Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 ns |
No |
5.5 V |
TTL |
MIL-STD-883 |
16 |
PAL-TYPE |
5 |
In-Line |
No |
Registered |
4.5 V |
125 °C (257 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
Yes |
52.5 MHz |
8 |
No |
0 |
|||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
12 ns |
No |
5.5 V |
TTL |
MIL-PRF-38535 |
10 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Mixed |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 2 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
52.5 MHz |
6 |
24.195 mm |
2 |
|||||||||||||
Texas Instruments |
EE PLD |
Military |
Flat |
24 |
DFP |
Rectangular |
Ceramic |
Yes |
TTL |
12 |
PLA-TYPE |
5 |
5 V |
Flatpack |
FL24,.4 |
Programmable Logic Devices |
32 |
1.27 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F24 |
No |
6 |
|||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
TTL |
14 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Mixed |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 2 I/O |
12 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
No |
Register Preload; Power-Up Reset |
25 MHz |
8 |
2 |
||||||||||||||||
Texas Instruments |
OT PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
5.5 V |
TTL |
MIL-PRF-38535 |
16 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LCC20,.35SQ |
Programmable Logic Devices |
Combinatorial |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
2.03 mm |
8.89 mm |
No |
50 MHz |
8 |
8.89 mm |
6 |
|||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
TTL |
MIL-STD-883 |
16 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
No |
Combinatorial |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
e0 |
25 MHz |
8 |
24.195 mm |
No |
6 |
||||||||
Texas Instruments |
No |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
J Bend |
28 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
30 ns |
Yes |
5.5 V |
TTL |
14 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LCC28,.45SQ |
Programmable Logic Devices |
Mixed |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 2 I/O |
12 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J28 |
2.54 mm |
11.43 mm |
No |
1 External Clock; Register Preload |
20 MHz |
8 |
11.43 mm |
2 |
|||||||||||||
Texas Instruments |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
18 ns |
Yes |
5.25 V |
TTL |
14 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Mixed |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 2 I/O |
12 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
No |
Register Preload; Power-Up Reset |
37 MHz |
8 |
2 |
||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
No |
TTL |
38535Q/M;38534H;883B |
16 |
PLS-TYPE |
5 |
5 V |
In-Line |
DIP28,.6 |
Programmable Logic Devices |
48 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T28 |
No |
8 |
||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Flat |
20 |
DFP |
Rectangular |
Ceramic, Glass-Sealed |
12 ns |
Yes |
5.5 V |
TTL |
MIL-PRF-38535 |
8 |
PAL-TYPE |
5 |
5 V |
Flatpack |
FL20,.3 |
Programmable Logic Devices |
Mixed |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 2 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDFP-F20 |
2.45 mm |
6.92 mm |
No |
52.5 MHz |
8 |
2 |
||||||||||||||
Texas Instruments |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
12 ns |
No |
5.25 V |
TTL |
10 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Mixed |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 2 I/O |
8 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
5.08 mm |
7.62 mm |
No |
Power-Up Reset |
62 MHz |
6 |
24.325 mm |
2 |
|||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
TTL |
MIL-STD-883 |
16 |
PAL-TYPE |
5 |
In-Line |
No |
Mixed |
4.5 V |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
Yes |
41.6 MHz |
4 |
No |
4 |
|||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
30 ns |
Yes |
5.5 V |
TTL |
MIL-STD-883 |
16 |
PAL-TYPE |
5 |
Chip Carrier |
No |
Mixed |
4.5 V |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
Yes |
25 MHz |
4 |
No |
4 |
|||||||||||||||||||
Texas Instruments |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
TTL |
14 |
PLA-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Combinatorial |
4.75 V |
32 |
2.54 mm |
70 °C (158 °F) |
14 Dedicated Inputs, 0 I/O |
14 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
No |
6 |
0 |
||||||||||||||||||
Texas Instruments |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
20 ns |
No |
5.25 V |
TTL |
12 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Mixed |
4.75 V |
40 |
2.54 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 2 I/O |
10 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
No |
Power-Up Reset; 1 External Clock; Register Preload |
35 MHz |
10 |
2 |
||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
TTL |
38535Q/M;38534H;883B |
16 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Registered |
64 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
25 MHz |
8 |
||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 ns |
Yes |
5.5 V |
TTL |
MIL-STD-883 |
8 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LCC20,.35SQ |
Programmable Logic Devices |
Registered |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
2.03 mm |
8.89 mm |
No |
74 MHz |
8 |
8.89 mm |
0 |
|||||||||||||
Texas Instruments |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
TTL |
12 |
PLA-TYPE |
5 |
5 V |
In-Line |
DIP24,.6 |
Programmable Logic Devices |
32 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
6 |
|||||||||||||||||||||||||
Texas Instruments |
No |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
Tin Lead |
No |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
TTL |
MIL-STD-883 |
10 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Mixed |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 2 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
50 MHz |
6 |
2 |
