Rectangular Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
GAL16V8D-15LD/883	Lattice Semiconductor	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883	18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20	1	5.08 mm	7.62 mm	No		e0	41.6 MHz		8		25.27 mm		8
GAL16V8Z-15QP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	7 Dedicated Inputs, 8 I/O	7	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20		4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	40 MHz		8		26.125 mm		8
GAL20RA10B-15LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	80	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	45 MHz	30 s	10	225 °C (437 °F)	31.75 mm		10
GAL20RA10B-20LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	80	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	33.3 MHz		10		31.75 mm		10
GAL20V8A-15LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.57 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Register Preload; Shared Input/Clock	e0	45.5 MHz		8		31.855 mm		8
GAL20V8B-15LD/883	Lattice Semiconductor	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 8 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24	1	5.08 mm	7.62 mm	No	1 External Clock; Register Preload		41.6 MHz		8		31.875 mm		8
GAL20V8B-15QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	45.5 MHz		8	260 °C (500 °F)	31.75 mm		8
GAL22V10-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		4.57 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Register Preload; Shared Input/Clock	e0	33.3 MHz		10		31.855 mm		10
GAL22V10-25LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No			CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.57 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Register Preload; Shared Input/Clock	e0	33.3 MHz		10		31.855 mm		10
GAL22V10B-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.953 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	33.3 MHz		10		31.877 mm		10
GAL22V10D-10LD/883	Lattice Semiconductor	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	1	5.08 mm	7.62 mm	No		e0	76.9 MHz		10		31.75 mm		10
P5C032-35	Intel	OT PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	72	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		5.08 mm	7.62 mm	No	PAL with Macrocells; 8 Macrocells; 1 External Clock; Shared Input/Clock	e0	22.2 MHz		8		25.55 mm		8
PALC16L8-30DMB	Cypress Semiconductor	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0			8		24.13 mm		6
PALC22V10-40WMB	Cypress Semiconductor	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	18.1 MHz		10		31.877 mm		10
PALC22V10D-15KMB	Cypress Semiconductor	Flash PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	15 ns	Yes	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDFP-F24				No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz		10				10
PALCE16V8-10DMB	Cypress Semiconductor	Flash PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset	e0	58 MHz		8		24.13 mm		8
PALCE16V8-15PC	Cypress Semiconductor	Flash PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		4.826 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset	e0	45.5 MHz		8		25.527 mm		8
PALCE20V8-15PC	Cypress Semiconductor	Flash PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.826 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	45.5 MHz		8		31.75 mm		8
PALCE22V10-15KMB	Cypress Semiconductor	Flash PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	15 ns	Yes	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDFP-F24		2.286 mm	9.652 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz		10		15.367 mm		10
PALCE22V10-5PC	Cypress Semiconductor	Flash PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	5 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.826 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	143 MHz		10		30.099 mm		10
PALCE22V10Q-10PC/5	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms	e0	83.3 MHz		10		30.734 mm		10
XC95108-10PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3		30 s		245 °C (473 °F)	20 mm	Yes	81
XC95108-15PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3		30 s		245 °C (473 °F)	20 mm	Yes	81
XC95144-10PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	144	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	67.7 MHz	30 s		225 °C (437 °F)	20 mm	Yes	81
XC9572-10PQ100	Xilinx	Flash PLD		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5			Flatpack				Macrocell			.65 mm		0 Dedicated Inputs, 72 I/O	0		Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable	e0					20 mm		72
ATF22LV10CQZ-30XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	30 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	3 V	132	.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24	2	1.2 mm	4.4 mm	No		e3	25 MHz		10		7.8 mm		10
ATF16V8B-15SU-T	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5	Tape and Reel		Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20		2.65 mm	7.5 mm			e3	45 MHz				12.8 mm		8
ATF22LV10C-10XU	Microchip Technology	Flash PLD	Other	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	3 V	132	.65 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24	2	1.2 mm	4.4 mm	No	10 Macrocells	e3	71.4 MHz		10		7.8 mm		10
ATF22LV10CQZ-30SU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		e3	25 MHz		10		15.4 mm		10
ATF22V10B-10GM/883	Microchip Technology	Flash PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		CMOS	MIL-STD-883	22	PAL-TYPE	5	Tube		In-Line	DIP24,.3			Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm		10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms		90 MHz		10		32 mm	No	10
ATF750C-10PU	Microchip Technology	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V	10	CMOS				5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	83 MHz				31.877 mm	No	10
ATF750LVC-15SU	Microchip Technology	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	10	CMOS				3.3	Tube	3.3 V	Small Outline	SOP24,.4	Programmable Logic Devices	No	Macrocell	3 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		e3					15.4 mm	No	10
PAL16L8A-2MJ	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		TTL		16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	16 MHz		8		24.195 mm	No	6
PAL16R8AMJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		TTL	38535Q/M;38534H;883B	8	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	25 MHz		8		24.195 mm	No	0
TIBPAL16L8-15MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		TTL	MIL-PRF-38535	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No			50 MHz		8		24.195 mm		6
5962-01-406-5958	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			30 MHz		8
SN74LS334NP1	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		12	PLA-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No					6
JM38510/50503BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		TTL	MIL-M-38510 Class B			5			In-Line				Mixed	4.75 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			28.5 MHz				32.005 mm		2
TIBPAL16R4-30MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	30 ns	Yes	5.5 V		TTL	MIL-STD-883	12	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20		2.54 mm	6.92 mm	No		e0	25 MHz		8		13.09 mm	No	4
TICPAL22V10CJL	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed		No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24(UNSPEC)	Programmable Logic Devices		Macrocell	4.75 V	132		75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-GDIP-T24				No	Shared Input/Clock				10				10
SNJ54LS336W	Texas Instruments	EE PLD	Military	Flat	24	DFP	Rectangular	Ceramic		Yes			TTL	38535Q/M;38534H;883B	12	PLA-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices				32	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F24				No					6
5962-8515515SX	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	14 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Flatpack				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20				No			48 MHz						2
5962-8767103KX	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	20 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Flatpack				Mixed	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDFP-F24				No			28.5 MHz						2
TIBPAL16R8-5CJ	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	7 ns	No	5.25 V		TTL		8	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	Power-Up Reset; Register Preload		111 MHz		8		24.195 mm		0
5962-8605303KX	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Flatpack				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDFP-F24				Yes			25 MHz						10
EP610PC-35	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	37 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-PDIP-T24				No	Zero Standby Function; 16 Macrocells With Configurable I/O		28.6 MHz		16				16
82S105ACN	Texas Instruments	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy		No			TTL		16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices				48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T28				No			12.5 MHz		8
TIBPAL22V10-20MNT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No			TTL		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			37 MHz		10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.