Xilinx Programmable Logic Devices (PLD) 1,918

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

XA95144XL-15CSG144I

Xilinx

Flash PLD

Industrial

Ball

144

BGA

Square

Plastic/Epoxy

15.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

30 s

260 °C (500 °F)

12 mm

117

XAC2C128-8VQG100Q

Xilinx

Flash PLD

Automotive

Flat

100

QFF

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

128

CMOS

AEC-Q100

80

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 80 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-F100

3

1.2 mm

14 mm

No

e3

119 MHz

30 s

80

260 °C (500 °F)

14 mm

Yes

80

XCR22V10-10PC28I

Xilinx

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.572 mm

11.5062 mm

No

74 MHz

11.5062 mm

10

XC9572-7PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

4.572 mm

16.5862 mm

No

e0

83.3 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

69

XH95432-7HQ304C

Xilinx

Mask PLD

Gull Wing

304

HFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

0 Dedicated Inputs, 232 I/O

0

Tin Lead

Quad

S-PQFP-G304

3

4.5 mm

40 mm

No

e0

40 mm

232

XC9536-15VQ44Q

Xilinx

Flash PLD

Automotive

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

36

CMOS

5

3.3/5,5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.5 V

.8 mm

125 °C (257 °F)

34 I/O

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

30 s

240 °C (464 °F)

10 mm

Yes

34

XC9572-7PCG84

Xilinx

Flash PLD

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

Macrocell

1.27 mm

0 Dedicated Inputs, 69 I/O

0

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable

e3

29.3116 mm

69

XH95216-10PQ160I

Xilinx

Mask PLD

Gull Wing

160

QFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack

Macrocell

.65 mm

0 Dedicated Inputs, 133 I/O

0

Tin Lead

Quad

S-PQFP-G160

3

3.94 mm

28 mm

No

e0

28 mm

133

XC7372-15PG84I

Xilinx

OT PLD

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

33 ns

No

5.5 V

72

CMOS

5

3.3/5,5 V

Grid Array

PGA84M,11X11

Programmable Logic Devices

No

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 37 I/O

12

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops

52.6 MHz

27.94 mm

No

37

XC7372-15PC84C

Xilinx

OT PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

33 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 37 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops

e0

52.6 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

37

XC7336Q-15PQ44C

Xilinx

OT PLD

Commercial

Gull Wing

44

QFP

Square

Plastic/Epoxy

23 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Flatpack

QFP44,.5SQ,32

Programmable Logic Devices

No

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

2.35 mm

10 mm

No

36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops

e0

66.7 MHz

30 s

225 °C (437 °F)

10 mm

No

32

XH95216-10HQ208C

Xilinx

Mask PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

0 Dedicated Inputs, 168 I/O

0

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

28 mm

168

XC7272A-25WC84C

Xilinx

UV PLD

Commercial

J Bend

84

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.25 V

72

CMOS

5

5 V

Chip Carrier, Window

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 42 I/O

12

0 °C (32 °F)

Quad

S-CQCC-J84

1

4.826 mm

29.21 mm

No

PAL Blocks interconnected by PIA; 72 Macrocells

40 MHz

29.21 mm

No

42

XA2C128-7CPG132I

Xilinx

Flash PLD

Industrial

Ball

132

TFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

128

CMOS

AEC-Q100

1.8

1.5/3.3,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

112 MHz

30 s

260 °C (500 °F)

8 mm

Yes

100

XCR5128-7PC84C

Xilinx

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

9.5 ns

Yes

5.25 V

128

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

95 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

64

XC95288XL-6BGG352C

Xilinx

Flash PLD

Commercial

Ball

352

LBGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Low Profile

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B352

3

1.7 mm

35 mm

No

288 Macrocells

e1

151.5 MHz

30 s

260 °C (500 °F)

35 mm

192

XC95108-15TQG100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

HLFQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

108

CMOS

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 81 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

30 s

260 °C (500 °F)

14 mm

Yes

81

XC95108-7TQ100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

HLFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 81 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

30 s

225 °C (437 °F)

14 mm

Yes

81

XC9572XV-5VQG44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

5 ns

Yes

2.62 V

72

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

2.37 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

222 MHz

30 s

260 °C (500 °F)

10 mm

Yes

34

XC9572F-15PQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 72 I/O

0

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

56 MHz

30 s

245 °C (473 °F)

20 mm

72

XC9572XL-10CS48C

Xilinx

Flash PLD

Commercial

Ball

48

FBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

72

CMOS

38

3.3

2.5/3.3,3.3 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 38 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

72 Macrocells

e0

100 MHz

30 s

38

240 °C (464 °F)

7 mm

Yes

38

XC7336Q-10WC44C

Xilinx

UV PLD

Commercial

J Bend

44

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

15 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC44,.7SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-CQCC-J44

