Intel Programmable Logic Devices (PLD) 517

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

5M2210ZF256C4N

Intel

Flash PLD

Other

Ball

256

LBGA

Square

Plastic/Epoxy

9.1 ns

Yes

1.89 V

1700

CMOS

203

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

203 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e1

247.5 MHz

203

17 mm

Yes

203

5M2210ZF324C5N

Intel

Flash PLD

Other

Ball

324

LBGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

271

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

271 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

1.55 mm

19 mm

No

e1

201.1 MHz

271

19 mm

Yes

271

5M240ZT144I5N

Intel

Flash PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

17.7 ns

Yes

1.89 V

192

CMOS

114

1.8

1.8,1.2/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

100 °C (212 °F)

114 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e3

118.3 MHz

114

20 mm

Yes

114

EPF10K100ARI240-3N

Intel

Loadable PLD

Industrial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.8 ns

4992

Yes

3.6 V

CMOS

189

3.3

2.5/3.3,3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

189

32 mm

189

EPM7032AETI44-7N

Intel

EE PLD

Industrial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

32

CMOS

36

PLA-TYPE

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

1024

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 36 I/O

0

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e3

138.9 MHz

30 s

36

260 °C (500 °F)

10 mm

Yes

36

EPM7064AETC44-10N

Intel

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e3

100 MHz

30 s

260 °C (500 °F)

10 mm

Yes

36

5M240ZT100C5

Intel

Flash PLD

Other

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

14 ns

Yes

1.89 V

192

79

1.8

Flatpack, Thin Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

79 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

1.2 mm

14 mm

No

e0

118.3 MHz

79

14 mm

79

EPM570T100C3N

Intel

Flash PLD

Other

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

5.4 ns

Yes

2.625 V

440

CMOS

76

2.5

1.5/3.3,2.5/3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 76 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

It can also operate at 3.3 V

e3

76

14 mm

Yes

76

5M40ZM64C4N

Intel

Flash PLD

Other

Ball

64

TFBGA

Square

Plastic/Epoxy

7.9 ns

Yes

1.89 V

1.8

Grid Array, Thin Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

30 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B64

1.2 mm

4.5 mm

No

e1

184.1 MHz

4.5 mm

30

5M40ZM64C5N

Intel

Flash PLD

Other

Ball

64

TFBGA

Square

Plastic/Epoxy

14 ns

Yes

1.89 V

1.8

Grid Array, Thin Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

30 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B64

3

1.2 mm

4.5 mm

No

e1

118.3 MHz

30 s

260 °C (500 °F)

4.5 mm

30

EPM1270M256I5N

Intel

Flash PLD

Ball

256

BGA

Rectangular

Plastic/Epoxy

10 ns

Yes

2.625 V

980

CMOS

212

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

100 °C (212 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

11 mm

No

It can also operate at 3.3 V

e1

212

11 mm

Yes

212

EPM2210F324C3N

Intel

Flash PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 272 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

272

19 mm

Yes

272

EPM3128ATC144-10N

Intel

EE PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 96 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e3

98 MHz

20 mm

Yes

96

EPM7064AETC44-4N

Intel

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

64

CMOS

36

PLA-TYPE

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

2048

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e3

222.2 MHz

36

10 mm

Yes

36

EPM7128SQI100-10

Intel

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.5 V

128

CMOS

84

5

3.3/5,5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

R-PQFP-G100

3

3.65 mm

14 mm

No

Configurable I/O operation with 3.3 V or 5 V

e0

125 MHz

84

20 mm

Yes

84

EP1K50QC208-1N

Intel

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

90 MHz

147

28 mm

147

EP1K50QC208-3N

Intel

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

147

28 mm

147

EPM3032ALC44-4N

Intel

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

32

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e3

227.3 MHz

16.5862 mm

Yes

34

EPM7192SQC160-10N

Intel

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

192

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 124 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

3

4.07 mm

28 mm

No

Configurable I/O operation with 3.3 V or 5 V

e3

125 MHz

28 mm

Yes

124

EPM1270T144I5

Intel

Flash PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

2.625 V

980

CMOS

116

2.5

1.5/3.3,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

100 °C (212 °F)

0 Dedicated Inputs, 116 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

It can also operate at 3.3 V

e0

116

20 mm

Yes

116

5M570ZT144I5

Intel

Flash PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

17.7 ns

Yes

1.89 V

1.8

Flatpack, Low Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

100 °C (212 °F)

