Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
OT PLD |
No Lead |
20 |
VQCCN |
Rectangular |
Yes |
5.5 V |
19 |
13 |
PLA-TYPE |
2.5 |
Chip Carrier, Very Thin Profile |
LCC20,.08X.12,16 |
Yes |
Macrocell |
2.3 V |
.4 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 13 I/O |
0 |
-40 °C (-40 °F) |
Quad |
R-XQCC-N20 |
1 |
.6 mm |
2 mm |
15 |
3 mm |
No |
13 |
||||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
20 |
VQCCN |
Rectangular |
Yes |
5.5 V |
19 |
13 |
PLA-TYPE |
2.5 |
Box, Tape and Reel, 7 in |
Chip Carrier, Very Thin Profile |
LCC20,.08X.12,16 |
Yes |
Macrocell |
2.3 V |
.4 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 13 I/O |
0 |
-40 °C (-40 °F) |
Quad |
R-XQCC-N20 |
.6 mm |
2 mm |
15 |
3 mm |
No |
13 |
||||||||||||||||||
|
Renesas Electronics |
OT PLD |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
5.5 V |
19 |
13 |
PLA-TYPE |
2.5 |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Yes |
Macrocell |
2.3 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 13 I/O |
0 |
-40 °C (-40 °F) |
Dual |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
15 |
6.5 mm |
No |
13 |
|||||||||||||||||
Texas Instruments |
OT PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
30 ns |
Yes |
5.5 V |
TTL |
38535Q/M;38534H;883B |
12 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LCC20,.35SQ |
Programmable Logic Devices |
No |
Mixed |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
2.03 mm |
8.89 mm |
No |
e0 |
25 MHz |
8 |
8.89 mm |
No |
4 |
||||||||
|
Renesas Electronics |
OT PLD |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
5.5 V |
19 |
13 |
PLA-TYPE |
2.5 |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Yes |
Macrocell |
2.3 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 13 I/O |
0 |
-40 °C (-40 °F) |
Dual |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
15 |
6.5 mm |
No |
13 |
|||||||||||||||||
Defense Logistics Agency |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
Yes |
e0 |
50 MHz |
10 |
||||||||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
12 |
VQCCN |
Square |
Yes |
1.89 V |
7 |
8 |
PLA-TYPE |
1.8 |
Chip Carrier, Very Thin Profile |
LCC12,.06SQ,16 |
No |
Macrocell |
1.71 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 7 I/O |
1 |
-40 °C (-40 °F) |
Quad |
S-XQCC-N12 |
1 |
.6 mm |
1.6 mm |
Can also operate at 3.3 V or 5 V supply |
7 |
1.6 mm |
No |
7 |
|||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
12 |
VQCCN |
Square |
Yes |
1.89 V |
12 |
10 |
PLA-TYPE |
1.8 |
Chip Carrier |
LCC12,.06SQ,16 |
No |
Macrocell |
1.71 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 9 I/O |
1 |
-40 °C (-40 °F) |
Quad |
S-XQCC-N12 |
1 |
.6 mm |
1.6 mm |
Can also operate at 3.3 V or 5 V supply |
9 |
1.6 mm |
No |
9 |
|||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
12 |
VQCCN |
Square |
Yes |
1.89 V |
12 |
9 |
PLA-TYPE |
1.8 |
Chip Carrier, Very Thin Profile |
LCC12,.06SQ,16 |
No |
Macrocell |
1.71 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 8 I/O |
1 |
-40 °C (-40 °F) |
Quad |
S-XQCC-N12 |
1 |
.6 mm |
1.6 mm |
Can also operate at 3.3 V or 5 V supply |
8 |
1.6 mm |
No |
8 |
|||||||||||||||||
|
Renesas Electronics |
OT PLD |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
3.6 V |
1 |
AEC-Q100 |
18 |
PLA-TYPE |
3.3 |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
No |
Macrocell |
1.71 V |
.65 mm |
105 °C (221 °F) |
1 Dedicated Inputs, 17 I/O |
1 |
-40 °C (-40 °F) |
Dual |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
17 |
6.5 mm |
No |
17 |
||||||||||||||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
14 |
VQCCN |
Rectangular |
Yes |
5.5 V |
15 |
11 |
PLA-TYPE |
2.5 |
Tape and Reel, 7 in |
Chip Carrier, Very Thin Profile |
LCC14,.06X.08,16 |
No |
Macrocell |
2.3 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 10 I/O |
1 |
-40 °C (-40 °F) |
Quad |
R-XQCC-N14 |
.6 mm |
1.6 mm |
11 |
2 mm |
No |
11 |
||||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
24 |
VQCCN |
Square |
Yes |
5.5 V |
20 |
8 |
PLA-TYPE |
2.5 |
Chip Carrier, Very Thin Profile |
LCC24,.12SQ,16 |
Yes |
Macrocell |
2.4 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 7 I/O |
1 |
-40 °C (-40 °F) |
