Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
Flash PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
55.5 MHz |
10 |
32 mm |
10 |
|||||||||
|
Microchip Technology |
EE PLD |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
64 |
CMOS |
64 |
5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Yes |
Macrocell |
4.75 V |
40 |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
Power-Up Reset; Security Fuse |
e3 |
166.7 MHz |
64 |
14 mm |
Yes |
64 |
||||||||||
|
Microchip Technology |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
64 |
CMOS |
32 |
5 |
Tube |
Chip Carrier |
LDCC44,.7SQ |
Yes |
Macrocell |
4.75 V |
40 |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
Power-Up Reset; Security Fuse |
e3 |
166.7 MHz |
40 s |
32 |
245 °C (473 °F) |
16.5862 mm |
Yes |
32 |
||||||
|
Microchip Technology |
Flash PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Small Outline |
SOP24,.4 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
70 °C (158 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
No |
e3 |
125 MHz |
10 |
15.4 mm |
10 |
||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
10 |
CMOS |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
e3 |
44 MHz |
11.5062 mm |
No |
10 |
|||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
4.572 mm |
8.966 mm |
No |
8 Macrocells |
e3 |
100 MHz |
8 |
8.966 mm |
8 |
|||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
5 |
Tape and Reel |
Flatpack, Thin Profile |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
e3 |
125 MHz |
10 mm |
32 |
|||||||||||||||||||
Microchip Technology |
Flash PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
20 ns |
No |
5.25 V |
CMOS |
5 |
In-Line |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
38.5 MHz |
31.877 mm |
10 |
||||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
70 °C (158 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
142 MHz |
10 |
11.5062 mm |
10 |
|||||||||
|
Microchip Technology |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
64 |
CMOS |
32 |
5 |
Tray |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Yes |
Macrocell |
4.75 V |
40 |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
Power-Up Reset; Security Fuse |
e3 |
166.7 MHz |
40 s |
32 |
260 °C (500 °F) |
10 mm |
Yes |
32 |
||||||
|
Microchip Technology |
EE PLD |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
32 |
36 |
PAL-TYPE |
5 |
Chip Carrier |
LDCC44,.7SQ |
Yes |
Macrocell |
4.5 V |
40 |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 32 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.586 mm |
30.3 MHz |
40 s |
32 |
245 °C (473 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
3.3 |
Tube |
3.3/5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
3 V |
64 |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
4.572 mm |
8.966 mm |
No |
e3 |
71 MHz |
8 |
8.966 mm |
8 |
||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
3.3 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
83.3 MHz |
40 s |
260 °C (500 °F) |
14 mm |
64 |
|||||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
3.3 |
Tape and Reel |
Flatpack, Thin Profile |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
100 MHz |
10 mm |
32 |
|||||||||||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
10 |
CMOS |
5 |
Tube |
5 V |
Small Outline |
SOP24,.4 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
No |
e3 |
44 MHz |
15.4 mm |
No |
10 |
|||||||||||
|
Microchip Technology |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
5 |
Tape and Reel |
Flatpack, Thin Profile |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
e3 |
166.7 MHz |
10 mm |
32 |
|||||||||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
Tube |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.586 mm |
No |
e3 |
100 MHz |
40 s |
245 °C (473 °F) |
16.586 mm |
Yes |
32 |
||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
32 |
5 |
Tube |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.586 mm |
No |
e3 |
76.9 MHz |
40 s |
245 °C (473 °F) |
16.586 mm |
32 |
||||||||||||||
Microchip Technology |
Flash PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
20 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
38.5 MHz |
31.877 mm |
10 |
||||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
4.572 mm |
8.966 mm |
No |
e3 |
68 MHz |
8 |
8.966 mm |
8 |
|||||||||||
|
Microchip Technology |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
128 |
5 |
Tube |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
2 |
4.572 mm |
29.3115 mm |
No |
e3 |
166.7 MHz |
29.3115 mm |
Yes |
64 |
|||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
64 |
CMOS |
32 |
5 |
Tube |
Chip Carrier |
LDCC44,.7SQ |
Yes |
Macrocell |
4.5 V |
40 |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
Power-Up Reset; Security Fuse |
e3 |
60 MHz |
40 s |
32 |
245 °C (473 °F) |
16.5862 mm |
Yes |
32 |
||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
