Square Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PZ3064AS7BP

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

9 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

3 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

111 MHz

14 mm

64

PLUS173DA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

TTL

22

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

4.75 V

42

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Output Polarity

10

11.505 mm

10

PZ5128-S12BP-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

63 MHz

14 mm

80

PZ5032I10BC-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

59 MHz

10 mm

32

PZ5128-S7BP-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

87 MHz

14 mm

80

PZ3032DS7BC

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

91 MHz

10 mm

32

PZ5064NS12A44

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

14 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

64 Macrocells

67 MHz

16.5862 mm

32

P3Z22V10-DA

NXP Semiconductors

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

83 MHz

11.5062 mm

10

PZ3064I12A44

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

67 MHz

16.5862 mm

32

PZ3128IS15BB2

NXP Semiconductors

EE PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

59 MHz

28 mm

96

PZ3064AS10EC

NXP Semiconductors

EE PLD

Commercial

Ball

56

LFBGA

Square

Plastic/Epoxy

11.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Low Profile, Fine Pitch

Macrocell

3 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 44 I/O

2

0 °C (32 °F)

Bottom

S-PBGA-B56

1.35 mm

6 mm

No

83 MHz

6 mm

44

PZ5064C7BP-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

9.5 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

64 Macrocells

105 MHz

14 mm

64

PZ3064AS10BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

11.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

83 MHz

10 mm

32

PL22V10-10A

NXP Semiconductors

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

66.6 MHz

11.505 mm

10

PZ5032-7A44-T

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

80 MHz

16.5862 mm

32

PZ3064A7BP

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

2.97 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

64 Macrocells

105 MHz

14 mm

64

PZ3128IS12A84-T

NXP Semiconductors

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

66 MHz

29.3116 mm

64

PZ5128IS15A84

NXP Semiconductors

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

63 MHz

29.3116 mm

64

PLS100A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

50 ns

Yes

5.25 V

TTL

16

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

4.75 V

48

1.27 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Tri-State Output

8

11.505 mm

0

PZ3032NS10BC

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

58.8 MHz

10 mm

32

PZ5128CS7BP-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

9.5 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

128 Macrocells

95 MHz

14 mm

80

LVT22V10-DA-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

74 MHz

11.5062 mm

10

PZ3064A7BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

105 MHz

10 mm

32

PZ3032I10BC-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

16 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

58.8 MHz

10 mm

32

PL22V10-12A

NXP Semiconductors

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

58.8 MHz

11.505 mm

10

PZ3064A10A44-T

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

77 MHz

16.5862 mm

32

PZ3032NS10BC-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

58.8 MHz

10 mm

32

PLQ20R6-5A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Mixed

4.75 V

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

No

Register Preload; Power-Up Reset

118 MHz

2

PZ3064I15A68

NXP Semiconductors

EE PLD

Industrial

J Bend

68

QCCJ

Square

Plastic/Epoxy

17.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 48 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J68

4.57 mm

24.2316 mm

No

58 MHz

24.2316 mm

48

PML2852-50KA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

84

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

29 Dedicated Inputs, 24 I/O

29

0 °C (32 °F)

Quad

S-CQCC-J84

4.83 mm

29.145 mm

No

52 Flip Flops

29.145 mm

24

PZ3032I10A44

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

16 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

58.8 MHz

16.5862 mm

32

PZ3128-S12BB2-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

66 MHz

28 mm

96

PZ3128-S12BP-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

3 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

66 MHz

14 mm

80

PLC18V8Z35A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

74

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

21 MHz

8

8.965 mm

8

PZ5032-7A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

80 MHz

16.5862 mm

32

PZ3032AS6BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

8 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

111 MHz

10 mm

32

PZ3064-12A44-T

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

67 MHz

16.5862 mm

32

PZ3032CS12BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

47 MHz

10 mm

32

PZ5128-S10A84

NXP Semiconductors

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

71 MHz

29.3116 mm

64

82S153A/B2A

NXP Semiconductors

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.5 V

TTL

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

No

10

P3Z22V10IBA

NXP Semiconductors

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

65 MHz

11.5062 mm

10

P5Z22V10-7A-T

NXP Semiconductors

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

9 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

103 MHz

11.5062 mm

10

PZ3032I12A44

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

19 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

47 MHz

16.5862 mm

32

PLS168A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Logic Sequencer; 1 External Clock

9.8 MHz

11.505 mm

0

PLS157A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

55 ns

Yes

5.25 V

TTL

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

4 Dedicated Inputs, 12 I/O

4

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Programmable Logic Sequencer; 1 External Clock

14 MHz

8.965 mm

12

PZ3128-S15BP-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

3 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

59 MHz

14 mm

80

PZ5064I10A68-T

NXP Semiconductors

EE PLD

Industrial

J Bend

68

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 48 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J68

4.57 mm

24.2316 mm

No

77 MHz

24.2316 mm

48

PZ5032I7A44-T

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

91 MHz

16.5862 mm

32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.