Square Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	Nominal Supply Voltage (V)	Package Style (Meter)	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Length	No. of I/O Lines
PZ5128IS10BP-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS		5	Flatpack, Thin Profile, Fine Pitch	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No			66 MHz	14 mm	80
PZ5064N12A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	5.5 V	CMOS		5	Chip Carrier	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	64 Macrocells		67 MHz	16.5862 mm	32
5962-9176007M3A	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.25 V	BICMOS	MIL-STD-883 Class B	5	Chip Carrier	Macrocell	4.75 V		125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N28			No		e0	55 MHz		10
PZ5064C7A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS		5	Chip Carrier	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	64 Macrocells		105 MHz	16.5862 mm	32
PZ3128IS12BB2	NXP Semiconductors	EE PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS		3.3	Flatpack	Macrocell	3 V	.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G160	4.07 mm	28 mm	No			66 MHz	28 mm	96
PZ3032-12BC	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	19 ns	Yes	3.63 V	CMOS		3.3	Flatpack, Thin Profile	Macrocell	2.97 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			47 MHz	10 mm	32
PZ3128IS12BP-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS		3.3	Flatpack, Thin Profile, Fine Pitch	Macrocell	3 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No			66 MHz	14 mm	80
PZ3128-S10BB2	NXP Semiconductors	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	13 ns	Yes	3.6 V	CMOS		3.3	Flatpack	Macrocell	3 V	.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G160	4.07 mm	28 mm	No			74 MHz	28 mm	96
PZ3032DS10BC	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS		3.3	Flatpack, Thin Profile	Macrocell	2.97 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No	32 Macrocells		59 MHz	10 mm	32
PZ3064-10BC-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS		3.3	Flatpack, Thin Profile	Macrocell	2.97 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			80 MHz	10 mm	32
PZ3064D10A44-T	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS		3.3	Chip Carrier	Macrocell	2.97 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	32 Macrocells		77 MHz	16.5862 mm	32
PZ5128IS15BB2	NXP Semiconductors	EE PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	17.5 ns	Yes	5.5 V	CMOS		5	Flatpack	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G160	4.07 mm	28 mm	No			63 MHz	28 mm	96
PZ3032I10BC-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	16 ns	Yes	3.63 V	CMOS		3.3	Flatpack, Thin Profile	Macrocell	2.97 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			58.8 MHz	10 mm	32
PZ3064I15A44-T	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	17.5 ns	Yes	3.63 V	CMOS		3.3	Chip Carrier	Macrocell	2.97 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No			58 MHz	16.5862 mm	32
P3Z22V10-BA-T	NXP Semiconductors	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	CMOS		3.3	Chip Carrier	Macrocell	3 V	1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No			69 MHz	11.5062 mm	10
PZ3128-S15BP-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS		3.3	Flatpack, Thin Profile, Fine Pitch	Macrocell	3 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No			59 MHz	14 mm	80
PZ5032NS10A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS		5	Chip Carrier	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	32 Macrocells		59 MHz	16.5862 mm	32
PZ5064CS10BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS		5	Flatpack, Thin Profile, Fine Pitch	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	64 Macrocells		80 MHz	14 mm	64
PZ5064NS10BC	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	CMOS		5	Flatpack, Thin Profile	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No	64 Macrocells		77 MHz	10 mm	32
PZ3032-8A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.63 V	CMOS		3.3	Chip Carrier	Macrocell	2.97 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No			74 MHz	16.5862 mm	32
PZ3032CS10BC-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	13 ns	Yes	3.63 V	CMOS		3.3	Flatpack, Thin Profile	Macrocell	3 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No	32 Macrocells		57 MHz	10 mm	32
PZ5032CS7BC-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS		5	Flatpack, Thin Profile	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No	32 Macrocells		80 MHz	10 mm	32
PZ3064I15A84-T	NXP Semiconductors	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	17.5 ns	Yes	3.63 V	CMOS		3.3	Chip Carrier	Macrocell	2.97 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No			58 MHz	29.3116 mm	64
PZ5128-S7A84	NXP Semiconductors	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS		5	Chip Carrier	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No			87 MHz	29.3116 mm	64
