Texas Instruments Programmable Logic Devices (PLD) 1,713

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

TIBPAD16N8-7CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

16

PAD-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

16

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

8

24.325 mm

6

EP610DI-40

Texas Instruments

UV PLD

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

40 ns

No

5.5 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

160

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 16 I/O

4

-40 °C (-40 °F)

Dual

R-CDIP-T24

No

Zero Standby Function; 16 Macrocells With Configurable I/O

16

16

TIBPALR19R6MFK

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

19

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

0 Dedicated Inputs, 2 I/O

0

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

1 External Clock; Register Preload

20 MHz

8

11.43 mm

2

PAL16R8AMW

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

8

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

No

25 MHz

8

0

5962-8515506RX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

In-Line

No

Registered

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

Yes

25 MHz

8

No

0

PAL20L8A-2CJW

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

Combinatorial

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

No

8

TIBPAL20R6-15CFN

Texas Instruments

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

18 ns

Yes

5.25 V

TTL

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Mixed

4.75 V

64

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

4.57 mm

11.5062 mm

No

Register Preload; Power-Up Reset

e3

37 MHz

20 s

8

220 °C (428 °F)

11.5062 mm

2

TIBPALR19R6CFN

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

TTL

19

PAL-TYPE

5

5 V

In-Line

LDCC28,.5SQ

Programmable Logic Devices

Mixed

4.75 V

64

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 2 I/O

0

0 °C (32 °F)

Dual

R-GDIP-T24

No

1 External Clock; Register Preload

30 MHz

8

2

SN74S331J

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

50

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T20

No

6

5962-94B0513QTX

Texas Instruments

No

PAL20R8AMFKB

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

20 MHz

8

PAL16R8A-2MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

8

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

16 MHz

8

0

5962-8515506SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

Flatpack

No

Registered

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

Yes

25 MHz

8

No

0

TIBPAL16R8-7MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

MIL-PRF-38535

8

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

74 MHz

8

24.195 mm

No

0

TIBPAL20R8-5CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

7 ns

No

5.25 V

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-GDIP-T24

No

Register Preload; Power-Up Reset

111 MHz

8

0

TIBPAL20L8-15CNT3

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

8

PAL16R6A-2MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

40 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

10

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

16 MHz

6

2

TIBPAL20R4-10MJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

8

32.005 mm

4

5962-8515519SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

10 ns

Yes

5.5 V

TTL

MIL-STD-883

5

Flatpack

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

No

52.5 MHz

2

TIBPAL20X1025MJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

25 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

10

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

4.5 V

40

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 0 I/O

10

-55 °C (-67 °F)

Dual

R-CDIP-T24

No

Power-Up Reset; 1 External Clock; Register Preload

25 MHz

10

0

TIBPAL16L8-30MW

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

30 ns

Yes

5.5 V

TTL

16

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDFP-F20

No

8

6

EP910PI-45

Texas Instruments

OT PLD

Industrial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

45 ns

No

5.5 V

CMOS

36

PAL-TYPE

5

5 V

In-Line

DIP40,.6

Programmable Logic Devices

Macrocell

4.5 V

240

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 24 I/O

12

-40 °C (-40 °F)

Dual

R-PDIP-T40

No

22.2 MHz

24

24

82S167AMJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

14

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

48

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

TIBPAL16R4-7MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

10 ns

Yes

5.5 V

TTL

MIL-PRF-38535

12

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

74 MHz

8

4

PAL16R4A-2MFK

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

12

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

16 MHz

8

8.89 mm

4

5962-94B0508QXA

Texas Instruments

Tin Lead

No

e0

TIBPAL20X10MFKB

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

10

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

EP610JC-30

Texas Instruments

UV PLD

Commercial

J Bend

28

QCCJ

Square

Ceramic, Metal-Sealed Cofired

32 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

160

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 16 I/O

4

0 °C (32 °F)

Quad

S-CQCC-J28

No

Zero Standby Function; 16 Macrocells With Configurable I/O

33.3 MHz

16

16

TGC105M

Texas Instruments

OT PLD

Military

5.5 V

CMOS

5

4.5 V

125 °C (257 °F)

0 Dedicated Inputs, 0 I/O

0

-55 °C (-67 °F)

No

0

TIBPAL16L8-15CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

e4

50 MHz

8

25.4 mm

6

5962-94B0504QZA

Texas Instruments

Tin Lead

No

e0

TIBPSG507CNT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

12 ns

No

5.25 V

TTL

13

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

4.75 V

80

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

No

Programmable Sequence Generator

35 MHz

8

0

TIBPAL20R6-7CFN

Texas Instruments

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

9 ns

Yes

5.25 V

TTL

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Mixed

4.75 V

64

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

1

4.57 mm

11.5062 mm

No

Register Preload; Power-Up Reset

74 MHz

8

11.5062 mm

2

SN74PL335N

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

15 MHz

6

SN74PL16R8-1N

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

35 MHz

8

TIBPAL22VP10-20CFN

Texas Instruments

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

TTL

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

120

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

37 MHz

10

11.5062 mm

10

TIBPAD18N8-6CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

6 ns

No

5.25 V

TTL

18

PAD-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

8

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 8 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8

24.195 mm

8

TIBPAL20R6-7MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

Register Preload; Power-Up Reset

74 MHz

8

2

5962-94B0512QUA

Texas Instruments

Tin Lead

No

e0

SNC54LS334J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

MIL-STD-883 Class B (Modified)

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

PAL16R8A-2CN

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

18 MHz

8

5962-94B0506QUA

Texas Instruments

Tin Lead

No

e0

8103614SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

40 ns

Yes

5.5 V

TTL

5

Flatpack

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

No

16 MHz

4

PAL20L8ACJW

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

70 °C (158 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Dual

R-GDIP-T24

No

8

6

5962-85155172X

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

9 ns

Yes

5.5 V

TTL

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

52.5 MHz

8.89 mm

6

TIBPAL22V10A-30MFKB

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic

35 ns

Yes

TTL

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

22 MHz

10

TIBPALT19L8CJW

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

TTL

19

PAL-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

70 °C (158 °F)

2 Dedicated Inputs, 6 I/O

2

0 °C (32 °F)

Dual

R-GDIP-T24

No

8

6

TIBPAL20X4-20CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

40

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T24

No

Power-Up Reset; 1 External Clock; Register Preload

35 MHz

10

6

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.