Quad |
S-XQCC-N24 |
1 |
.6 mm |
3 mm |
7 |
3 mm |
No |
7 |
||||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
14 |
VQCCN |
Rectangular |
Yes |
5.5 V |
15 |
11 |
PLA-TYPE |
2.5 |
Chip Carrier, Very Thin Profile |
LCC14,.06X.08,16 |
No |
Macrocell |
2.3 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 10 I/O |
1 |
-40 °C (-40 °F) |
Quad |
R-XQCC-N14 |
1 |
.6 mm |
1.6 mm |
11 |
2 mm |
No |
11 |
||||||||||||||||||
|
Texas Instruments |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock |
e4 |
31.2 MHz |
10 |
31.64 mm |
10 |
||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
68 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Mixed |
4.75 V |
1.27 mm |
75 °C (167 °F) |
9 Dedicated Inputs, 24 I/O |
9 |
0 °C (32 °F) |
Quad |
S-CQCC-J68 |
4.83 mm |
24.065 mm |
No |
50 MHz |
24.065 mm |
24 |
||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
TTL |
MIL-M-38510 Class B |
16 |
PAL-TYPE |
5 |
Tube |
In-Line |
No |
Combinatorial |
4.75 V |
64 |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
6.92 mm |
No |
e0 |
40 MHz |
8 |
24.2 mm |
No |
6 |
|||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
14 |
VQCCN |
Rectangular |
Yes |
1.89 V |
19 |
12 |
PLA-TYPE |
1.8 |
Chip Carrier, Very Thin Profile |
LCC14,.08X.09,16 |
No |
Macrocell |
1.71 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 11 I/O |
1 |
-40 °C (-40 °F) |
Quad |
R-XQCC-N14 |
1 |
.6 mm |
2 mm |
Can also operate at 3.3 V or 5 V supply |
11 |
2.2 mm |
No |
11 |
|||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
14 |
VQCCN |
Rectangular |
Yes |
1.89 V |
19 |
12 |
PLA-TYPE |
1.8 |
Box, Tape and Reel, 7 in |
Chip Carrier, Very Thin Profile |
LCC14,.08X.09,16 |
No |
Macrocell |
1.71 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 11 I/O |
1 |
-40 °C (-40 °F) |
Quad |
R-XQCC-N14 |
.6 mm |
2 mm |
Can also operate at 3.3 V or 5 V supply |
11 |
2.2 mm |
No |
11 |
|||||||||||||||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
Defense Logistics Agency |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
Yes |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
25 MHz |
31.877 mm |
10 |
|||||||||||||||||
|
Texas Instruments |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
TTL |
MIL-STD-883 |
16 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Combinatorial |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDIP-T20 |
5.08 mm |
7.62 mm |
No |
e4 |
30 MHz |
8 |
25.4 mm |
6 |
||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
20 |
HVQCCN |
Rectangular |
Yes |
1.89 V |
17 |
17 |
PLA-TYPE |
1.8 |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.08X.12,16 |
No |
Macrocell |
1.71 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 16 I/O |
1 |
-40 °C (-40 °F) |
Quad |
R-XQCC-N20 |
.6 mm |
2 mm |
Can also operate at 3.3 V or 5 V supply |
16 |
3 mm |
No |
16 |
||||||||||||||||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
32 |
HVQCCN |
Square |
Yes |
5.5 V |
12 |
AEC-Q100 |
20 |
2.5 |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
No |
Macrocell |
2.3 V |
.5 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 12 I/O |
8 |
-40 °C (-40 °F) |
Quad |
S-XQCC-N32 |
.8 mm |
5 mm |
20 |
5 mm |
No |
12 |
|||||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
32 |
HVQCCN |
Square |
Yes |
5.5 V |
12 |
18 |
PLA-TYPE |
2.5 |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.16SQ,16 |
No |
Macrocell |
2.3 V |
.4 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 12 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-XQCC-N32 |
1 |
.6 mm |
4 mm |
20 |
4 mm |
No |
12 |
||||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
32 |
HVQCCN |
Square |
Yes |
5.5 V |
12 |
18 |
PLA-TYPE |
2.5 |
Box, Tape and Reel, 13 in |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.16SQ,16 |
No |
Macrocell |
2.3 V |
.4 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 12 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-XQCC-N32 |
1 |
.6 mm |
4 mm |
20 |
4 mm |
No |
12 |
|||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
TTL |
MIL-M-38510 Class B |
5 |
In-Line |
Combinatorial |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
No |
e0 |
||||||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
