Rectangular Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
GAL22V10D-25LPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	33.3 MHz		10		31.75 mm		10
ATF22V10CQZ-20SI	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS				5			Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm				38.5 MHz				15.4 mm		10
EPM7128SQC100-15	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz				20 mm	Yes	84
PEEL18CV8P-15	Diodes Incorporated	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	74	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			7.62 mm	No		e0	41.6 MHz		8		26.162 mm		8
EPM7128SQC100-7N	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	166.7 MHz				20 mm	Yes	84
ATF16V8BQL-15XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	64	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	1	1.2 mm	4.4 mm	No		e3	45 MHz	40 s	8	260 °C (500 °F)	6.5 mm		8
SLG46855V	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	5.5 V	15			11	PLA-TYPE	2.5			Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 10 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	1.6 mm						11		2 mm	No	11
TICPAL22V10Z-25CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T24		5.08 mm	7.62 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock	e4	31.2 MHz		10		31.64 mm		10
GAL16V8D-10LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	66.7 MHz		8	260 °C (500 °F)	26.162 mm		8
GAL22V10D-15LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e3	55.5 MHz		10		31.75 mm		10
XC95108-10PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	108	CMOS		81		5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	66.7 MHz	30 s	81	225 °C (437 °F)	20 mm	Yes	81
ATF22V10CQZ-20SC	Microchip Technology	Flash PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS				5			Small Outline				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm				38.5 MHz				15.4 mm		10
GAL16V8D-7LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	100 MHz	30 s	8	260 °C (500 °F)	26.162 mm		8
ATF16V8C-7SU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 8 I/O	7	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	8 Macrocells	e3	100 MHz		8		12.8 mm		8
EPM7128SQI100-10C	Altera	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS				5			Flatpack				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100		3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	100 MHz				20 mm		80
ATF750C-15GM/883	Microchip Technology	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	10	CMOS	MIL-STD-883			5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	55 MHz				32 mm	No	10
JM38510/50601BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		TTL	MIL-M-38510 Class B	16	PAL-TYPE	5	Tube		In-Line			No	Combinatorial	4.75 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	6.92 mm	No		e0	40 MHz		8		24.2 mm	No	6
SLG46534V	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	1.89 V	19			12	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC14,.08X.09,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				11		2.2 mm	No	11
SLG46534VTR	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	1.89 V	19			12	PLA-TYPE	1.8	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC14,.08X.09,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				11		2.2 mm	No	11
ATF16V8B-15PC	Atmel	Flash PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	45 MHz		8		25.908 mm		8
GAL16V8D-15LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No		e0	45.5 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8
GAL16V8D-15LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin/Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	45.5 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8
5962-8867002LA	Defense Logistics Agency	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	Yes	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	25 MHz				31.877 mm		10
AT22V10-15DM/883	Atmel	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz		10		32 mm		10
ATF22V10CZ-15PI	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				55.5 MHz				31.877 mm		10
ATF16V8C-7PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 8 I/O	7	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	8 Macrocells	e3	100 MHz		8		25.908 mm		8
ATF22V10CZ-12PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				55.5 MHz				31.877 mm		10
5962-8984101LA	NXP Semiconductors	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24				No		e0	22 MHz						10
PEEL18CV8P-15L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	74	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20			7.62 mm	No		e3	41.6 MHz		8	260 °C (500 °F)	26.162 mm		8
TIBPAL16L8-25CN	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T20		5.08 mm	7.62 mm	No		e4	30 MHz		8		25.4 mm		6
ATF16V8CZ-15XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			PAL-TYPE	5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	64	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	1	1.2 mm	4.4 mm	No		e3	45 MHz	40 s	8	260 °C (500 °F)	6.5 mm		8
ATF22V10C-10PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	Shared Input/Clock	e0	90 MHz		10		31.877 mm		10
ATF22V10C-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e0	55.5 MHz		10		31.877 mm		10
ATF22V10CZ-15PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				55.5 MHz				31.877 mm		10
GAL16V8D-25LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8
GAL16V8D-25LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz		8		26.162 mm		8
GAL16V8D-25QP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz		8		26.162 mm		8
SLG46538V	Renesas Electronics	OT PLD		No Lead	20	HVQCCN	Rectangular			Yes	1.89 V	17			17	PLA-TYPE	1.8			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC20,.08X.12,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 16 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				16		3 mm	No	16
5962-8983901RA	Defense Logistics Agency	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	1 External Clock; Register Preload	e0	22.2 MHz				25.27 mm		8
5962-8983903RA	National Semiconductor	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset	e0	41.6 MHz				24.257 mm		8
5962-8984002LA	Defense Logistics Agency	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 8 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset	e0	33.3 MHz				31.9405 mm		8
5962-8984003LA	Defense Logistics Agency	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 8 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset	e0	41.6 MHz				31.9405 mm		8
ATF16V8BQL-15PI	Atmel	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No		e0	45 MHz		8		25.908 mm		8
ATF22V10CQ-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e0	55.5 MHz		10		31.877 mm		10
EPM7128SQC100-6N	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	6 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	166.7 MHz				20 mm	Yes	84
EPM7128SQC100-7	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	166.7 MHz				20 mm	Yes	84
EPM7128SQC100-7F	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No		e0	166.7 MHz				20 mm	Yes	84
JM38510/50401BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No			TTL	MIL-M-38510 Class B			5			In-Line				Combinatorial				125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20				No		e0

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.