EE PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR3256XL-10TQG144Q	Xilinx	EE PLD	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V		CMOS	3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 120 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3				20 mm		120
XCR5064C-10VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	64	CMOS	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e0	77 MHz	30 s	240 °C (464 °F)	10 mm	Yes	32
XCR5064C-7VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	64	CMOS	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e0	105 MHz	30 s	240 °C (464 °F)	14 mm	Yes	64
XCR3032XL-5CSG48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	32	CMOS	3.3	3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	e1	213 MHz	30 s	260 °C (500 °F)	7 mm	Yes	36
XCR3128XL-10TQ144Q	Xilinx	EE PLD	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	128	CMOS	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e0	95 MHz	30 s	225 °C (437 °F)	20 mm	Yes	108
XCR3032C-10VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.63 V	32	CMOS	3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.97 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e0	58.8 MHz	30 s	240 °C (464 °F)	10 mm	Yes	32
XCR3032-10PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.6 V		CMOS	3.3		Chip Carrier				Macrocell	3 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 33 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No		58.8 MHz			16.5862 mm		33
XCR3128-12TQ128I	Xilinx	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.63 V	128	CMOS	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.63X.87,20	Programmable Logic Devices	Yes	Macrocell	2.97 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No		69 MHz			20 mm	Yes	96
XCR3128XL-10VQG100Q	Xilinx	EE PLD	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS	3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e3	95 MHz	30 s	260 °C (500 °F)	14 mm		84
XCR5128-12PC84C	Xilinx	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	5.25 V	128	CMOS	5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	e0	63 MHz	30 s	225 °C (437 °F)	29.3116 mm	Yes	64
XCR3128XL-7CS144I	Xilinx	EE PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS	3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	e0	119 MHz	30 s	240 °C (464 °F)	12 mm	Yes	108
XCR5064-10PC84C	Xilinx	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS	5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	e0	77 MHz	30 s	225 °C (437 °F)	29.3116 mm	No	64
XCR3384XL-12FG324C	Xilinx	EE PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS	3.3	3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 220 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No	e0	83 MHz	30 s	225 °C (437 °F)	23 mm	Yes	220
XCR3256XL-7TQG144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	256	CMOS	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 120 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	154 MHz	30 s	260 °C (500 °F)	20 mm	Yes	120
XCR3512XL-10FGG324C	Xilinx	EE PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS	3.3	3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 260 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No	e1	97 MHz	30 s	250 °C (482 °F)	23 mm	Yes	260
XCR3384XL-10FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS	3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	102 MHz	30 s	225 °C (437 °F)	17 mm	Yes	212
XCR5032-10VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS	5		Flatpack, Thin Profile				Macrocell	4.75 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No		59 MHz			10 mm		32
XCR5128-10PQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.25 V	128	CMOS	5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	e0	71 MHz	30 s	225 °C (437 °F)	20 mm	Yes	80
XCR3032C-12VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12 ns	Yes	3.63 V	32	CMOS	3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.97 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e0	47 MHz	30 s	240 °C (464 °F)	10 mm	Yes	32
XCR3064XL-6PCG44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	64	CMOS	3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	e3	145 MHz	30 s	245 °C (473 °F)	16.5862 mm	Yes	36
XCR3256XL-12FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	256	CMOS	3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	88 MHz	30 s	260 °C (500 °F)	17 mm	Yes	164
XCR3032-12PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS	3.3		Chip Carrier				Macrocell	3 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 33 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No		47 MHz			16.5862 mm		33
XCR5128-10PC84C	Xilinx	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	128	CMOS	5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	e0	71 MHz	30 s	225 °C (437 °F)	29.3116 mm	Yes	64
XCR3064XL-6CS48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	64	CMOS	3.3	3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 40 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	e0	192 MHz	30 s	240 °C (464 °F)	7 mm	Yes	40
XCR3064-15PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	64	CMOS	3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	2.97 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	e0	58 MHz	30 s	225 °C (437 °F)	16.5862 mm	No	32
XCR3032XL-7VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS	3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e4	119 MHz			10 mm	Yes	36
XCR3384XL-12PQ208Q	Xilinx	EE PLD	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 172 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e0	87 MHz	30 s	225 °C (437 °F)	28 mm	Yes	172
XCR3256XL-7.5PQG208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS	3.3		Flatpack, Fine Pitch				Macrocell	2.7 V	.5 mm	85 °C (185 °F)	160 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e3	167 MHz			28 mm		160
XCR3512XL-10FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS	3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	97 MHz	30 s	225 °C (437 °F)	17 mm	Yes	212
XCR3256XL-10PQ208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS	3.3	3/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e4	105 MHz			28 mm	Yes	164
XCR3064A-12VQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	64	CMOS	3	3/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e0	77 MHz	30 s	240 °C (464 °F)	14 mm	Yes	64
XCR3064XL-10PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS	3.3	3/3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	e0	95 MHz	30 s	225 °C (437 °F)	16.5862 mm	Yes	36
XCR22LV10-10SO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS	3.3		Small Outline				Macrocell	3 V	1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		125 MHz			15.4 mm		10
XCR3256XL-7.5CSG280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS	3.3		Grid Array, Thin Profile, Fine Pitch				Macrocell	2.7 V	.8 mm	85 °C (185 °F)	160 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	e1	167 MHz			16 mm		160
XCR5064C-10VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e0	80 MHz	30 s	240 °C (464 °F)	10 mm	Yes	32
XCR5128-10VQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	128	CMOS	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e0	66 MHz	30 s	240 °C (464 °F)	14 mm	Yes	80
XCR3064XL-7VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e4	119 MHz			14 mm	Yes	68
XCR3256XL-10TQ144Q	Xilinx	EE PLD	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V		CMOS	3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 120 I/O	0	-40 °C (-40 °F)	Nickel/Palladium/Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e4				20 mm		120
XCR3384XL-12FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	83 MHz	30 s	225 °C (437 °F)	17 mm	Yes	212
XCR5128-10PC84I	Xilinx	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	128	CMOS	5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	e0	66 MHz	30 s	225 °C (437 °F)	29.3116 mm	Yes	64
XCR3512XL-12FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	512	CMOS	3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	77 MHz	30 s	225 °C (437 °F)	17 mm	Yes	212
XCR3128XL-10CS144C	Xilinx	EE PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	128	CMOS	3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	e0	95 MHz	30 s	240 °C (464 °F)	12 mm	Yes	108
XCR22LV10-15SO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS	3.3		Small Outline				Macrocell	3 V	1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		95 MHz			15.4 mm		10
XCR3256XL-7.5CS280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS	3.3		Grid Array, Thin Profile, Fine Pitch				Macrocell	2.7 V	.8 mm	85 °C (185 °F)	160 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	e0	167 MHz			16 mm		160
XCR3064XL-6VQG100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	64	CMOS	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e3	192 MHz	30 s	260 °C (500 °F)	14 mm	Yes	68
XCR3256XL-7TQ144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	256	CMOS	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 120 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e4	154 MHz			20 mm	Yes	120
XCR3032A-7VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS	3		Flatpack, Thin Profile				Macrocell	2.7 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e0	95 MHz	30 s	240 °C (464 °F)	10 mm		32
XCR3128XL-6VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	128	CMOS	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e4	175 MHz			14 mm	Yes	84

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.