Texas Instruments Programmable Logic Devices (PLD) 1,713

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

TIBPAL16L8-12CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

12 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8

24.195 mm

6

8412908LX

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

35 ns

No

5.5 V

TTL

5

In-Line

Mixed

4.5 V

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-PDIP-T24

4.064 mm

7.62 mm

15.4 MHz

30.378 mm

6

PAL20L8-5NC

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5.5 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

5.08 mm

7.62 mm

111 MHz

31.915 mm

6

SN54PL16R6-1J

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

6

JM38510/50404BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

TTL

MIL-M-38510 Class B

5

In-Line

Mixed

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

No

e0

20 MHz

M38510/50602BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

No

41.6 MHz

8

0

5962-94B0502QYA

Texas Instruments

Tin Lead

No

e0

TIBPAL16R6-12MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

14 ns

Yes

5.5 V

TTL

MIL-PRF-38535

10

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

48 MHz

6

8.89 mm

No

2

TIBPAL16L8-15MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

15 ns

Yes

5.5 V

TTL

MIL-PRF-38535

16

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.45 mm

6.92 mm

No

50 MHz

8

6

PAL16R6A-2MJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

16 MHz

6

24.195 mm

2

TICPAL22V10Z-30INT

Texas Instruments

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.5 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDIP-T24

5.08 mm

7.62 mm

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

23.8 MHz

10

31.64 mm

10

5962-94B0505QTA

Texas Instruments

Tin Lead

No

e0

TIBPAL16L8-5CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

7 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8

24.195 mm

6

5962-94B0510Q5A

Texas Instruments

Tin Lead

No

e0

5962-8605303LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

MIL-STD-883

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

25 MHz

10

32.005 mm

10

81036122A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

16 MHz

8

8.89 mm

0

PAL16L8ACJ

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

25 ns

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T20

No

8

PAL16R8A-2CFN

Texas Instruments

OT PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

TTL

8

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J20

No

18 MHz

8

TIBPAL20R8-7CNT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.25 V

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T24

5.08 mm

7.62 mm

No

Register Preload; Power-Up Reset

e4

74 MHz

8

31.64 mm

0

TIEPAL10H16ET6CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

5.25 V

ECL10K

10

PAL-TYPE

5

5,-5.2 V

In-Line

DIP24,.3

Programmable Logic Devices

Latched

4.75 V

48

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 0 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T24

No

6

0

TIBPAL22V10ACFN

Texas Instruments

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

TTL

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

4.57 mm

11.5062 mm

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

e3

28.5 MHz

20 s

10

220 °C (428 °F)

11.5062 mm

10

TIBPAL22V10AC25FN

Texas Instruments

OT PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

TTL

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

10

TIBPAL22V10-5CFN

Texas Instruments

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

4 ns

Yes

5.25 V

Bipolar

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

117 MHz

10

11.5062 mm

10

5962-8767103LX

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

MIL-STD-883

5

In-Line

Mixed

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

28.5 MHz

2

TIBPAL22VP10-25MWB

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

MIL-STD-883

22

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

Macrocell

4.5 V

120

1.27 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDFP-F24

2.29 mm

9.085 mm

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

25 MHz

10

14.355 mm

10

M38510/50401BRX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

Bipolar

MIL-M-38510 Class B

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-CDIP-T20

Yes

6

TIBPAL22V10-35CNT

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

40 ns

No

TTL

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

132

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

18 MHz

10

5962-8767103LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

TTL

MIL-STD-883

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

28.5 MHz

8

32.005 mm

2

5962-94B0510QNA

Texas Instruments

Tin Lead

No

e0

TIBPAL16R4-25CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

TTL

MIL-STD-883

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset

e4

30 MHz

8

25.4 mm

4

5962-94B0512Q4A

Texas Instruments

Tin Lead

No

e0

5962-8515516SA

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

14 ns

Yes

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.45 mm

6.92 mm

No

48 MHz

8

4

5962-94B0508QZA

Texas Instruments

Tin Lead

No

e0

TIBPAL20R4-30MFKB

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

8

PAL16R6ACJ

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T20

No

6

5962-85155042X

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

20 ns

Yes

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

Chip Carrier

No

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

Yes

41.6 MHz

4

No

4

5962-94B0507QNX

Texas Instruments

No

8412904XA

Texas Instruments

OT PLD

Military

No Lead

28

HQCCN

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.25 V

TTL

MIL-STD-883

16

PAL-TYPE

5

5 V

Chip Carrier, Heat Sink/Slug

LCC28,.45SQ

Programmable Logic Devices

Mixed

4.75 V

64

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

28.5 MHz

8

11.43 mm

4

TIBPAL20L8-7MJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

7 ns

No

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

8

EP610DC-30

Texas Instruments

UV PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

32 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

160

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 16 I/O

4

0 °C (32 °F)

Dual

R-CDIP-T24

No

Zero Standby Function; 16 Macrocells With Configurable I/O

33.3 MHz

16

16

5962-94B0501QYA

Texas Instruments

Tin Lead

No

e0

TIBPAL20X4MFK

Texas Instruments

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic

Yes

TTL

16

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

25 MHz

10

TIBPAL16R6-15CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 2 I/O

8

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset

e4

50 MHz

6

25.4 mm

2

TIBPAL20L8-25CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Dual

R-GDIP-T24

No

8

6

5962-94B0502QZA

Texas Instruments

Tin Lead

No

e0

PAL22V10Z-25CJTL

Texas Instruments

UV PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

10

CMOS

22

PAL-TYPE

5

Tube

5 V

In-Line

DIP24,.3

Programmable Logic Devices

No

Macrocell

4.75 V

132

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

e0

31.2 MHz

10

32.005 mm

No

10

TIBPAL16R8-20MJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset

41.6 MHz

8

24.195 mm

0

PAL16R6A-2CN

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

6

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.