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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | ATF750C-15GM/883 |
Description | EE PLD; Grading Of Temperature: MILITARY; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; |
Datasheet | ATF750C-15GM/883 Datasheet |
In Stock | 17 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 4.5 V |
Package Body Material: | Ceramic, Glass-Sealed |
Propagation Delay: | 15 ns |
Organization: | 11 Dedicated Inputs, 10 I/O |
Maximum Seated Height: | 5.08 mm |
Sub-Category: | Programmable Logic Devices |
Surface Mount: | No |
Position Of Terminal: | Dual |
No. of Terminals: | 24 |
JTAG Boundary Scan Test: | No |
No. of I/O Lines: | 10 |
Package Style (Meter): | In-Line |
Screening Level: | MIL-STD-883 |
JESD-30 Code: | R-GDIP-T24 |
Maximum Clock Frequency: | 55 MHz |
Package Shape: | Rectangular |
Maximum Operating Temperature: | 125 °C (257 °F) |
Package Code: | DIP |
Width: | 7.62 mm |
No. of Dedicated Inputs: | 11 |
Grading Of Temperature: | Military |
Programmable IC Type: | EE PLD |
Maximum Supply Voltage: | 5.5 V |
Nominal Supply Voltage (V): | 5 |
Packing Method: | Tube |
Technology Used: | CMOS |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -55 °C (-67 °F) |
Qualification: | No |
Package Equivalence Code: | DIP24,.3 |
Finishing Of Terminal Used: | Tin Lead |
Length: | 32 mm |
Form Of Terminal: | Through-Hole |
In-System Programmable: | No |
Output Function: | Macrocell |
Pitch Of Terminal: | 2.54 mm |
No. of Macro Cells: | 10 |
Power Supplies (V): | 5 V |