Microchip Technology Programmable Logic Devices (PLD) 110

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
ATF22V10CZ-15PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				55.5 MHz				31.877 mm		10
ATF1504BE-7AU100	Microchip Technology	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V		CMOS				1.8	Tray		Flatpack, Thin Profile, Fine Pitch				Macrocell	1.7 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 64 I/O	4	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm								14 mm		64
ATF22V10C-10NM/883	Microchip Technology	Flash PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		CMOS	MIL-STD-883	22	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 10 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.54 mm	11.4554 mm	No			90 MHz		10		11.455 mm		10
ATF22LV10CQZ-30PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	3 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	25 MHz		10		31.887 mm		10
ATF2500C-15JU	Microchip Technology	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	24	CMOS				5	Tube	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	13 Dedicated Inputs, 24 I/O	13	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.586 mm	No		e3	52 MHz	40 s		245 °C (473 °F)	16.586 mm	No	24
5962-9154505MYX	Microchip Technology	UV PLD	Military	J Bend	44	QCCJ	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V		CMOS	MIL-STD-883			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	13 Dedicated Inputs, 24 I/O	13	-55 °C (-67 °F)		Quad	S-CQCC-J44		4.57 mm	16.5862 mm	No			40 MHz				16.5862 mm		24
ATF22LV10CQZ-30XU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	30 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	3 V	132	.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24	2	1.2 mm	4.4 mm	No		e3	25 MHz		10		7.8 mm		10
ATF16V8B-15SU-T	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5	Tape and Reel		Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20		2.65 mm	7.5 mm			e3	45 MHz				12.8 mm		8
ATF22LV10C-10XU	Microchip Technology	Flash PLD	Other	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	3 V	132	.65 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24	2	1.2 mm	4.4 mm	No	10 Macrocells	e3	71.4 MHz		10		7.8 mm		10
ATF22LV10CQZ-30JU	Microchip Technology	Flash PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	30 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No		e3	25 MHz		10		11.5062 mm		10
ATF22LV10CQZ-30SU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		e3	25 MHz		10		15.4 mm		10
ATF22V10B-10GM/883	Microchip Technology	Flash PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		CMOS	MIL-STD-883	22	PAL-TYPE	5	Tube		In-Line	DIP24,.3			Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm		10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms		90 MHz		10		32 mm	No	10
ATF750C-10PU	Microchip Technology	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V	10	CMOS				5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	83 MHz				31.877 mm	No	10
ATF750LVC-15SU	Microchip Technology	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	10	CMOS				3.3	Tube	3.3 V	Small Outline	SOP24,.4	Programmable Logic Devices	No	Macrocell	3 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		e3					15.4 mm	No	10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.