Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Intel |
Flash PLD |
Other |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
9.1 ns |
Yes |
1.89 V |
1700 |
CMOS |
203 |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
203 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
No |
e1 |
247.5 MHz |
203 |
17 mm |
Yes |
203 |
||||||||||
|
Intel |
Flash PLD |
Other |
Ball |
324 |
LBGA |
Square |
Plastic/Epoxy |
11.2 ns |
Yes |
1.89 V |
1700 |
CMOS |
271 |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Low Profile |
BGA324,18X18,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
271 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B324 |
1.55 mm |
19 mm |
No |
e1 |
201.1 MHz |
271 |
19 mm |
Yes |
271 |
||||||||||
|
Intel |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
1.89 V |
192 |
CMOS |
114 |
1.8 |
1.8,1.2/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
114 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e3 |
118.3 MHz |
114 |
20 mm |
Yes |
114 |
||||||||||
|
Intel |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
0.8 ns |
4992 |
Yes |
3.6 V |
CMOS |
189 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
189 |
32 mm |
189 |
||||||||||||
|
Intel |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
32 |
CMOS |
36 |
PLA-TYPE |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1024 |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e3 |
138.9 MHz |
30 s |
36 |
260 °C (500 °F) |
10 mm |
Yes |
36 |
|||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e3 |
100 MHz |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
36 |
||||||||
Intel |
Flash PLD |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
192 |
79 |
1.8 |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
79 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
e0 |
118.3 MHz |
79 |
14 mm |
79 |
|||||||||||||||||
|
Intel |
Flash PLD |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
5.4 ns |
Yes |
2.625 V |
440 |
CMOS |
76 |
2.5 |
1.5/3.3,2.5/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 76 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
It can also operate at 3.3 V |
e3 |
76 |
14 mm |
Yes |
76 |
|||||||||
|
Intel |
Flash PLD |
Other |
Ball |
64 |
TFBGA |
Square |
Plastic/Epoxy |
7.9 ns |
Yes |
1.89 V |
1.8 |
Grid Array, Thin Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
30 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B64 |
1.2 mm |
4.5 mm |
No |
e1 |
184.1 MHz |
4.5 mm |
30 |
||||||||||||||||||||
|
Intel |
Flash PLD |
Other |
Ball |
64 |
TFBGA |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
1.8 |
Grid Array, Thin Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
30 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B64 |
3 |
1.2 mm |
4.5 mm |
No |
e1 |
118.3 MHz |
30 s |
260 °C (500 °F) |
4.5 mm |
30 |
|||||||||||||||||
|
Intel |
Flash PLD |
Ball |
256 |
BGA |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
2.625 V |
980 |
CMOS |
212 |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,20X20,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
100 °C (212 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B256 |
3 |
11 mm |
No |
It can also operate at 3.3 V |
e1 |
212 |
11 mm |
Yes |
212 |
|||||||||||
|
Intel |
Flash PLD |
Other |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
7 ns |
Yes |
2.625 V |
1700 |
CMOS |
272 |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA324,18X18,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 272 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B324 |
3 |
2.2 mm |
19 mm |
No |
It can also operate at 3.3 V |
e1 |
272 |
19 mm |
Yes |
272 |
|||||||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 96 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e3 |
98 MHz |
20 mm |
Yes |
96 |
||||||||||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
64 |
CMOS |
36 |
PLA-TYPE |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
2048 |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e3 |
222.2 MHz |
36 |
10 mm |
Yes |
36 |
|||||||
Intel |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
CMOS |
84 |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
84 |
20 mm |
Yes |
84 |
|||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.3 ns |
2880 |
Yes |
2.625 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
147 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
90 MHz |
147 |
28 mm |
147 |
||||||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.5 ns |
2880 |
Yes |
2.625 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
147 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
147 |
28 mm |
147 |
|||||||||||||
|
Intel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
227.3 MHz |
16.5862 mm |
Yes |
34 |
|||||||||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 124 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
28 mm |
Yes |
124 |
||||||||||
Intel |
Flash PLD |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
2.625 V |
980 |
CMOS |
116 |
2.5 |
1.5/3.3,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
100 °C (212 °F) |
0 Dedicated Inputs, 116 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
It can also operate at 3.3 V |
e0 |
116 |
20 mm |
Yes |
116 |
|||||||||||
Intel |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
114 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e0 |
118.3 MHz |
20 mm |
114 |
|||||||||||||||||||||
|
Intel |
Flash PLD |
Other |
Ball |
256 |
BGA |
Rectangular |
Plastic/Epoxy |
9.5 ns |
Yes |
1.89 V |
440 |
CMOS |
160 |
1.8 |
1.5/3.3,1.8 V |
Grid Array |
BGA256,20X20,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B256 |
3 |
11 mm |
No |
It can also operate at 3.3 V |
e1 |
160 |
11 mm |
Yes |
160 |
||||||||||
|
Intel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
