 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock	e4	31.2 MHz		10		31.64 mm		10
GAL16V8D-10LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	66.7 MHz		8	260 °C (500 °F)	26.162 mm		8
GAL22V10D-15LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e3	55.5 MHz		10		31.75 mm		10
GAL16V8D-7LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	100 MHz	30 s	8	260 °C (500 °F)	26.162 mm		8
ATF750C-15GM/883	Microchip Technology	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	10	CMOS	MIL-STD-883			5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	55 MHz				32 mm	No	10
JM38510/50601BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		TTL	MIL-M-38510 Class B	16	PAL-TYPE	5	Tube		In-Line			No	Combinatorial	4.75 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	6.92 mm	No		e0	40 MHz		8		24.2 mm	No	6
ATF16V8B-15PC	Atmel	Flash PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	45 MHz		8		25.908 mm		8
GAL16V8D-15LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No		e0	45.5 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8
GAL16V8D-15LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin/Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	45.5 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8
5962-8867002LA	Defense Logistics Agency	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	Yes	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	25 MHz				31.877 mm		10
ATF22V10CZ-15PI	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				55.5 MHz				31.877 mm		10
ATF16V8C-7PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 8 I/O	7	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	8 Macrocells	e3	100 MHz		8		25.908 mm		8
ATF22V10CZ-12PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				55.5 MHz				31.877 mm		10
5962-8984101LA	NXP Semiconductors	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24				No		e0	22 MHz						10
PEEL18CV8P-15L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	74	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20			7.62 mm	No		e3	41.6 MHz		8	260 °C (500 °F)	26.162 mm		8
TIBPAL16L8-25CN	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T20		5.08 mm	7.62 mm	No		e4	30 MHz		8		25.4 mm		6
ATF22V10C-10PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	Shared Input/Clock	e0	90 MHz		10		31.877 mm		10
ATF22V10C-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e0	55.5 MHz		10		31.877 mm		10
ATF22V10CZ-15PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				55.5 MHz				31.877 mm		10
GAL16V8D-25LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8
GAL16V8D-25LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz		8		26.162 mm		8
GAL16V8D-25QP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz		8		26.162 mm		8
5962-8983901RA	Defense Logistics Agency	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	1 External Clock; Register Preload	e0	22.2 MHz				25.27 mm		8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.