Tube |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
2.65 mm |
7.5 mm |
No |
e3 |
45 MHz |
40 s |
8 |
250 °C (482 °F) |
12.8 mm |
8 |
|||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
10 |
CMOS |
5 |
Tube |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
No |
e3 |
44 MHz |
7.8 mm |
No |
10 |
|||||||||||
|
Microchip Technology |
Flash PLD |
Other |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
3.3 |
Tube |
3.3/5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
3 V |
132 |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
e3 |
71.4 MHz |
10 |
11.5062 mm |
10 |
||||||||||
Microchip Technology |
Flash PLD |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
22 |
5 |
Tape and Reel |
Small Outline |
SOP24,.4 |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
38.5 MHz |
10 |
15.4 mm |
No |
10 |
||||||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
Tube |
3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
100 MHz |
40 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
32 |
||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
Tube |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
2.65 mm |
7.5 mm |
No |
e3 |
45 MHz |
40 s |
8 |
250 °C (482 °F) |
12.8 mm |
8 |
|||||||
Microchip Technology |
Flash PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
MIL-PRF-38535; MIL-STD-883 |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin/Lead - hot dipped |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
e0 |
50 MHz |
10 |
32 mm |
10 |
|||||||||||
Microchip Technology |
Flash PLD |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Small Outline |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
38.5 MHz |
15.4 mm |
10 |
||||||||||||||||||||||
|
Microchip Technology |
EE PLD |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
32 |
36 |
PAL-TYPE |
5 |
Chip Carrier |
LDCC44,.7SQ |
Yes |
Macrocell |
4.75 V |
40 |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 32 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.586 mm |
95.23 MHz |
40 s |
32 |
245 °C (473 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
55.5 MHz |
11.5062 mm |
10 |
||||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Tape and Reel |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.506 mm |
38.5 MHz |
11.506 mm |
10 |
||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
5 |
Tape and Reel |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
4.572 mm |
8.966 mm |
8 Macrocells |
e3 |
100 MHz |
8.966 mm |
8 |
|||||||||||||||||
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
3.3 |
Tape and Reel |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J20 |
4.572 mm |
8.966 mm |
8.966 mm |
8 |
||||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
Tube |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
.65 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
No |
e3 |
45 MHz |
40 s |
8 |
260 °C (500 °F) |
6.5 mm |
8 |
|||||||
Microchip Technology |
Flash PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
5 |
Small Outline |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
38.5 MHz |
15.4 mm |
10 |
||||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
Tube |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
No |
8 Macrocells |
e3 |
100 MHz |
8 |
12.8 mm |
8 |
|||||||||
Microchip Technology |
Flash PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.506 mm |
38.5 MHz |
11.506 mm |
10 |
||||||||||||||||||||||
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.506 mm |
38.5 MHz |
11.506 mm |
10 |
||||||||||||||||||||||
Microchip Technology |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
10 |
CMOS |
MIL-STD-883 |
5 |
Tube |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
e0 |
55 MHz |
32 mm |
No |
10 |
|||||||||||
Microchip Technology |
Flash PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
55.5 MHz |
31.877 mm |
10 |
||||||||||||||||||||||
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
CMOS |
1.8 |
Tray |
Flatpack, Thin Profile |
Macrocell |
1.7 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 33 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
10 mm |
33 |
||||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
8 Macrocells |
e3 |
100 MHz |
8 |
25.908 mm |
8 |
|||||||||
Microchip Technology |
Flash PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
12 ns |
No |
5.25 V |
CMOS |
5 |
In-Line |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
55.5 MHz |
31.877 mm |
10 |
||||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
4.572 mm |
8.966 mm |
No |
8 Macrocells |
e3 |
142 MHz |
8 |
8.966 mm |
8 |
|||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
PAL-TYPE |
5 |
Tube |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
.65 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
No |
e3 |
45 MHz |
40 s |
8 |
260 °C (500 °F) |
6.5 mm |
8 |
||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
e3 |
125 MHz |
10 |
11.5062 mm |
10 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.