TTL |
MIL-M-38510 Class B |
16 |
PAL-TYPE |
5 |
Tube |
In-Line |
No |
Combinatorial |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
e0 |
25 MHz |
8 |
24.2 mm |
No |
6 |
|||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.5 V |
TTL |
MIL-M-38510 Class B |
8 |
PAL-TYPE |
5 |
Tube |
In-Line |
No |
Registered |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
e0 |
25 MHz |
8 |
24.2 mm |
No |
0 |
|||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
TTL |
38535Q/M;38534H;883B |
16 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
No |
Combinatorial |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
e0 |
25 MHz |
8 |
24.195 mm |
No |
6 |
||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
22 |
HVQCCN |
Rectangular |
Yes |
1.89 V |
17 |
17 |
PLA-TYPE |
1.8 |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC22,.08X.09,16 |
No |
Macrocell |
1.71 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 16 I/O |
1 |
-40 °C (-40 °F) |
Quad |
R-XQCC-N22 |
.6 mm |
2 mm |
Can also operate at 3.3 V or 5 V supply |
16 |
2.2 mm |
No |
16 |
||||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
20 |
VQCCN |
Rectangular |
Yes |
5.5 V |
15 |
9 |
PLA-TYPE |
3.3 |
Chip Carrier, Very Thin Profile |
LCC20,.08X.12,16 |
No |
Macrocell |
2.3 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 8 I/O |
1 |
-40 °C (-40 °F) |
Quad |
R-XQCC-N20 |
.6 mm |
2 mm |
8 |
3 mm |
No |
8 |
|||||||||||||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
20 |
VQCCN |
Rectangular |
Yes |
5.5 V |
15 |
9 |
PLA-TYPE |
3.3 |
Box, Tape and Reel, 7 in |
Chip Carrier, Very Thin Profile |
LCC20,.08X.12,16 |
No |
Macrocell |
2.3 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 8 I/O |
1 |
-40 °C (-40 °F) |
Quad |
R-XQCC-N20 |
.6 mm |
2 mm |
8 |
3 mm |
No |
8 |
||||||||||||||||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
OT PLD |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
5.5 V |
19 |
AEC-Q100 |
13 |
PLA-TYPE |
3.3 |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
No |
Macrocell |
2.3 V |
.65 mm |
105 °C (221 °F) |
0 Dedicated Inputs, 13 I/O |
0 |
-40 °C (-40 °F) |
Dual |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
15 |
6.5 mm |
No |
13 |
||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Flat |
20 |
DFP |
Rectangular |
Ceramic, Glass-Sealed |
40 ns |
Yes |
5.5 V |
TTL |
MIL-STD-883 |
12 |
PAL-TYPE |
5 |
Tube |
5 V |
Flatpack |
FL20,.3 |
Programmable Logic Devices |
No |
Mixed |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDFP-F20 |
2.54 mm |
6.92 mm |
Yes |
e0 |
25 MHz |
8 |
13.09 mm |
No |
4 |
||||||||
Intel |
OT PLD |
Commercial |
J Bend |
28 |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
32 |
CMOS |
24 |
PAL-TYPE |
5 |
No |
Macrocell |
4.75 V |
320 |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Quad |
S-XQCC-J28 |
50 MHz |
16 |
No |
16 |
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Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
76.9 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
76.9 MHz |
30 s |
16 |
220 °C (428 °F) |
16 |
||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
20 ns |
No |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.25 V |
TTL |
MIL-M-38510 Class B |
12 |
PAL-TYPE |
5 |
Tube |
In-Line |
No |
Mixed |
4.75 V |
64 |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
6.92 mm |
No |
e0 |
40 MHz |
8 |
24.2 mm |
No |
4 |
|||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
5.25 V |
Bipolar |
MIL-M-38510 Class B |
16 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
No |
Mixed |
4.75 V |
64 |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 4 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
6.92 mm |
Yes |
e0 |
40 MHz |
8 |
32 mm |
No |
4 |
|||||||||
|
Renesas Electronics |
OT PLD |
No Lead |
8 |
VQCCN |
Rectangular |
Yes |
1.89 V |
7 |
6 |
PLA-TYPE |
1.8 |
Chip Carrier, Very Thin Profile |
LCC8,.039X.047,16 |
No |
Macrocell |
1.71 V |
.4 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 5 I/O |
1 |
-40 °C (-40 °F) |
Quad |
R-XQCC-N8 |
1 |
.6 mm |
1 mm |
Can also operate at 3.3 V or 5 V supply |
5 |
1.2 mm |
No |
5 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.