EE PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR5128C-10VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS			5		Flatpack, Thin Profile, Fine Pitch				Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No			71 MHz				14 mm		80
XCR3128A-12VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	128	CMOS			3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	71 MHz	30 s		240 °C (464 °F)	14 mm	Yes	80
XCR3512XL-12PQ208Q	Xilinx	EE PLD	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V		CMOS			3.3		Flatpack, Fine Pitch				Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 180 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm		180
XCR3064XL-10VQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS			3.3	3/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	14 mm	Yes	68
XCR3256XL-10CS280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	105 MHz	30 s		240 °C (464 °F)	16 mm	Yes	164
XCR22LV10-15PC28I	Xilinx	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS	22	PAL-TYPE	3.3	3.3 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e0	65 MHz		10		11.5062 mm		10
XCR3256XL-10PQG208Q	Xilinx	EE PLD	Automotive	Gull Wing	144	FQFP	Square	Plastic/Epoxy		Yes	3.6 V		CMOS			3.3		Flatpack, Fine Pitch				Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	4.1 mm	28 mm	No		e3					28 mm		164
XCR5064-10PQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS			5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	20 mm	No	64
XCR3384XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	102 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XCR3064-15PC68I	Xilinx	EE PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No			58 MHz				24.2316 mm	No	48
XCR3032XL-5PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	32	CMOS			3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	175 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	36
XCR5032-7VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS			5		Flatpack, Thin Profile				Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			80 MHz				10 mm		32
XCR5032C-7VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	32	CMOS			5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	80 MHz	30 s		240 °C (464 °F)	10 mm	Yes	32
XCR3512XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	97 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XCR3256XL-12FTG256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	256	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	88 MHz	30 s		260 °C (500 °F)	17 mm	Yes	164
TC9808P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	29 ns	No	5.25 V	8	CMOS	18	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function	e0	22 MHz		9		24.6 mm		9
TC9809P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	29 ns	No	5.25 V	8	CMOS	18	PLA-TYPE	5		In-Line				Macrocell	4.75 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function	e0	22 MHz		9		24.6 mm		9
TC9800FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	60 ns	Yes	6 V	8	CMOS	18	PLA-TYPE	5		Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		10 MHz		9		12.8 mm		9
TC9801FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	60 ns	Yes	5.5 V	8	CMOS	18	PLA-TYPE	5		Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		10 MHz		9		12.8 mm		9
TC9802FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	6 V	8	CMOS	18	PLA-TYPE	5		Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e2	14 MHz		9		12.8 mm		9
TC9803P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	5.5 V	8	CMOS	18	PLA-TYPE	5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	14 MHz		9		24.6 mm		9
TC9801P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	60 ns	No	5.5 V	8	CMOS	18	PLA-TYPE	5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	10 MHz		9		24.6 mm		9
TC9802P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	6 V	8	CMOS	18	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	14 MHz		9		24.6 mm		9
TC9807P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	21 ns	No	5.25 V		CMOS	16	PAD-TYPE	5		In-Line				Combinatorial	4.75 V		2.54 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	Zero-Standby Function	e0			12		24.6 mm		10
TC9806P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	21 ns	No	5.25 V		CMOS	16	PAD-TYPE	5		In-Line				Combinatorial	2 V		2.54 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	Zero-Standby Function	e0			12		24.6 mm		10
TC9800P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	60 ns	No	6 V	8	CMOS	18	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	10 MHz		9		24.6 mm		9
TC9807FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	21 ns	Yes	5.25 V		CMOS	16	PAD-TYPE	5		Small Outline				Combinatorial	4.75 V		1.27 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	Zero-Standby Function	e2			12		12.8 mm		10
TC9808FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	29 ns	Yes	5.25 V	8	CMOS	18	PLA-TYPE	5		Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function		22 MHz		9		12.8 mm		9
TC9803FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	8	CMOS	18	PLA-TYPE	5		Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e2	14 MHz		9		12.8 mm		9
TC9809FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	29 ns	Yes	5.25 V	8	CMOS	18	PLA-TYPE	5		Small Outline				Macrocell	4.75 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function		22 MHz		9		12.8 mm		9
TC9804P	Toshiba	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	16	CMOS	22	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	2 Dedicated Inputs, 16 I/O	2	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.45 mm	7.62 mm	No	16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable	e0	12 MHz		16		29.8 mm		16
TC9805P	Toshiba	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	16	CMOS	22	PLA-TYPE	5		In-Line				Macrocell	4.75 V		2.54 mm	85 °C (185 °F)	2 Dedicated Inputs, 16 I/O	2	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.45 mm	7.62 mm	No	16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable	e0	12 MHz		16		29.8 mm		16
TC9806FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	21 ns	Yes	5.25 V		CMOS	16	PAD-TYPE	5		Small Outline				Combinatorial	2 V		1.27 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	Zero-Standby Function				12		12.8 mm		10
CPL16V8-25NC	Samsung	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No			CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	28.5 MHz		8
CPL16V8L-30NLC	Samsung	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	30 ns	Yes			CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	3			No		e0	22.2 MHz		8
CPL16V8-35WC	Samsung	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic		No			CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20	3			No		e0			8
CPL16V8-20NLC	Samsung	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes			CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	3			No		e0	33.3 MHz		8
CPL16V8-35NC	Samsung	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy		No			CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0			8
CPL16V8-25PLC	Samsung	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes			CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	3			No		e0	28.5 MHz		8
CPL16V8-25NLC	Samsung	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes			CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	3			No		e0	28.5 MHz		8
CPL16V8L-30NC	Samsung	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	30 ns	No			CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	22.2 MHz		8
CPL16V8L-25NLC	Samsung	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes			CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	3			No		e0	28.5 MHz		8
CPL16V8-35PLC	Samsung	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy		Yes			CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	3			No		e0			8
CPL16V8-20NC	Samsung	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No			CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	33.3 MHz		8
EPM7512AETC144-7N	Altera	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	512	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 120 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e3	116.3 MHz	30 s		260 °C (500 °F)	20 mm	Yes	120
EPM7064TI44-7	Altera	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	64	CMOS			5	5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	64 Macrocells	e0	166.7 MHz			220 °C (428 °F)	10 mm	No	36
EPM7512BUI169-5	Altera	EE PLD		Ball	169	FBGA	Square	Plastic/Epoxy	5 ns	Yes		512	CMOS				1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes				.8 mm					Tin Lead	Bottom	S-PBGA-B169				No		e0				220 °C (428 °F)		Yes
EPM7128SQI160-10	Altera	EE PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	128	CMOS			5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz	20 s		220 °C (428 °F)	28 mm	Yes	100

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.