Rectangular Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
JM38510/50605BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		TTL	MIL-M-38510 Class B	16	PAL-TYPE	5	Tube		In-Line			No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	25 MHz		8		24.2 mm	No	6
JM38510/50606BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		TTL	MIL-M-38510 Class B	8	PAL-TYPE	5	Tube		In-Line			No	Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	25 MHz		8		24.2 mm	No	0
PAL16L8AMJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	25 MHz		8		24.195 mm	No	6
SLG46538M	Renesas Electronics	OT PLD		No Lead	22	HVQCCN	Rectangular			Yes	1.89 V	17			17	PLA-TYPE	1.8			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC22,.08X.09,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 16 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N22		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				16		2.2 mm	No	16
SLG46580V	Renesas Electronics	OT PLD		No Lead	20	VQCCN	Rectangular			Yes	5.5 V	15			9	PLA-TYPE	3.3			Chip Carrier, Very Thin Profile	LCC20,.08X.12,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 8 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm						8		3 mm	No	8
SLG46580VTR	Renesas Electronics	OT PLD		No Lead	20	VQCCN	Rectangular			Yes	5.5 V	15			9	PLA-TYPE	3.3	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC20,.08X.12,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 8 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm						8		3 mm	No	8
SLG46827-AG	Renesas Electronics	OT PLD		Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy		Yes	5.5 V	19		AEC-Q100	13	PLA-TYPE	3.3			Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25		No	Macrocell	2.3 V		.65 mm	105 °C (221 °F)	0 Dedicated Inputs, 13 I/O	0	-40 °C (-40 °F)		Dual	R-PDSO-G20	1	1.2 mm	4.4 mm						15		6.5 mm	No	13
XC95108-10PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm	Yes	108
XC95108-7PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0		30 s		225 °C (437 °F)	20 mm	Yes	81
8103610SA	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	40 ns	Yes	5.5 V		TTL	MIL-STD-883	12	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20		2.54 mm	6.92 mm	Yes		e0	25 MHz		8		13.09 mm	No	4
EPM1270GM256I5N	Intel	Flash PLD		Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns	Yes	1.89 V	980	CMOS		212		1.8		1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
EPM240ZM68C6N	Intel	Flash PLD	Other	Ball	68	BGA	Rectangular	Plastic/Epoxy	7.9 ns	Yes	1.89 V	192	CMOS		54		1.8		1.5/3.3,1.8 V	Grid Array	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B68	3		5 mm	No	It can also operate at 3.3 V	e1			54		5 mm	Yes	54
EPM240ZM68C7N	Intel	Flash PLD	Other	Ball	68	BGA	Rectangular	Plastic/Epoxy	12 ns	Yes	1.89 V	192	CMOS		54		1.8		1.5/3.3,1.8 V	Grid Array	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B68	3		5 mm	No	It can also operate at 3.3 V	e1			54		5 mm	Yes	54
EPM5032DC-15	Altera	UV PLD	Commercial	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	76.9 MHz		16	220 °C (428 °F)			16
EPM5032DC-20	Altera	UV PLD	Commercial	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)			16
EPM5032PC-15	Altera	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	76.9 MHz	30 s	16	220 °C (428 °F)			16
EPM5032PC-20	Altera	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)			16
EPM7128SQC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	128	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz				20 mm	Yes	84
GAL16V8-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No			CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20				No		e0	33.3 MHz		8
GAL22V10D-25LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e3	33.3 MHz		10		31.75 mm		10
JM38510/50604BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		TTL	MIL-M-38510 Class B	12	PAL-TYPE	5	Tube		In-Line			No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	6.92 mm	No		e0	40 MHz		8		24.2 mm	No	4
M38510/50504BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed		No	5.25 V		Bipolar	MIL-M-38510 Class B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	6.92 mm	Yes		e0	40 MHz		8		32 mm	No	4
SLG46108V	Renesas Electronics	OT PLD		No Lead	8	VQCCN	Rectangular			Yes	1.89 V	7			6	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC8,.039X.047,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 5 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N8	1	.6 mm	1 mm		Can also operate at 3.3 V or 5 V supply				5		1.2 mm	No	5
SLG46140V	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	1.89 V	8			12	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				11		2 mm	No	11
SLG46140VTR	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	1.89 V	8			12	PLA-TYPE	1.8	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				11		2 mm	No	11
SLG46538MTR	Renesas Electronics	OT PLD		No Lead	22	HVQCCN	Rectangular			Yes	1.89 V	17			17	PLA-TYPE	1.8	Tape and Reel, 7 in		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC22,.08X.09,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 16 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N22		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				16		2.2 mm	No	16
82S100/BXA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	80 ns	No	5.5 V		TTL				5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-GDIP-T28				No									0
82S100BXA	Qp Semiconductor	OT PLD	Military	Through-Hole	28		Rectangular	Ceramic, Metal-Sealed Cofired	80 ns	No	5.5 V		Bipolar				5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDIP-T28				No									0
ATF22LV10CQZ-30PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	3 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	25 MHz		10		31.887 mm		10
ATF750CL-15PC	Atmel	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	10	CMOS				5		5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e0	44 MHz				31.877 mm	No	10
GAL22V10D-25QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	33.3 MHz		10		31.75 mm		10
M38510/50601BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	6.92 mm	Yes		e0	40 MHz		8		24.2 mm	No	6
ATF1504ASL-20QC100	Atmel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.25 V	64	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	83.3 MHz			225 °C (437 °F)	20 mm	Yes	64
PALC22V10-30DMB	Cypress Semiconductor	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	25 MHz		10		31.877 mm		10
GAL22V10D-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e0	33.3 MHz	30 s	10	225 °C (437 °F)	31.75 mm		10
GAL20V8B-25QP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		31.75 mm		8
GAL20V8B-15LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	45.5 MHz		8		31.75 mm		8
XC95108-15PQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3		30 s		245 °C (473 °F)	20 mm	Yes	81
XC9572-10PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	72	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
ATF20V8B-10PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	8 Macrocells	e0	68 MHz		8		31.877 mm		8
ATF20V8B-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	8 Macrocells	e0	45 MHz		8		31.877 mm		8
ATF22V10C-10XC	Atmel	Flash PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	4.75 V	132	.65 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24	2	1.2 mm	4.4 mm	No	Shared Input/Clock	e0	90 MHz		10	240 °C (464 °F)	7.8 mm		10
GAL18V10B-20LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	96	2.54 mm	75 °C (167 °F)	7 Dedicated Inputs, 10 I/O	7	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20	1	4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	41.6 MHz		10		26.125 mm		10
GAL20V8B-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		31.75 mm		8
GAL20V8B-25QPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		31.75 mm		8
GAL22V10B-25LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.953 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	33.3 MHz		10		31.877 mm		10
M4A5-128/64-10YC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	128	CMOS				5		5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	62.5 MHz	30 s		225 °C (437 °F)	20 mm	Yes	64
PLS100N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	50 ns	No	5.25 V		TTL		16	PLA-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices		Combinatorial	4.75 V	48	2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28				No	Tri-State Output				8				0

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.