Xilinx Programmable Logic Devices (PLD) 1,918

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR3064XL-7VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS				3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	119 MHz				14 mm	Yes	68
XC9572F-15PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	56 MHz				29.3116 mm		69
XC9572XV-4PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	4 ns	Yes	2.62 V	72	CMOS				2.5	1.8/3.3,2.5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.37 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	250 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC7372-12PQ160I	Xilinx	OT PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	12 ns	Yes		72	CMOS					3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No			.635 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3			No		e0		30 s		225 °C (437 °F)		No
XC95144-10PQG160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	144	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 133 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e3	67.7 MHz	30 s		245 °C (473 °F)	28 mm	Yes	133
XCR3256XL-10TQ144Q	Xilinx	EE PLD	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V		CMOS				3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 120 I/O	0	-40 °C (-40 °F)	Nickel/Palladium/Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4					20 mm		120
XC95216-20BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	216	CMOS				5	3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	50 MHz	30 s		225 °C (437 °F)	35 mm	Yes	166
XC73108-15PQ160C	Xilinx	OT PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	36 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	45.5 MHz	30 s		225 °C (437 °F)	28 mm	No	78
XCR3384XL-12FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS				3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	83 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
XC7372-15PC84I	Xilinx	OT PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	33 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops	e0	52.6 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	37
XCR5128-10PC84I	Xilinx	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	128	CMOS				5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	66 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	64
XC9572XL-10TQ100Q	Xilinx	Flash PLD	Automotive	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS				3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0		30 s		225 °C (437 °F)	14 mm	Yes	72
XC2C256-5PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	256	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Real Digital Design Technology	e3		30 s		245 °C (473 °F)	28 mm	Yes	173
XC73144-15PG184M	Xilinx	UV PLD	Military	Pin/Peg	184	PGA	Square	Ceramic, Metal-Sealed Cofired	36 ns	No	5.5 V		CMOS				5		Grid Array				Macrocell	4.5 V		125 °C (257 °F)	0 Dedicated Inputs, 120 I/O	0	-55 °C (-67 °F)		Perpendicular	S-CPGA-P184				No	144 Macrocells With Programmable I/O Architecture		45.5 MHz						120
XC2C32-6CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 33 I/O	1	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1		30 s		260 °C (500 °F)	6 mm	Yes	33
XCR3512XL-12FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	512	CMOS				3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
XC95288XV-10FGG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	2.62 V	288	CMOS				2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	100 MHz	30 s		260 °C (500 °F)	17 mm	Yes	192
XC95288XL-7FG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	125 MHz	30 s	192	225 °C (437 °F)	17 mm	Yes	192
XCR3256XL-7TQ144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	256	CMOS				3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 120 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	154 MHz				20 mm	Yes	120
XC7318-7PQ44C	Xilinx	OT PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	18	CMOS				5	3.3/5,5 V	Flatpack	QFP44,.5SQ,20	Programmable Logic Devices	No	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	16 Dedicated Inputs, 17 I/O	16	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	2.35 mm	10 mm	No	18 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 18 Flip Flops	e0	125 MHz	30 s		225 °C (437 °F)	10 mm	No	17
XC9572XL-7CSG48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS		38		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 38 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e1	125 MHz	30 s	38	260 °C (500 °F)	7 mm	Yes	38
XC2C256-6PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	256	CMOS		173	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Real Digital Design Technology	e3	139 MHz	30 s	173	245 °C (473 °F)	28 mm	Yes	173
XC7272-30WC84I	Xilinx	UV PLD	Industrial	J Bend	84	QCCJ	Square	Ceramic	48 ns	Yes		72	CMOS				5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No			1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-XQCC-J84				No								No
XCR3128XL-10CS144C	Xilinx	EE PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	128	CMOS				3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	12 mm	Yes	108
XC95288XL-7BGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	125 MHz	30 s	192	250 °C (482 °F)	27 mm	Yes	192
XCR22LV10-15SO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS				3.3		Small Outline				Macrocell	3 V	1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			95 MHz				15.4 mm		10
XC95108-20PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XCR3256XL-7.5CS280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS				3.3		Grid Array, Thin Profile, Fine Pitch				Macrocell	2.7 V	.8 mm	85 °C (185 °F)	160 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	167 MHz				16 mm		160
XCR3064XL-6VQG100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	64	CMOS				3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	192 MHz	30 s		260 °C (500 °F)	14 mm	Yes	68
XC7336-10PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	100 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XCR3320-10BG256C	Xilinx	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	320	CMOS				3.3	3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 3 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	87 MHz	30 s		225 °C (437 °F)	27 mm	Yes	3
XC2C32-6CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 33 I/O	1	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0		30 s		240 °C (464 °F)	6 mm	Yes	33
XH95180-7PQ160I	Xilinx	Mask PLD		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack				Macrocell		.65 mm		0 Dedicated Inputs, 133 I/O	0		Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No		e0					28 mm		133
XC7236A-16WC44I	Xilinx	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	36	CMOS				5	3/5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V		60 MHz				16.51 mm	No	30
XCR5128-10TQ128C	Xilinx	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.25 V	128	CMOS				5	5 V	Flatpack, Low Profile, Fine Pitch	QFP128,.63X.87,20	Programmable Logic Devices	Yes	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 97 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1	1.6 mm	14 mm	No			71 MHz				20 mm	Yes	97
XC2C64A-5PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS				1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e0	333 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	33
XC9572-10PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XCR5064-10PQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	64	CMOS				5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	20 mm	No	64
XA2C64A-8VQG100Q	Xilinx	Flash PLD	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	14 mm	Yes	64
XC95216-10HQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS				5		Flatpack, Fine Pitch				Macrocell	4.75 V	.4 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	66.7 MHz	30 s		245 °C (473 °F)	28 mm		166
XC95288-15BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	288	CMOS				5	3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XC2C32A-3PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	3 ns	Yes	1.9 V		CMOS				1.8		Chip Carrier				Macrocell	1.7 V	1.27 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	500 MHz				16.5862 mm		33
XC95288XL-6BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	288	CMOS				3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	288 Macrocells	e0	151.5 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XC95144XV-5TQ144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4 ns	Yes	2.6 V						2.5		Flatpack, Low Profile, Fine Pitch				Registered	2.4 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0					20 mm		117
XC95432-10BG432C	Xilinx	Flash PLD	Commercial	Ball	432	LBGA	Square	Plastic/Epoxy	10 ns	Yes			CMOS				5		Grid Array, Low Profile				Macrocell		1.27 mm	70 °C (158 °F)	232 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0					40 mm		232
XC7354-15PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	32 ns	Yes	5.5 V	54	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 25 I/O	8	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops	e0	55.6 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	25
XC95144-10PQ160	Xilinx	Flash PLD		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack				Macrocell		.65 mm		0 Dedicated Inputs, 133 I/O	0		Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable	e0					28 mm		133
XH95288-7HQ304I	Xilinx	Mask PLD		Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 192 I/O	0		Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No		e0					40 mm		192

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.