Texas Instruments Programmable Logic Devices (PLD) 1,713

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
TIBPAL16R8-30MW	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.5 V	TTL		8	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20			No	Power-Up Reset		25 MHz	8			0
5962-94B0505QMX	Texas Instruments																																			No
5962-94B0509Q6A	Texas Instruments																														Tin Lead					No		e0
5962-8515506RA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V	TTL	MIL-STD-883	8	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	Yes		e0	25 MHz	8	24.2 mm	No	0
TIBPAL16R4-30MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL	MIL-STD-883	12	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	No		e0	25 MHz	8	24.195 mm	No	4
TIBPAL16R8-12MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL	MIL-PRF-38535	8	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			48 MHz	8	24.195 mm		0
TIFPLA839MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	TTL		14	PLA-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial	4.5 V	32	1.27 mm	125 °C (257 °F)	14 Dedicated Inputs, 0 I/O	14	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No				6	11.43 mm		0
SNJ54LS335J	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	12	PLS-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				6
82S167ACJT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL		14	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24			No			12.5 MHz	6
5962-8767101LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	TTL	MIL-STD-883	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No			28.5 MHz	8	32.005 mm		6
5962-94B0504QMA	Texas Instruments																														Tin Lead					No		e0
TIBPAL16L8-10MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	12 ns	Yes	5.5 V	TTL	MIL-PRF-38535	10	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDFP-F20	2.45 mm	6.92 mm	No			52.5 MHz	8	13.09 mm		6
TIBPAL16R8-30MFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	TTL	MIL-STD-883	8	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQCC-N20	2.03 mm	8.89 mm	No		e0	25 MHz	8	8.89 mm	No	0
TIBPAL20R6-30MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes		TTL	38535Q/M;38534H;883B	14	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28			No			25 MHz	8
TIBPAL20R4-15CNT3	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No		TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24						37 MHz	8
5962-94B0504QZX	Texas Instruments																																			No
5962-8767105LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	Bipolar	MIL-STD-883			5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Dual	R-GDIP-T24			No							6
TIBPAL20R6-10CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL		14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24	5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset		55.5 MHz	8	31.64 mm		2
EP910JC-40	Texas Instruments	UV PLD	Commercial	J Bend	44	QCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.25 V	CMOS		36	PAL-TYPE	5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.75 V	240	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)		Quad	S-CQCC-J44			No			25 MHz	24			24
5962-94B0501QXX	Texas Instruments																																			No
82S105ACFN3	Texas Instruments	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy		Yes		TTL		16	PLS-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices				48	1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J28						12.5 MHz	8
TIBPAL20R4-7MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic	7 ns	Yes		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28			No			74 MHz	8
PAL20R4A-2MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes		TTL		16	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28			No			18 MHz	8
TIBPAL20L8-20MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	TTL		20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No				8	11.43 mm		6
8412903KA	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.25 V	TTL	38535Q/M;38534H;883B	14	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices		Mixed	4.75 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDFP-F24	2.29 mm	9.085 mm	No			28.5 MHz	8	14.355 mm		2
TIFPLA839CNT3	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No		TTL		14	PLA-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24							6
TIBPAL22V10AMJTB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	TTL	MIL-PRF-38535	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No			22 MHz	10	32.005 mm		10
5962-94B0513QYX	Texas Instruments																																			No
5962-94B0510QMA	Texas Instruments																														Tin Lead					No		e0
5962-94B0508Q5A	Texas Instruments																														Tin Lead					No		e0
5962-94B0503Q4X	Texas Instruments																																			No
TIBPALT19L8CFN	Texas Instruments	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V	TTL		19	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Combinatorial	4.75 V	64	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 6 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No				8	11.5062 mm		6
JM38510/50403BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No		TTL	MIL-M-38510 Class B			5			In-Line				Mixed				125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20			No		e0	20 MHz
5962-94B0506Q4X	Texas Instruments																																			No
TIBPAL16R6-30MFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	TTL	MIL-STD-883	10	PAL-TYPE	5	Tube	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQCC-N20	2.03 mm	8.89 mm	No		e0	25 MHz	6	8.89 mm	No	2
TIBPAL22V10-15CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	TTL		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Programmable Output Polarity; Shared Input/Clock		40 MHz	10	11.5062 mm		10
TIBPLS506CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	6 ns	Yes	5.25 V	TTL		13	PLS-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Registered	4.75 V	97	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Field-Programmable Logic Sequencer		33 MHz	8	11.5062 mm		0
SNJ54LS335W	Texas Instruments	EE PLD	Military	Flat	24	DFP	Rectangular	Ceramic		Yes		TTL	38535Q/M;38534H;883B	12	PLS-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices				32	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F24			No				6
PAL16R8AMJ	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V	TTL		8	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	No		e0	25 MHz	8	24.195 mm	No	0
5962-94B0507QMA	Texas Instruments																														Tin Lead					No		e0
SN74LS336JP4	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL		12	PLA-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24							6
JM38510/50502BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V	TTL	MIL-M-38510 Class B			5			In-Line				Registered	4.75 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	5.08 mm	7.62 mm	No		e0	40 MHz		32.005 mm		0
TIBPAL20R8-20MW	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	20 ns	Yes	5.5 V	TTL				5			Flatpack				Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDFP-F24			No	Register Preload; Power-Up Reset		28.5 MHz				0
TIBPAL16R8-20MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	TTL	MIL-PRF-38535	8	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20	5.08 mm	7.62 mm	No		e0	41.6 MHz	8	24.195 mm	No	0
5962-8767115LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	TTL	MIL-STD-883	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No			50 MHz	8	32.005 mm		6
SN54LS333J	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL		12	PLS-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				6
TICPAL16L8-55CN	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	CMOS		16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Dual	R-PDIP-T20	5.08 mm	7.62 mm	No				8	24.325 mm		6
TIBPAL20R8-10MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	TTL		12	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28	2.03 mm	11.43 mm	No	Register Preload; Power-Up Reset		50 MHz	8	11.43 mm		0

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.