STMicroelectronics Programmable Logic Devices (PLD) 234

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

GAL16V8AS-15EB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T20

3.93 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

41.6 MHz

25.15 mm

8

GAL16V8S-20QC3

STMicroelectronics

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

No

e0

33.3 MHz

8

GAL16V8AS-20QB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

20 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

3.93 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

25.15 mm

8

GAL39V18-25HZ1

STMicroelectronics

EE PLD

Commercial

No Lead

QCCN

Ceramic

25 ns

Yes

CMOS

20

PLS-TYPE

5

5 V

Chip Carrier

LCC(UNSPEC)

Programmable Logic Devices

75

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

No

e0

40 MHz

10

GAL39V18-25HB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

20

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

75

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

40 MHz

10

GAL20V8S-20HB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

20 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

33.3 MHz

8

GAL16V8-20QD1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

20 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

33.3 MHz

8

GAL16V8-30HF2

STMicroelectronics

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

30 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

22.2 MHz

8

GAL16V8AS-20QB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

20 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

3.93 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

25.15 mm

8

GAL20V8-20HC1

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

33.3 MHz

8

GAL39V18-35HC1

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

20

PLS-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

75

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

29 MHz

10

GAL20V8S-20EC1J

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

11.5062 mm

8

GAL6001S-35HC1

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

40 ns

Yes

CMOS

20

PLS-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

75

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

22.9 MHz

10

GAL16V8AS-15HB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

3.93 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

25.15 mm

8

GAL20V8AS-15HB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

8

GAL20V8-20HD1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

20 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

33.3 MHz

8

GAL20V8AS-15QB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

8

GAL20V8-15HZ1

STMicroelectronics

EE PLD

Commercial

No Lead

28

QCCN

Square

Ceramic

15 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N28

No

e0

41.6 MHz

8

GAL16V8AS-20HB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

20 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

3.93 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

25.15 mm

8

GAL20V8AS-15EB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

8

GAL39V18-15QB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

CMOS

20

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

75

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

67 MHz

10

GAL20V8-20HD2

STMicroelectronics

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

20 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

33.3 MHz

8

GAL39V18-20QC1

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

20

PLS-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

75

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

50 MHz

10

GAL16V8AS-20QC1

STMicroelectronics

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

4.57 mm

8.9662 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

8.9662 mm

8

GAL16V8-25HF1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

25 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

28.5 MHz

8

GAL20V8AS-25QB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

LG-MAX

e0

28.5 MHz

8

31.88 mm

8

GAL20V8AS-12HC1J

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

48.5 MHz

8

11.5062 mm

8

GAL16V8-30HZ2

STMicroelectronics

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic

30 ns

Yes

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-XQCC-N20

No

e0

22.2 MHz

8

GAL20V8-35QC1

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

18.1 MHz

8

GAL16V8S-25HB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

No

e0

28.5 MHz

8

GAL6001S-30HC1

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

5.25 V

CMOS

20

PLS-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

75

1.27 mm

70 °C (158 °F)

10 Dedicated Inputs, 10 I/O

10

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Pal With Macros; 38 Macros; 2 External Clocks; Buried Macros; Input Macros

e0

23.5 MHz

10

11.5062 mm

10

GAL20V8S-25HC1J

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

28.5 MHz

8

GAL20V8-15HD1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

15 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

41.6 MHz

8

GAL39V18-25QC1

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PLS-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

75

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

40 MHz

10

GAL16V8S-15EB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

No

e0

41.6 MHz

8

GAL20V8AS-15EC3J

STMicroelectronics

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

11.5062 mm

8

GAL39V18-35QZ1

STMicroelectronics

EE PLD

Commercial

No Lead

QCCN

Ceramic

35 ns

Yes

CMOS

20

PLS-TYPE

5

5 V

Chip Carrier

LCC(UNSPEC)

Programmable Logic Devices

75

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

No

e0

29 MHz

10

GAL20V8-30QD2

STMicroelectronics

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

30 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

22.2 MHz

8

GAL16V8-30HD2

STMicroelectronics

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

30 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

22.2 MHz

8

GAL20V8S-25HC3J

STMicroelectronics

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

28.5 MHz

8

GAL20V8S-20EC3J

STMicroelectronics

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

11.5062 mm

8

GAL16V8S-25QC1

STMicroelectronics

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

No

e0

28.5 MHz

8

GAL39V18-30QC1

STMicroelectronics

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

CMOS

20

PLS-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

75

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

33 MHz

10

GAL16V8AS-15HC1

STMicroelectronics

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

4.57 mm

8.9662 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

8.9662 mm

8

GAL20V8-25QF1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

25 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

28.5 MHz

8

GAL39V18-25QZ1

STMicroelectronics

EE PLD

Commercial

No Lead

QCCN

Ceramic

25 ns

Yes

CMOS

20

PLS-TYPE

5

5 V

Chip Carrier

LCC(UNSPEC)

Programmable Logic Devices

75

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

No

e0

40 MHz

10

GAL20V8S-20EB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

20 ns

No

5.5 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

8

GAL16V8AS-15QB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

3.93 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

25.15 mm

8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.