PZ3064A10A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS		3.3	Chip Carrier	Macrocell	2.97 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	32 Macrocells		77 MHz	16.5862 mm	32
PZ5064I10A84	NXP Semiconductors	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS		5	Chip Carrier	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No			77 MHz	29.3116 mm	64
P3Z22V10-BA	NXP Semiconductors	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	CMOS		3.3	Chip Carrier	Macrocell	3 V	1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No			69 MHz	11.5062 mm	10
PZ5064I12A44-T	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	5.5 V	CMOS		5	Chip Carrier	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No			67 MHz	16.5862 mm	32
PZ3032I12BC	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	19 ns	Yes	3.63 V	CMOS		3.3	Flatpack, Thin Profile	Macrocell	2.97 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			47 MHz	10 mm	32
PZ3128-S15A84	NXP Semiconductors	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS		3.3	Chip Carrier	Macrocell	3 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No			59 MHz	29.3116 mm	64
PZ3064A10BC-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS		3.3	Flatpack, Thin Profile	Macrocell	2.97 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No	32 Macrocells		77 MHz	10 mm	32
PZ3032CS8A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.63 V	CMOS		3.3	Chip Carrier	Macrocell	3 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	32 Macrocells		91 MHz	16.5862 mm	32
PLUS16R4DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL		5	Chip Carrier	Mixed	4.75 V	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Power-Up Reset		60.6 MHz	8.965 mm	4
PZ5064N12BP	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14.5 ns	Yes	5.5 V	CMOS		5	Flatpack, Thin Profile, Fine Pitch	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	64 Macrocells		67 MHz	14 mm	64
PZ5064NS10A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	CMOS		5	Chip Carrier	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	64 Macrocells		77 MHz	16.5862 mm	32
PZ3064D12BP	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS		3.3	Flatpack, Thin Profile, Fine Pitch	Macrocell	2.97 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	64 Macrocells		67 MHz	14 mm	64
PLQ16R6-5A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	BICMOS		5	Chip Carrier	Mixed	4.75 V		75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20			No	Register Preload; Power-Up Reset		118 MHz		2
PLUS105-55A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	TTL		5	Chip Carrier	Registered	4.75 V	1.27 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock		35.7 MHz	11.505 mm	0
PLUS20R4-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL		5	Chip Carrier	Mixed	4.75 V	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Power-Up Reset		74 MHz	11.505 mm	4
PZ5064C7BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS		5	Flatpack, Thin Profile, Fine Pitch	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	64 Macrocells		105 MHz	14 mm	64
PLHS501IA-T	NXP Semiconductors	OT PLD	Industrial	J Bend	52	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	TTL		5	Chip Carrier	Combinatorial	4.5 V	1.27 mm	85 °C (185 °F)	24 Dedicated Inputs, 8 I/O	24	-40 °C (-40 °F)		Quad	S-PQCC-J52	4.57 mm	19.1262 mm	No				19.1262 mm	8
PZ5064CS7BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9 ns	Yes	5.25 V	CMOS		5	Flatpack, Thin Profile, Fine Pitch	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	64 Macrocells		105 MHz	14 mm	64
PLUS16L8DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL		5	Chip Carrier	Combinatorial	4.75 V	1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No				8.965 mm	6
PLC42VA12IA	NXP Semiconductors	OT PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	55 ns	Yes	5.5 V	CMOS		5	Chip Carrier	Macrocell	4.5 V		85 °C (185 °F)	8 Dedicated Inputs, 12 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J28			No	Programmable Multi-Function Pld; Register Preload; Shared Input/Clock		14.9 MHz		12
PLHS501A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	52	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	TTL		5	Chip Carrier	Combinatorial	4.75 V	1.27 mm	75 °C (167 °F)	24 Dedicated Inputs, 8 I/O	24	0 °C (32 °F)		Quad	S-PQCC-J52	4.57 mm	19.1262 mm	No				19.1262 mm	8
PZ5032CS10BC-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS		5	Flatpack, Thin Profile	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No	32 Macrocells		59 MHz	10 mm	32
PLC18V8ZIA-T	NXP Semiconductors	OT PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS		5	Chip Carrier	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz	8.965 mm	8
PZ3064-12BC-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS		3.3	Flatpack, Thin Profile	Macrocell	2.97 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			67 MHz	10 mm	32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.