||||||||||||||
Texas Instruments |
OT PLD |
Military |
Flat |
20 |
DFP |
Rectangular |
Ceramic, Glass-Sealed |
40 ns |
Yes |
5.5 V |
TTL |
10 |
PAL-TYPE |
5 |
5 V |
Flatpack |
FL20,.3 |
Programmable Logic Devices |
Mixed |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 2 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDFP-F20 |
No |
16 MHz |
6 |
2 |
|||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
Bipolar |
MIL-M-38510 Class B |
5 |
In-Line |
Combinatorial |
4.5 V |
125 °C (257 °F) |
10 Dedicated Inputs, 0 I/O |
10 |
-55 °C (-67 °F) |
Dual |
R-CDIP-T20 |
Yes |
20 MHz |
0 |
|||||||||||||||||||||||||
Texas Instruments |
No |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
TTL |
12 |
PLA-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
50 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
No |
6 |
|||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
No |
TTL |
38535Q/M;38534H;883B |
16 |
PLS-TYPE |
5 |
5 V |
In-Line |
DIP28,.6 |
Programmable Logic Devices |
48 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-XDIP-T28 |
No |
12.5 MHz |
8 |
|||||||||||||||||||||||
Texas Instruments |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
45 ns |
Yes |
5.5 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
240 |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
No |
22.2 MHz |
24 |
24 |
|||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Flat |
20 |
DFP |
Rectangular |
Ceramic, Glass-Sealed |
12 ns |
Yes |
5.5 V |
TTL |
MIL-STD-883 |
12 |
PAL-TYPE |
5 |
5 V |
Flatpack |
FL20,.3 |
Programmable Logic Devices |
Mixed |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDFP-F20 |
2.45 mm |
6.92 mm |
No |
52.5 MHz |
8 |
4 |
||||||||||||||
Texas Instruments |
EE PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic |
Yes |
TTL |
38535Q/M;38534H;883B |
10 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LCC20,.35SQ |
Programmable Logic Devices |
Registered |
64 |
1.27 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-XQCC-N20 |
No |
6 |
|||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
30 ns |
Yes |
5.5 V |
TTL |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Quad |
S-CQCC-N28 |
No |
22 MHz |
10 |
||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
TTL |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
132 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
10 |
||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
30 ns |
No |
TTL |
16 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Combinatorial |
64 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T20 |
No |
8 |
|||||||||||||||||||||||
Texas Instruments |
No |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
35 ns |
No |
5.25 V |
TTL |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
No |
PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock |
18 MHz |
10 |
10 |
||||||||||||||||
Texas Instruments |
UV PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.5 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
240 |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-CQCC-J44 |
No |
22.2 MHz |
24 |
24 |
|||||||||||||||||
Texas Instruments |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
25 ns |
No |
CMOS |
38535Q/M;38534H;883B |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
72 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T20 |
No |
22 MHz |
8 |
||||||||||||||||||||||
Texas Instruments |
No |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Flat |
20 |
DFP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
Yes |
5.5 V |
TTL |
5 |
Flatpack |
Registered |
4.5 V |
125 °C (257 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDFP-F20 |
No |
16 MHz |
0 |
|||||||||||||||||||||||||
Texas Instruments |
No |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
Tin Lead |
No |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
OT PLD |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
TTL |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Combinatorial |
64 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
No |
8 |
||||||||||||||||||||||
Texas Instruments |
No |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
40 ns |
Yes |
5.5 V |
TTL |
MIL-STD-883 |
16 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LCC20,.35SQ |
Programmable Logic Devices |
No |
Combinatorial |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
2.03 mm |
8.89 mm |
Yes |
e0 |
25 MHz |
8 |
8.89 mm |
No |
6 |
||||||||
Texas Instruments |
OT PLD |
Military |
Flat |
20 |
DFP |
Rectangular |
Ceramic, Glass-Sealed |
12 ns |
Yes |
5.5 V |
TTL |
MIL-STD-883 |
10 |
PAL-TYPE |
5 |
5 V |
Flatpack |
FL20,.3 |
Programmable Logic Devices |
Mixed |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 2 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDFP-F20 |
2.45 mm |
6.92 mm |
No |
52.5 MHz |
6 |
2 |
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Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
TTL |
5 |
In-Line |
Registered |
4.5 V |
125 °C (257 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
No |
41.6 MHz |
0 |
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Texas Instruments |
Mask PLD |
Commercial Extended |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
35 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Combinatorial |
4.5 V |
1.27 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
0 °C (32 °F) |
Quad |
S-PQCC-J20 |
4.57 mm |
8.9662 mm |
No |
8.9662 mm |
6 |
||||||||||||||||||||||
Texas Instruments |
OT PLD |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
13 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
72 |
1.27 mm |
70 °C (158 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
0 °C (32 °F) |
Quad |
S-PQCC-J20 |
4.57 mm |
8.9662 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock |
71.4 MHz |
8 |
8.9662 mm |
8 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.