Intel Programmable Logic Devices (PLD) 517

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM3032ATC44-4N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	4.5 ns		Yes	3.6 V	32	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	227.3 MHz				10 mm	Yes	34
5M240ZT100A5N	Intel	Flash PLD	Industrial	Gull Wing	100	QFP	Square	Plastic	17.7 ns		Yes	1.89 V	192	CMOS				1.8,1.2/3.3 V	Flatpack	TQFP100,.63SQ	Programmable Logic Devices	Yes		1.71 V		.5 mm	105 °C (221 °F)	0 Dedicated Inputs, 79 I/O		-40 °C (-40 °F)		Quad	S-PQFP-G100			14 mm	No							14 mm	Yes
5M1270ZT144I5	Intel	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	1.89 V					1.8		Flatpack, Low Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	100 °C (212 °F)	114 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e0	201.1 MHz				20 mm		114
EPM3032ATI44-10N	Intel	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	32	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	103.1 MHz				10 mm	Yes	34
EPM3128ATI100-10N	Intel	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100		1.27 mm	14 mm	No		e3	98 MHz				14 mm	Yes	80
5M1270ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	211 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	201.1 MHz				17 mm	Yes	211
EPM7128STC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	128	CMOS			5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz	40 s		260 °C (500 °F)	14 mm	Yes	84
EPM570F256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	2.625 V	440	CMOS	160		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			160		17 mm	Yes	160
5M1270ZT144C4N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.1 ns		Yes	1.89 V	980	CMOS			1.8	1.8,1.2/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	114 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3	247.5 MHz				20 mm	Yes	114
EPM7256AETC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	95.2 MHz				14 mm	Yes	84
EPM3512AQI208-10N	Intel	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 172 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm	Yes	172
EPM3032ALC44-10N	Intel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	32	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	103.1 MHz				16.5862 mm	Yes	34
EPM1270M256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS	212		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
EPM3128ATC100-5N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	192.3 MHz				14 mm	Yes	80
EPM7160STI100-10N	Intel	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	160	CMOS			5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	160 Macrocells; 10 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz				14 mm	Yes	84
5M160ZE64C4N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	128	CMOS			1.8	1.2/3.3,1.8 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	184.1 MHz				7 mm	Yes	54
5M570ZT144C4N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS			1.8	1.8,1.2/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	114 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3	184.1 MHz				20 mm	Yes	114
5M1270ZF256I5N	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS			1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	211 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	201.1 MHz				17 mm	Yes	211
EPM3064ATI100-10N	Intel	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 66 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	100 MHz				14 mm	Yes	66
EPM3128ATC100-7N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	129.9 MHz				14 mm	Yes	80
5M240ZT100I5	Intel	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192		79		1.8		Flatpack, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	100 °C (212 °F)	79 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e0	118.3 MHz		79		14 mm		79
EPM2210F324I5N	Intel	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS	272		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 272 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e1		30 s	272	260 °C (500 °F)	19 mm	Yes	272
EPM240T100I5	Intel	Flash PLD		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	192	CMOS	80		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e0			80		14 mm	Yes	80
EPM3032ATC44-7N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	138.9 MHz				10 mm	Yes	34
EPM3256AQC208-10N	Intel	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 158 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	95.2 MHz				28 mm	Yes	158
EPF10K10ATI144-3N	Intel	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.8 ns	576	Yes	3.6 V		CMOS	102		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	576 Logic Elements; 72 Labs	e3	80 MHz		102		20 mm		102
EPM3064ATC100-4N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	4.5 ns		Yes	3.6 V	64	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 66 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	222.2 MHz				14 mm	Yes	66
5M240ZM100C5N	Intel	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192	CMOS	79		1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	79 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz		79		6 mm	Yes	79
5M80ZE64C4N	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	64	CMOS			1.8	1.8,1.2/3.3 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	184.1 MHz				7 mm	Yes	54
EPF10K20TI144-4N	Intel	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS	102		5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3			102		20 mm		102
EPF10K50VRI240-4N	Intel	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	2880	Yes	3.6 V		CMOS	189		3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			189		32 mm		189
EPM240M100I5N	Intel	Flash PLD		Ball	100	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	192	CMOS	80		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1		30 s	80	260 °C (500 °F)	6 mm	Yes	80
EPM7064SLC44-5N	Intel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns		Yes	5.25 V	64	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	250 MHz				16.5862 mm	No	36
EPM9320LC84-15	Intel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	16 ns		Yes	5.25 V	320	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 60 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	117.6 MHz				29.3116 mm	Yes	60
EPM3064ALC44-10N	Intel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	100 MHz				16.5862 mm	Yes	34
EPM7064AETI44-7N	Intel	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64	CMOS	36	PLA-TYPE	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	2048	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	135.1 MHz		36		10 mm	Yes	36
EPM9320LC84-15N	Intel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	16 ns		Yes	5.25 V		CMOS			5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 60 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e3	117.6 MHz				29.3116 mm		60
5M40ZM64I5N	Intel	Flash PLD	Industrial	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V					1.8		Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	100 °C (212 °F)	30 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	118.3 MHz				4.5 mm		30
EPM240T100C3	Intel	Flash PLD	Commercial Extended	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	4.7 ns		Yes	2.625 V	192	CMOS	80		2.5	1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e0			80		14 mm	Yes	80
EPM1270GT144C4N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.1 ns		Yes	1.89 V	980	CMOS	116		1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3			116		20 mm	Yes	116
EPM7128AETC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	98 MHz	30 s		260 °C (500 °F)	14 mm	Yes	84
EPM2210F324C4N	Intel	Flash PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	9.1 ns		Yes	2.625 V	1700	CMOS	272		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e1			272		19 mm	Yes	272
EPM240GM100C5N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.89 V	192	CMOS	80		1.8	1.5/3.3,1.8 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100			6 mm	No	It can also operate at 3.3 V	e1			80		6 mm	Yes	80
EPM7064STI44-7N	Intel	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns		Yes	5.5 V	64	CMOS			5	5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	166.7 MHz				10 mm	No	36
EP20K100ETC144-2XN	Intel	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2.02 ns		Yes	1.89 V		CMOS			1.8		Flatpack, Low Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 92 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3					20 mm		92
EPM240GT100C5N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.89 V	192	CMOS	80		1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			80		14 mm	Yes	80
EPM7128AETI100-7N	Intel	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS	84	PLA-TYPE	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	129.9 MHz		84		14 mm	Yes	84
EPM7256SRI208-10N	Intel	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	256	CMOS			5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz				28 mm	Yes	164

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.