STMicroelectronics Programmable Logic Devices (PLD) 234

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
GAL39V18-25HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	40 MHz	10
GAL39V18-15QC1	STMicroelectronics	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes		CMOS	20	PLS-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices			75	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28			No		e0	67 MHz	10
GAL20V8-20HZ2	STMicroelectronics	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic	20 ns	Yes		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N28			No		e0	33.3 MHz	8
GAL20V8S-25QC3J	STMicroelectronics	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28			No		e0	28.5 MHz	8
GAL20V8-20HF2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33.3 MHz	8
GAL16V8S-15EC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	41.6 MHz	8
GAL20V8AS-25QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL16V8AS-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V	CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	25.15 mm	8
GAL20V8S-25HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL20V8AS-20HC3J	STMicroelectronics	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	11.5062 mm	8
GAL16V8-20QD2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL16V8AS-25HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL39V18-20HZ1	STMicroelectronics	EE PLD	Commercial	No Lead		QCCN		Ceramic	20 ns	Yes		CMOS	20	PLS-TYPE	5	5 V	Chip Carrier	LCC(UNSPEC)	Programmable Logic Devices			75		70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad				No		e0	50 MHz	10
GAL20V8AS-20QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8		8
GAL20V8-25HZ1	STMicroelectronics	EE PLD	Commercial	No Lead	28	QCCN	Square	Ceramic	25 ns	Yes		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-XQCC-N28			No		e0	28.5 MHz	8
GAL20V8S-20QC1J	STMicroelectronics	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns	Yes		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28			No		e0	33.3 MHz	8
GAL20V8-35QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	18.1 MHz	8
GAL39V18-20HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	50 MHz	10
GAL20V8S-15EC1J	STMicroelectronics	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28			No		e0	41.6 MHz	8
GAL20V8S-25QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL16V8S-20HC3	STMicroelectronics	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	33.3 MHz	8
GAL20V8AS-10HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	58.8 MHz	8		8
GAL39V18-15QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	67 MHz	10
GAL20V8-30HD2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	22.2 MHz	8
GAL20V8AS-15QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8		8
GAL16V8AS-20HC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	8.9662 mm	8
GAL39V18-15QZ1	STMicroelectronics	EE PLD	Commercial	No Lead		QCCN		Ceramic	15 ns	Yes		CMOS	20	PLS-TYPE	5	5 V	Chip Carrier	LCC(UNSPEC)	Programmable Logic Devices			75		70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad				No		e0	67 MHz	10
GAL16V8S-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL16V8-15HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	41.6 MHz	8
GAL20V8AS-15QC1J	STMicroelectronics	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8	11.5062 mm	8
GAL16V8-15HZ1	STMicroelectronics	EE PLD	Commercial	No Lead	20	QCCN	Square	Ceramic	15 ns	Yes		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-XQCC-N20			No		e0	41.6 MHz	8
GAL16V8AS-15QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8	25.15 mm	8
GAL16V8S-20HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL20V8AS-12HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	48.5 MHz	8		8
GAL20V8-15HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	41.6 MHz	8
GAL39V18-35HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	29 MHz	10
GAL20V8AS-20HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8		8
GAL39V18-35QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	29 MHz	10
GAL16V8-20HF2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL39V18-15HC1	STMicroelectronics	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes		CMOS	20	PLS-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices			75	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28			No		e0	67 MHz	10
GAL16V8-30QF2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	22.2 MHz	8
GAL16V8-25HC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	28.5 MHz	8
GAL16V8S-20EC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	8.9662 mm	8
GAL20V8AS-25HC1J	STMicroelectronics	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28			No		e0	28.5 MHz	8
GAL16V8S-25QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL16V8-25QC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	4.57 mm	8.965 mm	No		e0	28.5 MHz	8	8.965 mm	8
GAL20V8S-20HC3J	STMicroelectronics	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns	Yes		CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell		64	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28			No		e0	33.3 MHz	8
GAL20V8AS-15QC3J	STMicroelectronics	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS	20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8	11.5062 mm	8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.