Texas Instruments Programmable Logic Devices (PLD) 1,713

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

TIBPAL20R4-30MFK

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

16

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

25 MHz

8

11.43 mm

4

5962-87671013X

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

20 ns

Yes

5.5 V

TTL

MIL-STD-883

20

PAL-TYPE

5

Chip Carrier

No

Combinatorial

4.5 V

125 °C (257 °F)

14 Dedicated Inputs, 6 I/O

14

-55 °C (-67 °F)

Quad

S-CQCC-N28

Yes

6

No

6

TIBPAL16L8-12MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

14 ns

No

5.5 V

TTL

MIL-PRF-38535

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

48 MHz

8

24.195 mm

6

TIBPAL16L8-10CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8

24.195 mm

6

5962-94B0510QUA

Texas Instruments

Tin Lead

No

e0

5962-94B0509Q6X

Texas Instruments

No

EP330-12CN

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

13 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

72

2.54 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

71.4 MHz

8

24.325 mm

8

TIEPAL10016TE6CJT

Texas Instruments

OT PLD

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

6 ns

No

5.25 V

ECL100K

10

PAL-TYPE

5

5,-5.2 V

In-Line

DIP24,.3

Programmable Logic Devices

Latched

4.75 V

48

2.54 mm

85 °C (185 °F)

10 Dedicated Inputs, 0 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T24

No

6

0

TIBPAL20R6-15CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

18 ns

No

5.25 V

TTL

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Dual

R-GDIP-T24

No

Register Preload; Power-Up Reset

37 MHz

8

2

TIBPAL16R8-30MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

e0

25 MHz

8

13.09 mm

No

0

PAL16L8A-2MFK

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

16

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

8

8.89 mm

6

5962-87671053X

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

14 Dedicated Inputs, 6 I/O

14

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

6

TIBPAL16L8-10CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

e4

55.5 MHz

8

24.325 mm

6

TIBPAL20R4-12MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

12 ns

No

5.5 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

Power-Up Reset; Security Fuse

48 MHz

8

4

TIBPAL16R8-10CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset; Register Preload

55.5 MHz

8

24.195 mm

0

SN54LS334W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

12

PLA-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

TIBPAL16L8-7MFK

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

TTL

16

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

74 MHz

8

8.89 mm

6

TIBPAL16L8-7MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic

7 ns

Yes

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Combinatorial

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

8

EP1830-20CFN

Texas Instruments

OT PLD

Commercial

J Bend

68

QCCJ

Square

Plastic/Epoxy

22 ns

Yes

5.25 V

48

CMOS

5

5 V

Chip Carrier

LDCC68,1.0SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 48 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J68

4.57 mm

24.2316 mm

No

F_Max for 12-bit counter application is 50 MHz; Labs interconnected by PIA; 4 Labs; 48 Macrocells

24.2316 mm

No

48

TIB82S105BCFN

Texas Instruments

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

TTL

16

PLS-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

4.75 V

48

1.27 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Programmable Logic Sequencer

30 MHz

8

11.5062 mm

0

5962-8515502SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

15 ns

Yes

5.5 V

TTL

MIL-STD-883

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

No

41.6 MHz

0

5962-85155112A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 ns

Yes

5.5 V

TTL

MIL-STD-883

10

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

50 MHz

6

8.89 mm

2

8412903XX

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

20 ns

Yes

5.5 V

TTL

5

Chip Carrier

Mixed

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

28.5 MHz

2

5962-94B0501QUX

Texas Instruments

No

TIBPAL16R4-15CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset

e4

50 MHz

8

25.4 mm

4

PAL16R4A-2CN

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

28.6 MHz

8

TIBPAL16R4-7MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

MIL-PRF-38535

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

74 MHz

8

24.195 mm

4

PAL16L8AMJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

16

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.195 mm

No

6

5962-94B0502QNX

Texas Instruments

No

TIBPAL16L8-30MFHB

Texas Instruments

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic

30 ns

Yes

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Combinatorial

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

8

TIBPAL20L8-7MFKB

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic

7 ns

Yes

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Combinatorial

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

8

5962-94B0512QZA

Texas Instruments

Tin Lead

No

e0

TICHAL16R8-35CDW

Texas Instruments

Mask PLD

Commercial Extended

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

35 ns

Yes

5.5 V

CMOS

5

Small Outline

Registered

4.5 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

1 External Clock

18 MHz

12.8 mm

0

5962-94B0503QXA

Texas Instruments

Tin Lead

No

e0

PAL16R6A-2MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

10

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

16 MHz

6

8.89 mm

2

EP630-25IFZ

Texas Instruments

OT PLD

Industrial

J Bend

28

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier, Window

FL(UNSPEC)

Programmable Logic Devices

Macrocell

4.5 V

160

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 16 I/O

4

-40 °C (-40 °F)

Quad

S-CQCC-J28

4.57 mm

11.24 mm

No

40 MHz

16

11.24 mm

16

TIBPAL20L8-30MFK

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

20

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

14 Dedicated Inputs, 6 I/O

14

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

8

11.43 mm

6

5962-94B0506Q5X

Texas Instruments

No

5962-94B0504Q4A

Texas Instruments

Tin Lead

No

e0

TIBPAL20X4-20CNT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

20 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

40

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-PDIP-T24

No

Power-Up Reset; 1 External Clock; Register Preload

35 MHz

10

6

TIBPAL16R6-25CFN

Texas Instruments

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

TTL

MIL-STD-883

10

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Mixed

4.75 V

64

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 2 I/O

8

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQCC-J20

3

4.57 mm

8.965 mm

No

Power-Up Reset

e4

30 MHz

30 s

6

245 °C (473 °F)

8.965 mm

2

SN74LS335NP1

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

6

5962-87671063A

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

2

TIBPAL16R4-30MFK

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

12

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

Power-Up Reset

25 MHz

8

8.89 mm

4

8103612RX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

5

In-Line

Registered

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

No

16 MHz

0

TIBPAD18N8-6CFN

Texas Instruments

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

6 ns

Yes

5.25 V

TTL

18

PAD-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Combinatorial

4.75 V

8

1.27 mm

75 °C (167 °F)

10 Dedicated Inputs, 8 I/O

10

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.9662 mm

No

8

8.9662 mm

8

TIBPAL20R6-20MFK

Texas Instruments

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.5 V

TTL

14

PAL-TYPE

5

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

Register Preload; Power-Up Reset

28.5 MHz

8

11.43 mm

2

5962-94B0511Q5A

Texas Instruments

Tin Lead

No

e0

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.