EE PLD Programmable Logic Devices (PLD) 2,400+

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PZ3064-10A84-T

NXP Semiconductors

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

80 MHz

29.3116 mm

64

P3Z22V10-DD-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

83 MHz

15.4 mm

10

PZ5064NS10BP

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

12 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

64 Macrocells

77 MHz

14 mm

64

PZ5128IS15BB1-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

63 MHz

20 mm

80

PL22V10-12D

NXP Semiconductors

EE PLD

Commercial Extended

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

58.8 MHz

15.4 mm

10

PZ3128IS12A84

NXP Semiconductors

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

66 MHz

29.3116 mm

64

PZ3128AS12BP

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

2.97 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

128 Macrocells

63 MHz

14 mm

80

PZ3128-S12BE-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

3 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

66 MHz

20 mm

96

PZ3032-12A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

19 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

47 MHz

16.5862 mm

32

P5Z22V10-DA

NXP Semiconductors

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

83 MHz

11.5062 mm

10

PZ5064C7BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

9.5 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

64 Macrocells

105 MHz

10 mm

32

PZ3032-8BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

74 MHz

10 mm

32

P5Z22V10IDDH-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

11 ns

Yes

5.5 V

CMOS

5

Small Outline, Thin Profile, Shrink Pitch

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDSO-G24

1.1 mm

4.4 mm

No

74 MHz

7.8 mm

10

PZ5128IS10BE

NXP Semiconductors

EE PLD

Industrial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Flatpack, Low Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

66 MHz

20 mm

96

PZ5064C7A44-T

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

9.5 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

64 Macrocells

105 MHz

16.5862 mm

32

PZ5064I12A68

NXP Semiconductors

EE PLD

Industrial

J Bend

68

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 48 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J68

4.57 mm

24.2316 mm

No

67 MHz

24.2316 mm

48

PZ5128-S7BE-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Flatpack, Low Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

87 MHz

20 mm

96

PZ3064DS12BP

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

13.5 ns

Yes

3.6 V

CMOS

Flatpack, Thin Profile, Fine Pitch

Macrocell

2.7 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

77 MHz

14 mm

64

PZ5128-S12BB2-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

63 MHz

28 mm

96

PZ5064C7BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

9.5 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

64 Macrocells

105 MHz

10 mm

32

PZ5032-10BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

59 MHz

10 mm

32

PZ3064A7A44-T

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

105 MHz

16.5862 mm

32

P5Z22V10-7DH-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

9 ns

Yes

5.25 V

CMOS

5

Small Outline, Thin Profile, Shrink Pitch

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

1.1 mm

4.4 mm

No

103 MHz

7.8 mm

10

PZ5128-S7BP-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

87 MHz

14 mm

80

PZ3064DS10BC

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

11.5 ns

Yes

3.6 V

CMOS

Flatpack, Thin Profile

Macrocell

2.7 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

90 MHz

10 mm

32

PZ3032I12A44-T

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

19 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

47 MHz

16.5862 mm

32

PL22V10I15A

NXP Semiconductors

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

50 MHz

11.505 mm

10

PZ5128IS15BE

NXP Semiconductors

EE PLD

Industrial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Low Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

63 MHz

20 mm

96

PZ5064I10BC-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

12.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

77 MHz

10 mm

32

PZ3128-S15BB1-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

59 MHz

20 mm

80

PZ5064N10A44

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

64 Macrocells

77 MHz

16.5862 mm

32

PZ5064-10A84-T

NXP Semiconductors

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

77 MHz

29.3116 mm

64

P3Z22V10-DD

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

83 MHz

15.4 mm

10

P3Z22V10IBD-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

65 MHz

15.4 mm

10

PZ5032I10A44

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

59 MHz

16.5862 mm

32

CY37384P208-66NI

Infineon Technologies

EE PLD

Industrial

Gull Wing

208

QFP

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

384

CMOS

3.3/5,5 V

Flatpack

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

-40 °C (-40 °F)

Tin/Lead

Quad

S-PQFP-G208

28 mm

No

e0

47.6 MHz

28 mm

Yes

5962-01-382-4960

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

CY37064VP44-83YMB

Infineon Technologies

EE PLD

Military

J Bend

44

QCCJ

Square

Ceramic

15 ns

Yes

64

CMOS

38535Q/M;38534H;883B

3.3

3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-J44

No

e0

Yes

5962-01-379-9524

Infineon Technologies

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

132

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

1

No

e0

100 MHz

10

CY37064VP48-143BAI

Infineon Technologies

EE PLD

Industrial

Ball

48

FBGA

Rectangular

Plastic/Epoxy

8.5 ns

Yes

64

CMOS

3.3

3.3 V

Grid Array, Fine Pitch

BGA48,6X8,32

Programmable Logic Devices

Yes

.8 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Bottom

R-PBGA-B48

No

e0

Yes

CY37064P84-100JI

Infineon Technologies

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

64

CMOS

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Quad

S-PQCC-J84

No

e0

Yes

CY37064VP44-83JI

Infineon Technologies

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

64

CMOS

3.3

3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

Yes

CY37064P44-100AI

Infineon Technologies

EE PLD

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

12 ns

Yes

64

CMOS

3.3/5,5 V

Flatpack

QFP44,.47SQ,32

Programmable Logic Devices

Yes

.8 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G44

No

e0

Yes

5962-01-382-7225

Infineon Technologies

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

132

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

1

No

e0

100 MHz

10

5962-01-302-9835

Infineon Technologies

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

1

No

e0

25 MHz

10

5962-01-382-7255

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

5962-01-302-9836

Infineon Technologies

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

1

No

e0

25 MHz

10

5962-01-394-3671

Infineon Technologies

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

30 ns

No

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.