Xilinx Programmable Logic Devices (PLD) 1,918

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC95108-20PQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.5 V	108	CMOS			5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3		30 s		245 °C (473 °F)	20 mm	Yes	81
XC9536XV-5VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	2.62 V	36	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.37 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	222.2 MHz	30 s		240 °C (464 °F)	10 mm	Yes	34
XC7372-10PC84C	Xilinx	OT PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 37 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops	e0	71.4 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	37
XCR3512XL-12FG324C	Xilinx	EE PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	512	CMOS			3.3	3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 260 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	23 mm	Yes	260
XC73108-10PG144C	Xilinx	UV PLD	Commercial	Pin/Peg	144	WPGA	Square	Ceramic, Metal-Sealed Cofired	25 ns	No	5.25 V	108	CMOS			5	3.3/5,5 V	Grid Array, Window	PGA144,15X15	Programmable Logic Devices	No	Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Perpendicular	S-CPGA-P144	1	3.683 mm	39.624 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		62.5 MHz				39.624 mm	No	78
XC2C128-7TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS	100	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	119 MHz		100		20 mm	Yes	100
XC95108-7PCG84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	108	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3		30 s		245 °C (473 °F)	29.3116 mm	Yes	69
XC95144XV-7CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	144	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.37 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	125 MHz	30 s		260 °C (500 °F)	12 mm	Yes	117
XC73108-10PQ160C	Xilinx	OT PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	25 ns	Yes	5.25 V	108	CMOS			5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	62.5 MHz	30 s		225 °C (437 °F)	28 mm	No	78
XCR22LV10-15PC28C	Xilinx	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS	22	PAL-TYPE	3.3	3.3 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No			95 MHz		10		11.5062 mm		10
XCR3032XL-10VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS			3.3	3/3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	95 MHz				10 mm	Yes	36
XC9536XV-7CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	36	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1		30 s		260 °C (500 °F)	7 mm	Yes	36
XC73108-15WB225I	Xilinx	UV PLD	Industrial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	36 ns	Yes	5.5 V	108	CMOS			5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V		1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		45.5 MHz					No	78
XCR3032XL-7CSG48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS			3.3	3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	119 MHz	30 s		260 °C (500 °F)	7 mm	Yes	36
XC9572XV-7TQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	72	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	125 MHz	30 s		225 °C (437 °F)	14 mm	Yes	72
XH95144-7PQG160C	Xilinx	Mask PLD		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS			5		Flatpack				Macrocell			.65 mm		0 Dedicated Inputs, 133 I/O	0		Matte Tin	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No		e3					28 mm		133
XC95108F-10PCG84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS			5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	67 MHz	30 s		245 °C (473 °F)	29.3116 mm		69
XC95144-15PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	144	CMOS			5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	20 mm	Yes	81
XH95576-7HQ304C	Xilinx	Mask PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes			CMOS			5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell			.5 mm		0 Dedicated Inputs, 232 I/O	0		Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No		e0					40 mm		232
XC9572XL-5PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	72	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells	e0	178.6 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XCR3064XL-7CS48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 40 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	7 mm	Yes	40
XC2C64-7CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS			1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0		30 s		240 °C (464 °F)	6 mm	Yes	45
XCR3064-12PC84C	Xilinx	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	64
XC7272-30WC68C	Xilinx	UV PLD	Commercial	J Bend	68	QCCJ	Square	Ceramic	48 ns	Yes		72	CMOS			5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No				1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-XQCC-J68				No								No
XC95144-15PQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	144	CMOS			5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	20 mm	Yes	81
XC95288XV-7TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	288	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	125 MHz	30 s		260 °C (500 °F)	20 mm	Yes	117
XC9572XL-10VQ44Q	Xilinx	Flash PLD	Automotive	Gull Wing	44	QFP	Square	Plastic	10 ns	Yes		72	CMOS				2.5/3.3,3.3 V	Flatpack	TQFP44,.47SQ,32	Programmable Logic Devices	Yes				.8 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3			No		e0		30 s		240 °C (464 °F)		Yes
XC73144-12PQ160C	Xilinx	OT PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	30 ns	Yes	5.25 V	144	CMOS			5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	12 Dedicated Inputs, 110 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	55.6 MHz	30 s		225 °C (437 °F)	28 mm	No	110
XC9536-6PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	6 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	100 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9536XL-5PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	36	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e0	178.6 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9536XL-7PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	36	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	125 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XCR3256XL-7.5TQG144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS			3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V		.5 mm	70 °C (158 °F)	116 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	167 MHz	30 s		260 °C (500 °F)	20 mm		116
XCR3064XL-6CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V		CMOS			3.3		Grid Array, Fine Pitch				Macrocell	2.7 V		.8 mm	85 °C (185 °F)	32 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	167 MHz				7 mm		32
XH95180-10HQG208C	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes			CMOS			5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell			.5 mm		0 Dedicated Inputs, 168 I/O	0		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm		168
XC9572-15TQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	55.6 MHz	30 s		260 °C (500 °F)	14 mm	Yes	72
XC7336-7PQ44C	Xilinx	OT PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Flatpack	QFP44,.5SQ,20	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	2.35 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	125 MHz	30 s		225 °C (437 °F)	10 mm	No	32
XC9572-15PCG84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	72	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	29.3116 mm	Yes	69
XH95288-10HQ208C	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes			CMOS			5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell			.5 mm		0 Dedicated Inputs, 168 I/O	0		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm		168
XC9536XL-7CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	36	CMOS	36		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	138.88 MHz	30 s	36	260 °C (500 °F)	7 mm	Yes	36
XCR3064XL-7CPG56C	Xilinx	EE PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 48 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e1	119 MHz	30 s		260 °C (500 °F)	6 mm	Yes	48
XC2C512-7PQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	512	CMOS	173	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	119 MHz		173		28 mm	Yes	173
XC7336-10PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	100 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC95216-10PQG160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	216	CMOS			5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 133 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160	3	3.7 mm	28 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	66.7 MHz	30 s		245 °C (473 °F)	28 mm	Yes	133
XC95288-10BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	288	CMOS			5	3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XC7272A-25PC84I	Xilinx	OT PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	40 ns	Yes	5.5 V	72	CMOS			5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 42 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells	e0	40 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	42
XCR3032C-10PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.63 V	32	CMOS			3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	57 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XC9572F-10PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic	10 ns	Yes		72	CMOS				3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No				1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3			No		e0		30 s		225 °C (437 °F)		Yes
XC7336Q-12WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	19 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops		80 MHz				16.51 mm	No	32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.