OT PLD Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

SLG46826V

Renesas Electronics

OT PLD

No Lead

20

VQCCN

Rectangular

Yes

5.5 V

19

13

PLA-TYPE

2.5

Chip Carrier, Very Thin Profile

LCC20,.08X.12,16

Yes

Macrocell

2.3 V

.4 mm

85 °C (185 °F)

0 Dedicated Inputs, 13 I/O

0

-40 °C (-40 °F)

Quad

R-XQCC-N20

1

.6 mm

2 mm

15

3 mm

No

13

SLG46826VTR

Renesas Electronics

OT PLD

No Lead

20

VQCCN

Rectangular

Yes

5.5 V

19

13

PLA-TYPE

2.5

Box, Tape and Reel, 7 in

Chip Carrier, Very Thin Profile

LCC20,.08X.12,16

Yes

Macrocell

2.3 V

.4 mm

85 °C (185 °F)

0 Dedicated Inputs, 13 I/O

0

-40 °C (-40 °F)

Quad

R-XQCC-N20

.6 mm

2 mm

15

3 mm

No

13

SLG46826G

Renesas Electronics

OT PLD

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

5.5 V

19

13

PLA-TYPE

2.5

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Yes

Macrocell

2.3 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 13 I/O

0

-40 °C (-40 °F)

Dual

R-PDSO-G20

1

1.2 mm

4.4 mm

15

6.5 mm

No

13

PAL16R4AMFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

8

8.89 mm

No

4

SLG46824G

Renesas Electronics

OT PLD

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

5.5 V

19

13

PLA-TYPE

2.5

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Yes

Macrocell

2.3 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 13 I/O

0

-40 °C (-40 °F)

Dual

R-PDSO-G20

1

1.2 mm

4.4 mm

15

6.5 mm

No

13

5962-8867005LA

Defense Logistics Agency

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

Yes

e0

50 MHz

10

SLG46110V

Renesas Electronics

OT PLD

No Lead

12

VQCCN

Square

Yes

1.89 V

7

8

PLA-TYPE

1.8

Chip Carrier, Very Thin Profile

LCC12,.06SQ,16

No

Macrocell

1.71 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 7 I/O

1

-40 °C (-40 °F)

Quad

S-XQCC-N12

1

.6 mm

1.6 mm

Can also operate at 3.3 V or 5 V supply

7

1.6 mm

No

7

SLG46120V

Renesas Electronics

OT PLD

No Lead

12

VQCCN

Square

Yes

1.89 V

12

10

PLA-TYPE

1.8

Chip Carrier

LCC12,.06SQ,16

No

Macrocell

1.71 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 9 I/O

1

-40 °C (-40 °F)

Quad

S-XQCC-N12

1

.6 mm

1.6 mm

Can also operate at 3.3 V or 5 V supply

9

1.6 mm

No

9

SLG46121V

Renesas Electronics

OT PLD

No Lead

12

VQCCN

Square

Yes

1.89 V

12

9

PLA-TYPE

1.8

Chip Carrier, Very Thin Profile

LCC12,.06SQ,16

No

Macrocell

1.71 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 8 I/O

1

-40 °C (-40 °F)

Quad

S-XQCC-N12

1

.6 mm

1.6 mm

Can also operate at 3.3 V or 5 V supply

8

1.6 mm

No

8

SLG46620-AG

Renesas Electronics

OT PLD

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

3.6 V

1

AEC-Q100

18

PLA-TYPE

3.3

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

No

Macrocell

1.71 V

.65 mm

105 °C (221 °F)

1 Dedicated Inputs, 17 I/O

1

-40 °C (-40 °F)

Dual

R-PDSO-G20

1

1.2 mm

4.4 mm

17

6.5 mm

No

17

SLG46620G

Renesas Electronics

OT PLD

1

SLG46855VTR

Renesas Electronics

OT PLD

No Lead

14

VQCCN

Rectangular

Yes

5.5 V

15

11

PLA-TYPE

2.5

Tape and Reel, 7 in

Chip Carrier, Very Thin Profile

LCC14,.06X.08,16

No

Macrocell

2.3 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 10 I/O

1

-40 °C (-40 °F)

Quad

R-XQCC-N14

.6 mm

1.6 mm

11

2 mm

No

11

SLG47004V

Renesas Electronics

OT PLD

No Lead

24

VQCCN

Square

Yes

5.5 V

20

8

PLA-TYPE

2.5

Chip Carrier, Very Thin Profile

LCC24,.12SQ,16

Yes

Macrocell

2.4 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 7 I/O

1

-40 °C (-40 °F)

