Square Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

LVT22V10-DA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

74 MHz

11.5062 mm

10

PLHS501A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

52

QCCJ

Square

Plastic/Epoxy

17.5 ns

Yes

5.25 V

TTL

32

PLE-TYPE

5

5 V

Chip Carrier

LDCC52,.8SQ

Programmable Logic Devices

Combinatorial

4.75 V

1.27 mm

75 °C (167 °F)

24 Dedicated Inputs, 8 I/O

24

0 °C (32 °F)

Quad

S-PQCC-J52

1

4.57 mm

19.1262 mm

No

30 MHz

24

19.1262 mm

8

PZ3064-12A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

67 MHz

16.5862 mm

32

PZ3064-12A84-T

NXP Semiconductors

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

67 MHz

29.3116 mm

64

PZ3064-10BC-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

80 MHz

10 mm

32

PZ5128CS10BP-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

128 Macrocells

71 MHz

14 mm

80

PZ5064-7A68-T

NXP Semiconductors

EE PLD

Commercial

J Bend

68

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 48 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J68

4.57 mm

24.2316 mm

No

105 MHz

24.2316 mm

48

PML2552-35KA-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

68

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

9 Dedicated Inputs, 24 I/O

9

0 °C (32 °F)

Quad

S-CQCC-J68

4.83 mm

24.065 mm

No

50 MHz

24.065 mm

24

PZ5032CS6A44-T

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

111 MHz

16.5862 mm

32

PZ5064CS7A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

9 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

64 Macrocells

105 MHz

16.5862 mm

32

PZ5064-7A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

105 MHz

16.5862 mm

32

PLQ20R8-5A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

6 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Registered

4.75 V

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

No

Register Preload; Power-Up Reset

118 MHz

0

PZ3128IS12BP-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

3 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

66 MHz

14 mm

80

PLS153A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

40 ns

Yes

5.25 V

TTL

5

Chip Carrier

Combinatorial

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 10 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Programmable Output Polarity

8.965 mm

10

PZ5064N12BP-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

14.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

64 Macrocells

67 MHz

14 mm

64

PZ3128-S12A84-T

NXP Semiconductors

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

66 MHz

29.3116 mm

64

PZ3032CS8BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

91 MHz

10 mm

32

PZ3032I12BC-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

19 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

47 MHz

10 mm

32

PZ5032-10A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

59 MHz

16.5862 mm

32

PZ3128-S15BB2-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

59 MHz

28 mm

96

PLS173A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.25 V

TTL

22

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

4.75 V

42

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Output Polarity

10

11.505 mm

10

PZ5064C10BP-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

64 Macrocells

77 MHz

14 mm

64

PZ3032AS6A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

111 MHz

16.5862 mm

32

PZ5032-10BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

59 MHz

10 mm

32

PZ5128-S10BB2

NXP Semiconductors

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

71 MHz

28 mm

96

PZ5064-10A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

77 MHz

16.5862 mm

32

PZ3064A7BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

105 MHz

10 mm

32

PZ5064I12A84

NXP Semiconductors

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

67 MHz

29.3116 mm

64

PZ5128IS10BB2

NXP Semiconductors

EE PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

66 MHz

28 mm

96

PLUS16R8-7A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Power-Up Reset

74 MHz

8.965 mm

0

PZ5128IS15A84-T

NXP Semiconductors

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

63 MHz

29.3116 mm

64

5962-8768201M2A

NXP Semiconductors

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

No

e0

10

PZ5128NS15BP

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

128 Macrocells

63 MHz

14 mm

80

PZ5032-10BC-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

59 MHz

10 mm

32

PLS167AA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

14 Dedicated Inputs, 0 I/O

14

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Logic Sequencer; 1 External Clock

12.5 MHz

11.505 mm

0

PZ5128IS15BB2-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

63 MHz

28 mm

96

PLQ20R4-5A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Mixed

4.75 V

75 °C (167 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

No

Register Preload; Power-Up Reset

118 MHz

4

PZ3032AS7BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

80 MHz

10 mm

32

PLUS16L8-7A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

TTL

5

Chip Carrier

Combinatorial

4.75 V

1.27 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

8.965 mm

6

PZ3064A7A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

105 MHz

16.5862 mm

32

PZ3032AS6BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

8 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

111 MHz

10 mm

32

PLUS405/B3A

NXP Semiconductors

OT PLD

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

Bipolar

Chip Carrier

16 Dedicated Inputs

16

Quad

S-CQCC-N28

No

30 MHz

PZ5064-7A68

NXP Semiconductors

EE PLD

Commercial

J Bend

68

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 48 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J68

4.57 mm

24.2316 mm

No

105 MHz

24.2316 mm

48

PZ3064-12BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

67 MHz

10 mm

32

PZ3032-10BC-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

17 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

57 MHz

10 mm

32

PML2852-35KA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

84

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

29 Dedicated Inputs, 24 I/O

29

0 °C (32 °F)

Quad

S-CQCC-J84

4.83 mm

29.145 mm

No

52 Flip Flops

29.145 mm

24

PZ5032-6BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

11 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

105 MHz

10 mm

32

PZ3064DS10EC

NXP Semiconductors

EE PLD

Industrial

Ball

56

LFBGA

Square

Plastic/Epoxy

11.5 ns

Yes

3.6 V

CMOS

Grid Array, Low Profile, Fine Pitch

Macrocell

2.7 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 44 I/O

2

-40 °C (-40 °F)

Bottom

S-PBGA-B56

1.35 mm

6 mm

No

90 MHz

6 mm

44

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.