QCCJ Programmable Logic Devices (PLD) 2,131

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

XC9536XL-4PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4 ns

Yes

3.6 V

36

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

36 Macrocells

e0

200 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XCR22LV10-15PC28I

Xilinx

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

22

PAL-TYPE

3.3

3.3 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

3 V

132

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

e0

65 MHz

10

11.5062 mm

10

XC2C32A-4PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4 ns

Yes

1.9 V

32

CMOS

1.8

1.5/3.3,1.8 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

1.27 mm

70 °C (158 °F)

33 I/O

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

Real Digital Design Technology

e0

450 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

33

XCR3064-15PC68I

Xilinx

EE PLD

Industrial

J Bend

68

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

64

CMOS

3.3

3.3 V

Chip Carrier

LDCC68,1.0SQ

Programmable Logic Devices

No

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 48 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J68

1

5.08 mm

24.2316 mm

No

58 MHz

24.2316 mm

No

48

XCR3032XL-5PC44C

Xilinx

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

32

CMOS

3.3

3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

e0

175 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

36

XC7272-30WC84C

Xilinx

UV PLD

Commercial

J Bend

84

QCCJ

Square

Ceramic

48 ns

Yes

72

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-XQCC-J84

No

No

XC95108F-20PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

50 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

PLX448JC-45

Broadcom

OT PLD

Commercial

J Bend

28

QCCJ

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.25 V

8

CMOS

26

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

88

1.27 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin Lead

Quad

S-CQCC-J28

5.59 mm

11.6332 mm

No

PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock

e0

16.7 MHz

8

11.6332 mm

8

PLX464WJC-25

Broadcom

Commercial

J Bend

28

QCCJ

Square

Ceramic

Yes

8

CMOS

26

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

88

1.27 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin/Lead

Quad

S-XQCC-J28

11.638 mm

No

e0

28.5 MHz

8

11.638 mm

8

PLX448JC-25

Broadcom

Commercial

J Bend

28

QCCJ

Square

Ceramic

Yes

8

CMOS

26

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

88

1.27 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin/Lead

Quad

S-XQCC-J28

11.638 mm

No

e0

28.5 MHz

8

11.638 mm

8

PLX448JC-35

Broadcom

Commercial

J Bend

28

QCCJ

Square

Ceramic

Yes

8

CMOS

26

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

88

1.27 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin/Lead

Quad

S-XQCC-J28

11.638 mm

No

e0

18 MHz

8

11.638 mm

8

PLX464WJC-35

Broadcom

Commercial

J Bend

28

QCCJ

Square

Ceramic

Yes

8

CMOS

26

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

88

1.27 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin/Lead

Quad

S-XQCC-J28

11.638 mm

No

e0

18 MHz

8

11.638 mm

8

CPL20R6L25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20R4L-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

8

CPL16R6-15NLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

3

No

e0

41.6 MHz

6

CPL16R8L-25NLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

3

No

e0

28.5 MHz

8

CPL20R6-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20L8-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20V8L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL20R8L-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

8

CPL20L8L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20L8L-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R4-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

8

CPL16R8L-35NLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

3

No

e0

18 MHz

8

CPL20R8L25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL16R8-20NLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

3

No

e0

33.3 MHz

8

CPL16R8L-15NLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

3

No

e0

41.6 MHz

8

CPL20R6L-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL16R8-25NLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

3

No

e0

28.5 MHz

8

CPL16R8-15NLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Ceramic

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-J20

3

No

e0

41.6 MHz

8

CPL20L10-30NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20R4L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL22V10-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

10

CPL20L8-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R6-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL16R4L-25NLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

3

No

e0

28.5 MHz

4

CPL20R4L-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

8

CPL20L8L-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R8-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

41.6 MHz

8

CPL16R6-35PLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

3

No

e0

18 MHz

6

CPL20R4-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

41.6 MHz

8

CPL20R6-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20L10L25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

10

CPL16R6L-20NLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

3

No

e0

33.3 MHz

6

CPL16L8-20NLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Combinatorial

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

3

No

e0

8

CPL20R6-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R8L-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

8

CPL16R6-20NLC

Samsung

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

3

No

e0

33.3 MHz

6

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.