114 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e0

118.3 MHz

20 mm

114

EPM570ZM256C6N

Intel

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

9.5 ns

Yes

1.89 V

440

CMOS

160

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

11 mm

No

It can also operate at 3.3 V

e1

160

11 mm

Yes

160

EPM7064SLC44-7N

Intel

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

64

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e3

166.7 MHz

16.5862 mm

No

36

EPM7064SLI44-7N

Intel

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.5 V

64

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 36 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V

e3

166.7 MHz

30 s

245 °C (473 °F)

16.5862 mm

No

36

EPM7256AETC100-10

Intel

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e0

95.2 MHz

30 s

235 °C (455 °F)

14 mm

Yes

84

EP1K50TI144-2N

Intel

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

85 °C (185 °F)

102 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

37.5 MHz

102

20 mm

102

EPM7256SQC208-15N

Intel

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

256

CMOS

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V

e3

100 MHz

28 mm

Yes

164

EP1K100QI208-2N

Intel

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

85 °C (185 °F)

147 I/O

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

37.5 MHz

147

28 mm

147

EPM2210F324A5N

Intel

Flash PLD

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 272 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

272

19 mm

Yes

272

EP1K50TC144-3N

Intel

Loadable PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.625 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

102 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

102

20 mm

102

EPM7128SQC100-15

Intel

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.25 V

128

CMOS

5

3.3/5,5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

3.65 mm

14 mm

No

Configurable I/O operation with 3.3 V or 5 V

e0

100 MHz

20 mm

Yes

84

5M80ZE64I5

Intel

Flash PLD

Industrial

Gull Wing

64

HTFQFP

Square

Plastic/Epoxy

14 ns

Yes

1.89 V

1.8

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Macrocell

1.71 V

.4 mm

100 °C (212 °F)

54 I/O

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G64

1.2 mm

7 mm

No

e0

118.3 MHz

7 mm

54

EPM1270GT144C5N

Intel

Flash PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

1.89 V

980

CMOS

116

1.8

1.5/3.3,1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 116 I/O

0

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

It can also operate at 3.3 V

e3

30 s

116

260 °C (500 °F)

20 mm

Yes

116

EPM570F256I5N

Intel

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

8.7 ns

Yes

2.625 V

440

CMOS

160

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

100 °C (212 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

160

17 mm

Yes

160

EPM7128SQC100-7N

Intel

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

7.5 ns

Yes

5.25 V

128

CMOS

5

3.3/5,5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 84 I/O

0

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.65 mm

14 mm

No

Configurable I/O operation with 3.3 V or 5 V

e3

166.7 MHz

20 mm

Yes

84

EP1K30TC144-2N

Intel

Loadable PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

102 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

37.5 MHz

102

20 mm

102

EP20K400EFC672-2X

Intel

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.83 ns

16640

Yes

1.89 V

CMOS

480

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

480

27 mm

488

EPF10K10AQC208-3N

Intel

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.8 ns

576

Yes

3.6 V

CMOS

134

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 134 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

576 Logic Elements; 72 Labs

e3

80 MHz

134

28 mm

134

EPM240F100I5N

Intel

Flash PLD

Ball

100

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.625 V

192

CMOS

80

2.5

1.5/3.3,2.5/3.3 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

100 °C (212 °F)

0 Dedicated Inputs, 80 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

It can also operate at 3.3 V

e1

80

11 mm

Yes

80

EPM240GF100I5N

Intel

Flash PLD

Ball

100

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.89 V

192

CMOS

80

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA100,10X10,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

0 Dedicated Inputs, 80 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

1.7 mm

11 mm

No

It can also operate at 3.3 V

e1

80

11 mm

Yes

80

EPM3064ATC44-4N

Intel

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e3

222.2 MHz

10 mm

Yes

34

EPM570F256C3

Intel

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

2.625 V

440

CMOS

160

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e0

160

17 mm

Yes

160

EPM7128SLC84-10N

Intel

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

128

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V

e3

125 MHz

29.3116 mm

Yes

68

5M570ZF256I5N

Intel

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

17.7 ns

Yes

1.89 V

440

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

159 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e1

118.3 MHz

17 mm

Yes

159

EP1K30FC256-1N

Intel

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

171 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

90 MHz

171

17 mm

171

EPF10K20RI208-4N

Intel

Loadable PLD

Industrial

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

0.6 ns

1152

Yes

5.25 V

CMOS

147

5

3.3/5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 147 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V

e3

67.11 MHz

147

28 mm

147

EPM1270F256A5N

Intel

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

2.625 V

980

CMOS

212

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

212

17 mm

Yes

212

EPM1270T144A5N

Intel

Flash PLD

Automotive

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

2.625 V

980

CMOS

116

2.5

1.5/3.3,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 116 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

It can also operate at 3.3 V

e3

116

20 mm

Yes

116

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.