Rectangular Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
ATF22V10C-15PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	55.5 MHz		10		31.877 mm		10
ATF22V10CQZ-20PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	38.5 MHz		10		32 mm		10
ATF22V10C-10PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	90 MHz		10		31.877 mm		10
ATF16V8BQL-15PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS			PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45 MHz		8		25.908 mm		8
ATF750CL-15PU	Microchip Technology	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	10	CMOS				5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	44 MHz				31.877 mm	No	10
ATF22V10CQZ-20SU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		e3	38.5 MHz		10		15.4 mm		10
GAL16V8D-25LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	37 MHz	30 s	8	260 °C (500 °F)	26.162 mm		8
EPM570ZM144C7N	Intel	Flash PLD	Other	Ball	144	BGA	Rectangular	Plastic/Epoxy	15.1 ns	Yes	1.89 V	440	CMOS		116		1.8		1.5/3.3,1.8 V	Grid Array	BGA144,13X13,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B144	3		7 mm	No	It can also operate at 3.3 V	e1			116		7 mm	Yes	116
SLG46826V	Renesas Electronics	OT PLD		No Lead	20	VQCCN	Rectangular			Yes	5.5 V	19			13	PLA-TYPE	2.5			Chip Carrier, Very Thin Profile	LCC20,.08X.12,16		Yes	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	0 Dedicated Inputs, 13 I/O	0	-40 °C (-40 °F)		Quad	R-XQCC-N20	1	.6 mm	2 mm						15		3 mm	No	13
ATF22V10C-7PX	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	125 MHz		10		31.877 mm		10
ATF1508AS-10QU100	Microchip Technology	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	128					5	Tray	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	125 MHz				20 mm	Yes	80
ATF22V10C-10XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	4.5 V	132	.65 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24	2	1.2 mm	4.4 mm	No		e3	90 MHz		10		7.8 mm		10
EPM7128SQI100-10N	Intel	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz				20 mm	Yes	84
GAL16V8D-15LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45.5 MHz	5 s	8	260 °C (500 °F)	26.162 mm		8
ATF16V8CZ-15PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS			PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45 MHz		8		25.908 mm		8
ATF22V10C-10SU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		e3	90 MHz		10		15.4 mm		10
ATF22V10CQZ-20XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	4.5 V	132	.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		1.2 mm	4.4 mm	No		e3	38.5 MHz		10		7.8 mm		10
SLG46826VTR	Renesas Electronics	OT PLD		No Lead	20	VQCCN	Rectangular			Yes	5.5 V	19			13	PLA-TYPE	2.5	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC20,.08X.12,16		Yes	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	0 Dedicated Inputs, 13 I/O	0	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm						15		3 mm	No	13
GAL16V8D-25QPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	37 MHz		8	260 °C (500 °F)	26.162 mm		8
ATF16V8B-15PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45 MHz		8		25.908 mm		8
SLG46826G	Renesas Electronics	OT PLD		Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy		Yes	5.5 V	19			13	PLA-TYPE	2.5			Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25		Yes	Macrocell	2.3 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 13 I/O	0	-40 °C (-40 °F)		Dual	R-PDSO-G20	1	1.2 mm	4.4 mm						15		6.5 mm	No	13
ATF22V10B-15GM/883	Microchip Technology	Flash PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883	22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	55.5 MHz		10		32 mm		10
ATF22V10C-7SX	Microchip Technology	Flash PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	5	Tube	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		e3	125 MHz		10		15.4 mm		10
EPM7128SQC100-15N	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	100 MHz				20 mm	Yes	84
GAL16V8D-15QPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45.5 MHz		8	260 °C (500 °F)	26.162 mm		8
GAL16V8D-25LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	37 MHz		8	260 °C (500 °F)	26.162 mm		8
ATF22V10CQZ-20PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				38.5 MHz				31.877 mm		10
SLG46824G	Renesas Electronics	OT PLD		Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy		Yes	5.5 V	19			13	PLA-TYPE	2.5			Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25		Yes	Macrocell	2.3 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 13 I/O	0	-40 °C (-40 °F)		Dual	R-PDSO-G20	1	1.2 mm	4.4 mm						15		6.5 mm	No	13
ATF750CL-15SU	Microchip Technology	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	10	CMOS				5	Tube	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		e3	44 MHz				15.4 mm	No	10
EPM1270M256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns	Yes	2.625 V	980	CMOS		212		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
ATF22V10CQZ-20PI	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				38.5 MHz				31.877 mm		10
GAL16V8D-15LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45.5 MHz		8	260 °C (500 °F)	26.162 mm		8
GAL22V10D-15LPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	55.5 MHz	30 s	10	260 °C (500 °F)	31.75 mm		10
GAL22V10D-15QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	10	CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	55.5 MHz		10		31.75 mm	No	10
5962-8867005LA	Defense Logistics Agency	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24				Yes		e0	50 MHz						10
GAL22V10D-10QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	83.3 MHz		10		31.75 mm		10
ATF16V8B-15SU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	1	2.65 mm	7.5 mm	No		e3	45 MHz	40 s	8	250 °C (482 °F)	12.8 mm		8
ATF750CL-15XU	Microchip Technology	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	10	CMOS				5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		1.2 mm	4.4 mm	No		e3	44 MHz				7.8 mm	No	10
SLG46620-AG	Renesas Electronics	OT PLD		Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy		Yes	3.6 V	1		AEC-Q100	18	PLA-TYPE	3.3			Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25		No	Macrocell	1.71 V		.65 mm	105 °C (221 °F)	1 Dedicated Inputs, 17 I/O	1	-40 °C (-40 °F)		Dual	R-PDSO-G20	1	1.2 mm	4.4 mm						17		6.5 mm	No	17
ATF22V10CQZ-20SU-T	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS		22		5	Tape and Reel		Small Outline	SOP24,.4			Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm				38.5 MHz		10		15.4 mm	No	10
EPM1270M256I5N	Intel	Flash PLD		Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns	Yes	2.625 V	980	CMOS		212		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
ATF16V8BQL-15SU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	1	2.65 mm	7.5 mm	No		e3	45 MHz	40 s	8	250 °C (482 °F)	12.8 mm		8
5962-8984103LA	Microchip Technology	Flash PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-PRF-38535; MIL-STD-883	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin/Lead - hot dipped	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	50 MHz		10		32 mm		10
EPM7128SQI100-10	Intel	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	128	CMOS		84		5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz		84		20 mm	Yes	84
SLG46855VTR	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	5.5 V	15			11	PLA-TYPE	2.5	Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 10 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14		.6 mm	1.6 mm						11		2 mm	No	11
AT22V10-15DM	Atmel	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz		10		32 mm		10
ATF16V8C-7PC	Atmel	Flash PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 8 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No	8 Macrocells	e0	100 MHz		8		25.908 mm		8
EPM570ZM256C6N	Intel	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	9.5 ns	Yes	1.89 V	440	CMOS		160		1.8		1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			160		11 mm	Yes	160

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.