Rectangular Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
ATV750-25DM/883	Atmel	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V	10	CMOS	MIL-STD-883 Class B			5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 10 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; Variable Product Terms	e0	45 MHz	30 s		240 °C (464 °F)	32 mm	No	10
EP1210DC	Altera	UV PLD	Commercial	Through-Hole	40	WDIP	Rectangular	Ceramic, Glass-Sealed	90 ns	No	5.25 V		CMOS		36	PAL-TYPE	5		In-Line, Window	DIP40,.6	Programmable Logic Devices		Macrocell	4.75 V	236	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T40		5.715 mm	15.24 mm	No	28 Macrocells	e0	17.5 MHz		24	220 °C (428 °F)	52.07 mm		24
EP22V10EDC-10	Altera	UV PLD	Commercial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock	e0	95.2 MHz		10	220 °C (428 °F)	32 mm		10
GAL20VP8B-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	40 MHz		8		31.855 mm		8
GAL22V10D-15LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e0	55.5 MHz		10		31.75 mm		10
PALC16R4-30DMB	Cypress Semiconductor	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	1 External Clock	e0	22 MHz		4		24.13 mm		4
PALCE16V8H-25PC/4	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20		4.953 mm	7.62 mm	No		e0	37 MHz		8		26.1366 mm		8
5962-8872404LA	Defense Logistics Agency	UV PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		CMOS	MIL-STD-883			5		In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	31.2 MHz				32 mm		10
5962-8983904RA	Defense Logistics Agency	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		CMOS	MIL-STD-883			5		In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	Yes	1 External Clock; Register Preload	e0	58.8 MHz				25.27 mm		8
5962-9061102XA	Defense Logistics Agency	UV PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed		No			CMOS				5		In-Line				Macrocell				125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28				Yes		e0
ATF16V8B-10PC	Atmel	Flash PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	68 MHz		8		25.908 mm		8
CY7C344-25WMB	Cypress Semiconductor	UV PLD	Military	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	24	PAL-TYPE	5	5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.5 V	320	2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 16 I/O	7	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz		16		37.0205 mm		16
EP610PC-25	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	27 ns	No	5.25 V		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-PDIP-T24				No	Zero Standby Function; 16 Macrocells With Configurable I/O		40 MHz		16				16
GAL16V8B-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		26.125 mm		8
GAL22V10B-25QP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.953 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	33.3 MHz		10		31.877 mm		10
GAL22V10D-10LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e0	83.3 MHz		10		31.75 mm		10
M4A5-128/64-10YNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	128	CMOS			PAL-TYPE	5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	62.5 MHz	40 s		245 °C (473 °F)	20 mm	Yes	64
M4A5-128/64-10YNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	128	CMOS				5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	62.5 MHz	40 s		245 °C (473 °F)	20 mm	Yes	64
PALC22V10-25DMB	Cypress Semiconductor	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	30.3 MHz		10		31.877 mm		10
PALCE22V10H-10PI/5	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms	e0	83.3 MHz		10		30.734 mm		10
PALCE22V10H-25PC/4	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms	e0	33.3 MHz		10		30.734 mm		10
PALCE22V10H-7PC/5	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms	e0	100 MHz		10		30.734 mm		10
PLDC20G10B-15PC	Cypress Semiconductor	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	90	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 11 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.826 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	45.4 MHz		10		31.75 mm		11
XC95144-7PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	144	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	83.3 MHz	30 s		245 °C (473 °F)	20 mm	Yes	81
XC9572-10PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
5962-8867005LX	Defense Logistics Agency	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883			5		In-Line				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24				Yes			50 MHz						10
5962-8867805RA	Defense Logistics Agency	UV PLD	Military	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS				5		In-Line, Window				Combinatorial	4.5 V		2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0					24.13 mm		6
5962-8984102LA	NXP Semiconductors	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		CMOS				5		In-Line				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24				No		e0	31.2 MHz						10
AT22V10-15PI	Atmel	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz		10		32 mm		10
ATF1508ASV-15QC100	Atmel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	128					3.3	3.3 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	3 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	100 MHz			225 °C (437 °F)	20 mm	Yes	80
ATF16V8B-15GM	Atmel	Flash PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	45 MHz		8		24.35 mm		8
ATF22V10B-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.06 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Register Preload; Power-Up Reset; Shared Input/Clock	e0	55.5 MHz		10		32 mm		10
ATF750C-15PC	Atmel	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	10	CMOS				5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e0	55 MHz				31.877 mm	No	10
ATF750CL-15SC	Atmel	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	10	CMOS				5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24	2	2.65 mm	7.5 mm	No		e0	44 MHz				15.4 mm	No	10
ATV750-20GM/883	Atmel	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	10	CMOS	MIL-STD-883			5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 10 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; Variable Product Terms	e0	55 MHz				32 mm	No	10
CY7C330-40WMB	Cypress Semiconductor	UV PLD	Military	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	23	PAL-TYPE	5	5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.5 V	256	2.54 mm	125 °C (257 °F)	9 Dedicated Inputs, 12 I/O	9	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Synchronous State Machine; 12 I/O Macrocells; 3 External Clocks; Shared Input/Clock	e0	40 MHz		12		37.0205 mm		12
CY7C344-20WC	Cypress Semiconductor	UV PLD	Commercial	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		CMOS		24	PAL-TYPE	5	5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	41.6 MHz		16		37.0205 mm		16
EP22V10PC-7	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	9 ns	No	5.25 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.32 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock	e0	109.8 MHz		10	220 °C (428 °F)	31.68 mm		10
EP320IPC-35	Altera	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No			CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		72	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20				No		e0	25 MHz		8	220 °C (428 °F)
EP330PC-15	Rochester Electronics	OT PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	16 ns	No	5.25 V		CMOS				5		In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		4.318 mm	7.62 mm		8 Macrocells; 1 External Clock; Shared Input/Clock	e0	83.3 MHz				26.162 mm		8
EP900DI	Altera	UV PLD	Industrial	Through-Hole	40	WDIP	Rectangular	Ceramic, Glass-Sealed	60 ns	No	5.5 V		CMOS		36	PAL-TYPE	5	5 V	In-Line, Window	DIP40,.6	Programmable Logic Devices		Macrocell	4.5 V	240	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-GDIP-T40		5.715 mm	15.24 mm	No	24 Macrocells	e0	20 MHz		24	220 °C (428 °F)	52.07 mm		24
EPM1270GM256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns	Yes	1.89 V	980	CMOS		212		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
EPM5016DC-20	Altera	UV PLD	Commercial	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		CMOS		16	PAL-TYPE	5	5 V	In-Line, Window	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 8 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T20		5.334 mm	7.62 mm	No	Macrocells interconnected by PIA; 16 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		8	220 °C (428 °F)	24.13 mm		8
EPM5032DC-25	Altera	UV PLD	Commercial	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		CMOS		24	PAL-TYPE	5	5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)	36.83 mm		16
EPM7064QC100-10	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				20 mm	No	68
EPM7128SQC100-10	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	128	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				20 mm	Yes	84
GAL16V8B-10LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	58.8 MHz		8		26.125 mm		8
GAL16V8D-10LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	Programmable Output Polarity	e0	66.7 MHz		8		26.162 mm		8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.