Rectangular Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

8103609RA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

TTL

MIL-STD-883

10

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

Yes

e0

25 MHz

6

24.2 mm

No

2

SNC54LS333J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

MIL-STD-883 Class B (Modified)

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

5962-8515501SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

20 ns

Yes

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

Flatpack

No

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDFP-F20

Yes

8

No

6

EP630-15CNT

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

17 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

160

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 16 I/O

4

0 °C (32 °F)

Dual

R-PDIP-T24

No

16 Macrocells; 2 External Clocks; Asynchronous Clocks

47.6 MHz

16

16

5962-01-322-3733

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

37 MHz

8

SNJ54LS336J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

TIBPAD18N8-6CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

6 ns

No

5.25 V

TTL

18

PAD-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

8

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 8 I/O

10

0 °C (32 °F)

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

8

24.325 mm

8

TIBPAL20SP8-20CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.25 V

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Dual

R-GDIP-T24

No

8

6

TICPAL16L8-55CJ

Texas Instruments

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

55 ns

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T20

No

8

PAL16R4A-2MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

16 MHz

8

24.195 mm

4

5962-01-284-1531

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

20 ns

No

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

28.5 MHz

8

SN74S330N3

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

50

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

6

PAL16R4AMWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

30 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

e0

25 MHz

8

13.09 mm

No

4

GAL16V8-20LJM

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

20 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

33.3 MHz

8

TIBPAL20R4-20MJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

Tube

5 V

In-Line

DIP24,.3

Programmable Logic Devices

No

Mixed

4.75 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

e0

40 MHz

8

32.005 mm

No

4

8103608SA

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

25 MHz

8

0

8412904LX

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

MIL-STD-883 Class B

5

In-Line

Mixed

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

Yes

28.5 MHz

4

TIBPAL16R8-12CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset

62 MHz

8

24.195 mm

0

5962-8515501RX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

In-Line

No

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDIP-T20

Yes

8

No

6

TICPAL22V10Z-35JT

Texas Instruments

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

45 ns

No

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

132

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

No

20 MHz

10

TIBPAL20R8-7MJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 0 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

Register Preload; Power-Up Reset

74 MHz

8

32.005 mm

0

TIBPAL16R8-25CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.25 V

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset

30 MHz

8

24.195 mm

0

TIBPAL20R8-10MWB

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

10 ns

Yes

5.5 V

TTL

12

PAL-TYPE

5

5 V

Flatpack

FL24,.35

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 0 I/O

12

-55 °C (-67 °F)

Dual

R-GDFP-F24

2.29 mm

9.085 mm

No

50 MHz

8

14.355 mm

0

TIBPALT19R4CNT

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

TTL

19

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

70 °C (158 °F)

0 Dedicated Inputs, 4 I/O

0

0 °C (32 °F)

Dual

R-PDIP-T24

No

1 External Clock; Register Preload

30 MHz

8

4

SN54PL16R8-1J

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

35 MHz

8

5962-8605301LX

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-STD-883

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

22 MHz

10

TIBPAL20X4CJT

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

No

35 MHz

10

TIFPLA839CJT

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.25 V

TTL

14

PLA-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

32

2.54 mm

70 °C (158 °F)

14 Dedicated Inputs, 0 I/O

14

0 °C (32 °F)

Dual

R-GDIP-T24

No

6

0

TIBPAL20R8-10MJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 0 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

8

32.005 mm

0

5962-8515509RX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

TTL

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDIP-T20

No

6

TICPAL16R6-55CJL

Texas Instruments

UV PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

55 ns

No

5.25 V

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 2 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T20

No

Register Preload

16 MHz

6

2

SN54LS336J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

5962-8515512RX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

In-Line

No

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

Yes

50 MHz

4

No

4

TIBPAL16R8-7CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

7.5 ns

No

5.25 V

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset; Register Preload

74 MHz

8

24.195 mm

0

TIBPAL16L8-12MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

14 ns

No

5.5 V

TTL

MIL-PRF-38535

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

48 MHz

8

24.195 mm

6

TIBPAL16L8-10CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8

24.195 mm

6

EP330-12CN

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

13 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

72

2.54 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

71.4 MHz

8

24.325 mm

8

TIEPAL10016TE6CJT

Texas Instruments

OT PLD

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

6 ns

No

5.25 V

ECL100K

10

PAL-TYPE

5

5,-5.2 V

In-Line

DIP24,.3

Programmable Logic Devices

Latched

4.75 V

48

2.54 mm

85 °C (185 °F)

10 Dedicated Inputs, 0 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T24

No

6

0

TIBPAL20R6-15CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

18 ns

No

5.25 V

TTL

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Dual

R-GDIP-T24

No

Register Preload; Power-Up Reset

37 MHz

8

2

TIBPAL16R8-30MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

e0

25 MHz

8

13.09 mm

No

0

TIBPAL16L8-10CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

e4

55.5 MHz

8

24.325 mm

6

TIBPAL20R4-12MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

12 ns

No

5.5 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

Power-Up Reset; Security Fuse

48 MHz

8

4

TIBPAL16R8-10CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset; Register Preload

55.5 MHz

8

24.195 mm

0

SN54LS334W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

12

PLA-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

5962-8515502SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

15 ns

Yes

5.5 V

TTL

MIL-STD-883

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

No

41.6 MHz

0

TIBPAL16R4-15CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset

e4

50 MHz

8

25.4 mm

4

PAL16R4A-2CN

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

28.6 MHz

8

TIBPAL16R4-7MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

MIL-PRF-38535

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

74 MHz

8

24.195 mm

4

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.