166.7 MHz |
16.5862 mm |
No |
36 |
|||||||||||
|
Intel |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V |
e3 |
166.7 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
No |
36 |
||||||||
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
95.2 MHz |
30 s |
235 °C (455 °F) |
14 mm |
Yes |
84 |
||||||||||
|
Intel |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.4 ns |
2880 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
102 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
37.5 MHz |
102 |
20 mm |
102 |
||||||||||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
256 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
28 mm |
Yes |
164 |
||||||||||
|
Intel |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.5 ns |
4992 |
Yes |
2.625 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
147 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
37.5 MHz |
147 |
28 mm |
147 |
||||||||||||
|
Intel |
Flash PLD |
Automotive |
Ball |
324 |
BGA |
Square |
Plastic/Epoxy |
11.2 ns |
Yes |
2.625 V |
1700 |
CMOS |
272 |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA324,18X18,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 272 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B324 |
3 |
2.2 mm |
19 mm |
No |
It can also operate at 3.3 V |
e1 |
272 |
19 mm |
Yes |
272 |
|||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.5 ns |
2880 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
102 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
102 |
20 mm |
102 |
|||||||||||||
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
20 mm |
Yes |
84 |
|||||||||||
Intel |
Flash PLD |
Industrial |
Gull Wing |
64 |
HTFQFP |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
Macrocell |
1.71 V |
.4 mm |
100 °C (212 °F) |
54 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G64 |
1.2 mm |
7 mm |
No |
e0 |
118.3 MHz |
7 mm |
54 |
|||||||||||||||||||||
|
Intel |
Flash PLD |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
1.89 V |
980 |
CMOS |
116 |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 116 I/O |
0 |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
It can also operate at 3.3 V |
e3 |
30 s |
116 |
260 °C (500 °F) |
20 mm |
Yes |
116 |
|||||||
|
Intel |
Flash PLD |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
8.7 ns |
Yes |
2.625 V |
440 |
CMOS |
160 |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
100 °C (212 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e1 |
160 |
17 mm |
Yes |
160 |
||||||||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
166.7 MHz |
20 mm |
Yes |
84 |
||||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
102 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
37.5 MHz |
102 |
20 mm |
102 |
||||||||||||
Intel |
Loadable PLD |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
1.83 ns |
16640 |
Yes |
1.89 V |
CMOS |
480 |
1.8 |
1.8,1.8/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Macrocell |
1.71 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 488 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e0 |
160 MHz |
480 |
27 mm |
488 |
||||||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.8 ns |
576 |
Yes |
3.6 V |
CMOS |
134 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 134 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
576 Logic Elements; 72 Labs |
e3 |
80 MHz |
134 |
28 mm |
134 |
||||||||||
|
Intel |
Flash PLD |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
2.625 V |
192 |
CMOS |
80 |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
100 °C (212 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
It can also operate at 3.3 V |
e1 |
80 |
11 mm |
Yes |
80 |
||||||||||
|
Intel |
Flash PLD |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.89 V |
192 |
CMOS |
80 |
1.8 |
1.5/3.3,1.8 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
100 °C (212 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
It can also operate at 3.3 V |
e1 |
80 |
11 mm |
Yes |
80 |
||||||||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e3 |
222.2 MHz |
10 mm |
Yes |
34 |
|||||||||||
Intel |
Flash PLD |
Commercial Extended |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5.4 ns |
Yes |
2.625 V |
440 |
CMOS |
160 |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e0 |
160 |
17 mm |
Yes |
160 |
||||||||||
|
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
29.3116 mm |
Yes |
68 |
||||||||||
|
Intel |
Flash PLD |
Industrial |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
100 °C (212 °F) |
159 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
No |
e1 |
118.3 MHz |
17 mm |
Yes |
159 |
|||||||||||||
|
Intel |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
171 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
171 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
90 MHz |
171 |
17 mm |
171 |
||||||||||||
|
Intel |
Loadable PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
1152 |
Yes |
5.25 V |
CMOS |
147 |
5 |
3.3/5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
67.11 MHz |
147 |
28 mm |
147 |
||||||||||
|
Intel |
Flash PLD |
Automotive |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
2.625 V |
980 |
CMOS |
212 |
2.5 |
1.5/3.3,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
No |
It can also operate at 3.3 V |
e1 |
212 |
17 mm |
Yes |
212 |
|||||||||
|
Intel |
Flash PLD |
Automotive |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
2.625 V |
980 |
CMOS |
116 |
2.5 |
1.5/3.3,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.5 mm |
125 °C (257 °F) |
0 Dedicated Inputs, 116 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
It can also operate at 3.3 V |
e3 |
116 |
20 mm |
Yes |
116 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.