Quad

S-XQCC-N24

1

.6 mm

3 mm

7

3 mm

No

7

SLG46855V

Renesas Electronics

OT PLD

No Lead

14

VQCCN

Rectangular

Yes

5.5 V

15

11

PLA-TYPE

2.5

Chip Carrier, Very Thin Profile

LCC14,.06X.08,16

No

Macrocell

2.3 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 10 I/O

1

-40 °C (-40 °F)

Quad

R-XQCC-N14

1

.6 mm

1.6 mm

11

2 mm

No

11

TICPAL22V10Z-25CNT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

132

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T24

5.08 mm

7.62 mm

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

e4

31.2 MHz

10

31.64 mm

10

PML2552-35KA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

68

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

9 Dedicated Inputs, 24 I/O

9

0 °C (32 °F)

Quad

S-CQCC-J68

4.83 mm

24.065 mm

No

50 MHz

24.065 mm

24

JM38510/50601BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

MIL-M-38510 Class B

16

PAL-TYPE

5

Tube

In-Line

No

Combinatorial

4.75 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

6.92 mm

No

e0

40 MHz

8

24.2 mm

No

6

SLG46534V

Renesas Electronics

OT PLD

No Lead

14

VQCCN

Rectangular

Yes

1.89 V

19

12

PLA-TYPE

1.8

Chip Carrier, Very Thin Profile

LCC14,.08X.09,16

No

Macrocell

1.71 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 11 I/O

1

-40 °C (-40 °F)

Quad

R-XQCC-N14

1

.6 mm

2 mm

Can also operate at 3.3 V or 5 V supply

11

2.2 mm

No

11

SLG46534VTR

Renesas Electronics

OT PLD

No Lead

14

VQCCN

Rectangular

Yes

1.89 V

19

12

PLA-TYPE

1.8

Box, Tape and Reel, 7 in

Chip Carrier, Very Thin Profile

LCC14,.08X.09,16

No

Macrocell

1.71 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 11 I/O

1

-40 °C (-40 °F)

Quad

R-XQCC-N14

.6 mm

2 mm

Can also operate at 3.3 V or 5 V supply

11

2.2 mm

No

11

SLG46537M

Renesas Electronics

OT PLD

1

SLG46537MTR

Renesas Electronics

OT PLD

1

SLG46537V

Renesas Electronics

OT PLD

1

SLG46537VTR

Renesas Electronics

OT PLD

1

5962-8867002LA

Defense Logistics Agency

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

Yes

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

e0

25 MHz

31.877 mm

10

TIBPAL16L8-25CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

TTL

MIL-STD-883

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

e4

30 MHz

8

25.4 mm

6

SLG46538V

Renesas Electronics

OT PLD

No Lead

20

HVQCCN

Rectangular

Yes

1.89 V

17

17

PLA-TYPE

1.8

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.08X.12,16

No

Macrocell

1.71 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 16 I/O

1

-40 °C (-40 °F)

Quad

R-XQCC-N20

.6 mm

2 mm

Can also operate at 3.3 V or 5 V supply

16

3 mm

No

16

SLG46811V

Renesas Electronics

OT PLD

1

SLG46880-AP

Renesas Electronics

OT PLD

No Lead

32

HVQCCN

Square

Yes

5.5 V

12

AEC-Q100

20

2.5

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

No

Macrocell

2.3 V

.5 mm

125 °C (257 °F)

8 Dedicated Inputs, 12 I/O

8

-40 °C (-40 °F)

Quad

S-XQCC-N32

.8 mm

5 mm

20

5 mm

No

12

SLG46880V

Renesas Electronics

OT PLD

No Lead

32

HVQCCN

Square

Yes

5.5 V

12

18

PLA-TYPE

2.5

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.16SQ,16

No

Macrocell

2.3 V

.4 mm

85 °C (185 °F)

2 Dedicated Inputs, 12 I/O

2

-40 °C (-40 °F)

Quad

S-XQCC-N32

1

.6 mm

4 mm

20

4 mm

No

12

SLG46880VTR

Renesas Electronics

OT PLD

No Lead

32

HVQCCN

Square

Yes

5.5 V

12

18

PLA-TYPE

2.5

Box, Tape and Reel, 13 in

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.16SQ,16

No

Macrocell

2.3 V

.4 mm

85 °C (185 °F)

2 Dedicated Inputs, 12 I/O

2

-40 °C (-40 °F)

Quad

S-XQCC-N32

1

.6 mm

4 mm

20

4 mm

No

12

JM38510/50401BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

TTL

MIL-M-38510 Class B

5

In-Line

Combinatorial

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

No

e0

JM38510/50605BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-M-38510 Class B

