OT PLD Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
SLG46140V	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	1.89 V	8			12	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				11		2 mm	No	11
SLG46140VTR	Renesas Electronics	OT PLD		No Lead	14	VQCCN	Rectangular			Yes	1.89 V	8			12	PLA-TYPE	1.8	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC14,.06X.08,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 11 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N14	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				11		2 mm	No	11
SLG46538MTR	Renesas Electronics	OT PLD		No Lead	22	HVQCCN	Rectangular			Yes	1.89 V	17			17	PLA-TYPE	1.8	Tape and Reel, 7 in		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC22,.08X.09,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 16 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N22		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				16		2.2 mm	No	16
SLG46721V	Renesas Electronics	OT PLD																																	1
SLG47105V	Renesas Electronics	OT PLD																																	1
TIBPAL16L8-25CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Combinatorial	4.75 V	64	1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQCC-J20	3	4.57 mm	8.965 mm	No		e4	30 MHz	30 s	8	245 °C (473 °F)	8.965 mm		6
82S100/BXA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	80 ns	No	5.5 V		TTL				5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-GDIP-T28				No									0
82S100BXA	Qp Semiconductor	OT PLD	Military	Through-Hole	28		Rectangular	Ceramic, Metal-Sealed Cofired	80 ns	No	5.5 V		Bipolar				5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDIP-T28				No									0
M38510/50601BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	6.92 mm	Yes		e0	40 MHz		8		24.2 mm	No	6
PALC22V10-30DMB	Cypress Semiconductor	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	25 MHz		10		31.877 mm		10
CY7C344-25JC	Cypress Semiconductor	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS		24	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J28		4.57 mm	11.5316 mm	No	Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz	30 s	16	225 °C (437 °F)	11.5316 mm		16
PLS100N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	50 ns	No	5.25 V		TTL		16	PLA-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices		Combinatorial	4.75 V	48	2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28				No	Tri-State Output				8				0
CY7C342B-25JC	Cypress Semiconductor	OT PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	40 ns	Yes	5.25 V	128	CMOS				5		5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 52 I/O	7	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz				24.2316 mm	No	52
PALC16R4-30DMB	Cypress Semiconductor	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	1 External Clock	e0	22 MHz		4		24.13 mm		4
EP1810GM883B	Altera	OT PLD	Military	Pin/Peg	68	PGA	Square	Ceramic	50 ns	No		48	CMOS	38535Q/M;38534H;883B			5		5 V	Grid Array	PGA68,11X11	Programmable Logic Devices	No				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Perpendicular	S-XPGA-P68				No		e0				220 °C (428 °F)		No
EP610PC-25	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	27 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-PDIP-T24				No	Zero Standby Function; 16 Macrocells With Configurable I/O		40 MHz		16				16
PALC22V10-25DMB	Cypress Semiconductor	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	30.3 MHz		10		31.877 mm		10
PLDC20G10B-15PC	Cypress Semiconductor	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	90	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 11 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.826 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	45.4 MHz		10		31.75 mm		11
PLDC20RA10-15JC	Cypress Semiconductor	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	80	1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28				No	Asynchronous Registered; 10 Macrocells; Register Preload; Power-Up Reset	e0	45.5 MHz		10				10
5962-8867005LX	Defense Logistics Agency	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24				Yes			50 MHz						10
AT22V10-15PI	Atmel	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz		10		32 mm		10
ATV750-20GM/883	Atmel	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	10	CMOS	MIL-STD-883			5		5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 10 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; Variable Product Terms	e0	55 MHz				32 mm	No	10
CY7C343B-35JI	Cypress Semiconductor	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	35 ns	Yes	5.5 V	64	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 28 I/O	7	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44		4.572 mm	16.6116 mm	No	Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock	e0	40 MHz				16.6116 mm	No	28
EP1810LC-20T	Altera	OT PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	22 ns	Yes	5.25 V	48	CMOS				5		5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 48 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68		5.08 mm	24.23 mm	No	Macrocells Interconnected By Global And/Or Local Bus; 48 Macrocells; 4 External Clocks	e0	50 MHz			220 °C (428 °F)	24.23 mm	No	48
EP22V10ELC-15	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock	e0	64.5 MHz		10	220 °C (428 °F)	11.505 mm		10
EP22V10PC-7	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	9 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.32 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock	e0	109.8 MHz		10	220 °C (428 °F)	31.68 mm		10
EP330PC-15	Rochester Electronics	OT PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	16 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		4.318 mm	7.62 mm		8 Macrocells; 1 External Clock; Shared Input/Clock	e0	83.3 MHz				26.162 mm		8
P5C032-35	Intel	OT PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	72	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		5.08 mm	7.62 mm	No	PAL with Macrocells; 8 Macrocells; 1 External Clock; Shared Input/Clock	e0	22.2 MHz		8		25.55 mm		8
PALC16L8-30DMB	Cypress Semiconductor	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0			8		24.13 mm		6
PLDC20RA10-15JCT	Cypress Semiconductor	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5			Chip Carrier				Macrocell	4.5 V			75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J28				No	Asynchronous Registered; 10 Macrocells; Register Preload; Power-Up Reset		45.5 MHz						10
XC7354-15PC68C	Xilinx	OT PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	32 ns	Yes	5.25 V	54	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 42 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 108 Flip Flops	e0	55.6 MHz				24.2316 mm	No	42
PAL16L8A-2MJ	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		TTL		16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	16 MHz		8		24.195 mm	No	6
PAL16R8AMJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		TTL	38535Q/M;38534H;883B	8	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	25 MHz		8		24.195 mm	No	0
TIBPAL16L8-15MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		TTL	MIL-PRF-38535	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No			50 MHz		8		24.195 mm		6
5962-01-406-5958	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			30 MHz		8
TIBPAL20L8-7CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	9 ns	Yes	5.25 V		TTL		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Combinatorial	4.75 V	64	1.27 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No			74 MHz		8		11.5062 mm		6
JM38510/50503BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		TTL	MIL-M-38510 Class B			5			In-Line				Mixed	4.75 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			28.5 MHz				32.005 mm		2
TIBPAL16R4-30MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	30 ns	Yes	5.5 V		TTL	MIL-STD-883	12	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20		2.54 mm	6.92 mm	No		e0	25 MHz		8		13.09 mm	No	4
5962-8515515SX	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	14 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Flatpack				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20				No			48 MHz						2
5962-8767103KX	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	20 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Flatpack				Mixed	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDFP-F24				No			28.5 MHz						2
TIBPAL16R8-5CJ	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	7 ns	No	5.25 V		TTL		8	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	Power-Up Reset; Register Preload		111 MHz		8		24.195 mm		0
TIBPAL20R6-10MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	12 ns	Yes	5.5 V		TTL		14	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No	Register Preload; Power-Up Reset		50 MHz		8		11.43 mm		2
5962-8605303KX	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Flatpack				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDFP-F24				Yes			25 MHz						10
EP610PC-35	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	37 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-PDIP-T24				No	Zero Standby Function; 16 Macrocells With Configurable I/O		28.6 MHz		16				16
82S105ACN	Texas Instruments	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy		No			TTL		16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices				48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T28				No			12.5 MHz		8
TIBPAL16R8-7MFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		TTL		8	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No	Power-Up Reset; Register Preload		74 MHz		8		8.89 mm		0
TIBPAL22V10-20MNT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No			TTL		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			37 MHz		10
TIBPAL20L8-10CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		TTL		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Combinatorial	4.75 V	64	1.27 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No					8		11.5062 mm		6

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.