EE PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR3384XL-10FTG256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	102 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XCR3032XL-10PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS			3.3	3/3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	e0	95 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	36
XCR3064XL-7CSG48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 40 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	e1	119 MHz	30 s		260 °C (500 °F)	7 mm	Yes	40
XCR3032A-7VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS			3		Flatpack, Thin Profile				Macrocell	2.7 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e0	95 MHz	30 s		240 °C (464 °F)	10 mm		32
XCR3128XL-6VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	128	CMOS			3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e4	175 MHz				14 mm	Yes	84
XCR5128C-10VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS			5		Flatpack, Thin Profile, Fine Pitch				Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No		71 MHz				14 mm		80
XCR3128A-12VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	128	CMOS			3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e0	71 MHz	30 s		240 °C (464 °F)	14 mm	Yes	80
XCR3512XL-12PQ208Q	Xilinx	EE PLD	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V		CMOS			3.3		Flatpack, Fine Pitch				Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 180 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e0		30 s		225 °C (437 °F)	28 mm		180
XCR3064XL-10VQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS			3.3	3/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e0	95 MHz	30 s		240 °C (464 °F)	14 mm	Yes	68
XCR3256XL-10CS280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	e0	105 MHz	30 s		240 °C (464 °F)	16 mm	Yes	164
XCR22LV10-15PC28I	Xilinx	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS	22	PAL-TYPE	3.3	3.3 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	e0	65 MHz		10		11.5062 mm		10
XCR3256XL-10PQG208Q	Xilinx	EE PLD	Automotive	Gull Wing	144	FQFP	Square	Plastic/Epoxy		Yes	3.6 V		CMOS			3.3		Flatpack, Fine Pitch				Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	4.1 mm	28 mm	No	e3					28 mm		164
XCR5064-10PQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS			5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	e0	77 MHz	30 s		225 °C (437 °F)	20 mm	No	64
XCR3384XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	102 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XCR3064-15PC68I	Xilinx	EE PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No		58 MHz				24.2316 mm	No	48
XCR3032XL-5PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	32	CMOS			3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	e0	175 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	36
XCR5032-7VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS			5		Flatpack, Thin Profile				Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No		80 MHz				10 mm		32
XCR5032C-7VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	32	CMOS			5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e0	80 MHz	30 s		240 °C (464 °F)	10 mm	Yes	32
XCR3512XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	97 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XCR3256XL-12FTG256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	256	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	88 MHz	30 s		260 °C (500 °F)	17 mm	Yes	164
XCR3064XL-10CP56I	Xilinx	EE PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS			3.3	3/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 48 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	e0	95 MHz	30 s		240 °C (464 °F)	6 mm	Yes	48
XCR3128-12PC84I	Xilinx	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.63 V	128	CMOS			3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	e0	69 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	64
XCR3064-15PC84I	Xilinx	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	e0	58 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	64
XCR3064XL-7VQG100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e3	119 MHz	30 s		260 °C (500 °F)	14 mm	Yes	68
XCR3384XL-7.5CSG280C	Xilinx	EE PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS			3.3		Grid Array, Thin Profile, Fine Pitch				Macrocell	3 V		.8 mm	70 °C (158 °F)	216 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	e1					16 mm		216
XCR3064XL-6CPG56C	Xilinx	EE PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 48 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	e1	192 MHz	30 s		260 °C (500 °F)	6 mm	Yes	48
XCR5032C-7VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	32	CMOS			5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e0	91 MHz	30 s		240 °C (464 °F)	10 mm	Yes	32
XCR3128-12VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	3.63 V	128	CMOS			3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e0	66 MHz	30 s		240 °C (464 °F)	14 mm	Yes	80
XCR5128-10PQ160C	Xilinx	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	128	CMOS			5	5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 95 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	e0	71 MHz	30 s		225 °C (437 °F)	28 mm	Yes	95
XCR3512XL-7FTG256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	512	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	135 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XCR3384XL-7.5CS280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS			3.3		Grid Array, Thin Profile, Fine Pitch				Macrocell	2.7 V		.8 mm	85 °C (185 °F)	216 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	e0					16 mm		216
XCR3064XL-10CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 40 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	e0	95 MHz	30 s		240 °C (464 °F)	7 mm	Yes	40
XCR3128-12PQ160C	Xilinx	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	12 ns	Yes	3.63 V	128	CMOS			3.3	3.3 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	e0	66 MHz	30 s		225 °C (437 °F)	28 mm	Yes	96
XCR3256XL-12PQG208C	Xilinx	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	256	CMOS			3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e3	88 MHz	30 s		245 °C (473 °F)	28 mm	Yes	164
XCR3384XL-7.5CSG280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS			3.3		Grid Array, Thin Profile, Fine Pitch				Macrocell	2.7 V		.8 mm	85 °C (185 °F)	216 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	e1					16 mm		216
XCR3064-12PQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	2.97 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	e0	67 MHz	30 s		225 °C (437 °F)	20 mm	No	64
XCR3128XL-7CS144C	Xilinx	EE PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS			3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	e0	119 MHz	30 s		240 °C (464 °F)	12 mm	Yes	108
XCR5032-7PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS			5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No		80 MHz				16.5862 mm		32
XCR3064XL-7VQG100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e3	119 MHz	30 s		260 °C (500 °F)	14 mm	Yes	68
XCR3256XL-10FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	105 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XCR3064XL-10CPG56C	Xilinx	EE PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 48 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	e1	95 MHz	30 s		260 °C (500 °F)	6 mm	Yes	48
XCR5032C-7PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	32	CMOS			5	5 V	Chip Carrier	QFP44,.5SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	e0	91 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XCR3064A-12CP56I	Xilinx	EE PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	64	CMOS			3	3/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 44 I/O	2	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	e0	77 MHz	30 s		240 °C (464 °F)	6 mm	Yes	44
XCR3128A-15TQ128I	Xilinx	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	128	CMOS			3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.63X.87,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128	1	1.6 mm	14 mm	No		77 MHz				20 mm	Yes	96
XCR22V10-10VO24I	Xilinx	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS			5		Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		1.2 mm	4.4 mm	No		74 MHz				7.8 mm		10
XCR3256XL-10PQ208C	Xilinx	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e4	105 MHz				28 mm	Yes	164
XCR3384XL-10TQ144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS			3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 118 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e4	102 MHz				20 mm	Yes	118
XCR3512XL-10FGG324I	Xilinx	EE PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS			3.3	3/3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 260 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No	e1	97 MHz	30 s		250 °C (482 °F)	23 mm	Yes	260

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.