16

PAL-TYPE

5

Tube

In-Line

No

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.2 mm

No

6

JM38510/50606BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

MIL-M-38510 Class B

8

PAL-TYPE

5

Tube

In-Line

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.2 mm

No

0

PAL16L8AMJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.195 mm

No

6

SLG46538M

Renesas Electronics

OT PLD

No Lead

22

HVQCCN

Rectangular

Yes

1.89 V

17

17

PLA-TYPE

1.8

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC22,.08X.09,16

No

Macrocell

1.71 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 16 I/O

1

-40 °C (-40 °F)

Quad

R-XQCC-N22

.6 mm

2 mm

Can also operate at 3.3 V or 5 V supply

16

2.2 mm

No

16

SLG46580V

Renesas Electronics

OT PLD

No Lead

20

VQCCN

Rectangular

Yes

5.5 V

15

9

PLA-TYPE

3.3

Chip Carrier, Very Thin Profile

LCC20,.08X.12,16

No

Macrocell

2.3 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 8 I/O

1

-40 °C (-40 °F)

Quad

R-XQCC-N20

.6 mm

2 mm

8

3 mm

No

8

SLG46580VTR

Renesas Electronics

OT PLD

No Lead

20

VQCCN

Rectangular

Yes

5.5 V

15

9

PLA-TYPE

3.3

Box, Tape and Reel, 7 in

Chip Carrier, Very Thin Profile

LCC20,.08X.12,16

No

Macrocell

2.3 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 8 I/O

1

-40 °C (-40 °F)

Quad

R-XQCC-N20

.6 mm

2 mm

8

3 mm

No

8

SLG46620V

Renesas Electronics

OT PLD

1

SLG46827-AG

Renesas Electronics

OT PLD

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

5.5 V

19

AEC-Q100

13

PLA-TYPE

3.3

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

No

Macrocell

2.3 V

.65 mm

105 °C (221 °F)

0 Dedicated Inputs, 13 I/O

0

-40 °C (-40 °F)

Dual

R-PDSO-G20

1

1.2 mm

4.4 mm

15

6.5 mm

No

13

8103610SA

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

40 ns

Yes

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.54 mm

6.92 mm

Yes

e0

25 MHz

8

13.09 mm

No

4

EPM5032JC

Intel

OT PLD

Commercial

J Bend

28

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

32

CMOS

24

PAL-TYPE

5

No

Macrocell

4.75 V

320

70 °C (158 °F)

7 Dedicated Inputs, 16 I/O

7

0 °C (32 °F)

Quad

S-XQCC-J28

50 MHz

16

No

16

EPM5032LC-15

Altera

OT PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

24

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

320

1.27 mm

70 °C (158 °F)

7 Dedicated Inputs, 16 I/O

7

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock

e0

76.9 MHz

16

220 °C (428 °F)

16

EPM5032LC-20

Altera

OT PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

CMOS

24

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

320

1.27 mm

70 °C (158 °F)

7 Dedicated Inputs, 16 I/O

7

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock

e0

62.5 MHz

16

220 °C (428 °F)

16

EPM5032PC-15

Altera

OT PLD

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

24

PAL-TYPE

5

5 V

In-Line

DIP28,.3

Programmable Logic Devices

Macrocell

4.75 V

320

2.54 mm

70 °C (158 °F)

7 Dedicated Inputs, 16 I/O

7

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock

e0

76.9 MHz

30 s

16

220 °C (428 °F)

16

EPM5032PC-20

Altera

OT PLD

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

20 ns

No

5.25 V

CMOS

24

PAL-TYPE

5

5 V

In-Line

DIP28,.3

Programmable Logic Devices

Macrocell

4.75 V

320

2.54 mm

70 °C (158 °F)

7 Dedicated Inputs, 16 I/O

7

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

No

Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock

e0

62.5 MHz

16

220 °C (428 °F)

16

JM38510/50604BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.25 V

TTL

MIL-M-38510 Class B

12

PAL-TYPE

5

Tube

In-Line

No

Mixed

4.75 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

6.92 mm

No

e0

40 MHz

8

24.2 mm

No

4

M38510/50504BLA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

5.25 V

Bipolar

MIL-M-38510 Class B

16

PAL-TYPE

5

Tube

5 V

In-Line

DIP24,.3

Programmable Logic Devices

No

Mixed

4.75 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

6.92 mm

Yes

e0

40 MHz

8

32 mm

No

4

SLG46108V

Renesas Electronics

OT PLD

No Lead

8

VQCCN

Rectangular

Yes

1.89 V

7

6

PLA-TYPE

1.8

Chip Carrier, Very Thin Profile

LCC8,.039X.047,16

No

Macrocell

1.71 V

.4 mm

85 °C (185 °F)

1 Dedicated Inputs, 5 I/O

1

-40 °C (-40 °F)

Quad

R-XQCC-N8

1

.6 mm

1 mm

Can also operate at 3.3 V or 5 V supply

5

1.2 mm

No

5

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.