1

4.826 mm

16.51 mm

No

36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops

100 MHz

16.51 mm

No

32

XC7354-10WC44I

Xilinx

UV PLD

Industrial

J Bend

44

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

22 ns

Yes

5.5 V

54

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC44,.7SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 25 I/O

8

-40 °C (-40 °F)

Tin Lead

Quad

S-CQCC-J44

1

4.826 mm

16.51 mm

No

54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops

e0

76.9 MHz

16.51 mm

No

25

XC7336-15PC44I

Xilinx

OT PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

23 ns

Yes

5.5 V

36

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops

e0

66.7 MHz

30 s

225 °C (437 °F)

16.5862 mm

No

32

XCR5032C-6VQ44C

Xilinx

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

6 ns

Yes

5.25 V

32

CMOS

5

5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

111 MHz

30 s

240 °C (464 °F)

10 mm

Yes

32

XC7354-7PC44C

Xilinx

OT PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

16.5 ns

Yes

5.25 V

54

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 25 I/O

8

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops

e0

95.2 MHz

30 s

225 °C (437 °F)

16.5862 mm

No

25

XC95108-20TQ100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

HLFQFP

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

108

CMOS

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 81 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

30 s

225 °C (437 °F)

14 mm

Yes

81

XC7336-5PC44C

Xilinx

OT PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

8.5 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops

e0

167 MHz

30 s

225 °C (437 °F)

16.5862 mm

No

32

XC7372-7PC68I

Xilinx

OT PLD

Industrial

J Bend

68

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

72

CMOS

3.3/5,5 V

Chip Carrier

LDCC68,1.0SQ

Programmable Logic Devices

No

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J68

No

e0

No

XC7336-10WC44C

Xilinx

UV PLD

Commercial

J Bend

44

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

15 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC44,.7SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-CQCC-J44

1

4.826 mm

16.51 mm

No

36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops

100 MHz

16.51 mm

No

32

XC2C64A-5PCG44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

64

CMOS

1.8

1.5/3.3,1.8 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 33 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

Real Digital Design Technology

e3

333 MHz

30 s

245 °C (473 °F)

16.5862 mm

Yes

33

XC73144-10PQ160C

Xilinx

OT PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

22 ns

Yes

5.25 V

144

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

12 Dedicated Inputs, 110 I/O

12

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G160

3

4.1 mm

28 mm

No

144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops

e0

62.5 MHz

30 s

225 °C (437 °F)

28 mm

No

110

XC73108-15WC84C

Xilinx

UV PLD

Commercial

J Bend

84

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

36 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 37 I/O

12

0 °C (32 °F)

Quad

S-CQCC-J84

1

4.826 mm

29.21 mm

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops

45.5 MHz

29.21 mm

No

37

XC9536-5PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e0

100 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XC95144XV-7TQG144I

Xilinx

Flash PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

144

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

2.37 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

125 MHz

30 s

260 °C (500 °F)

20 mm

Yes

117

XC95288XL-10BGG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e1

100 MHz

30 s

192

250 °C (482 °F)

27 mm

Yes

192

XCR3384XL-12PQ208C

Xilinx

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

384

CMOS

3.3

3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 172 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e4

83 MHz

28 mm

Yes

172

XC9536XV-3CSG48C

Xilinx

Flash PLD

Commercial

Ball

48

FBGA

Square

Plastic/Epoxy

3.5 ns

Yes

2.6 V

2.5

Grid Array, Fine Pitch

Registered

2.4 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

e1

7 mm

36

XC7372-10WC84I

Xilinx

UV PLD

Industrial

J Bend

84

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

23 ns

Yes

5.5 V

72

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 37 I/O

12

-40 °C (-40 °F)

Quad

S-CQCC-J84

1

4.826 mm

29.21 mm

No

72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops

71.4 MHz

29.21 mm

No

37

XC2C512-6PQ208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

512

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 173 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

30 s

225 °C (437 °F)

28 mm

Yes

173

XC95108-10PQ160I

Xilinx

Flash PLD

Industrial

Gull Wing

160

HQFP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.5 V

108

CMOS

5

3.3/5,5 V

Flatpack, Heat Sink/Slug

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 108 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G160

3

4.1 mm

28 mm

No

e0

30 s

225 °C (437 °F)

28 mm

Yes

108

XH95576-7HQG304C

Xilinx

Mask PLD

Gull Wing

304

HFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

0 Dedicated Inputs, 232 I/O

0

Matte Tin

Quad

S-PQFP-G304

4.5 mm

40 mm

No

e3

40 mm

232

XC7372-12WC68I

Xilinx

UV PLD

Industrial

J Bend

68

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

28 ns

Yes

5.5 V

72

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC68,1.0SQ

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

10 Dedicated Inputs, 25 I/O

10

-40 °C (-40 °F)

Quad

S-CQCC-J68

1

4.826 mm

24.13 mm

No

72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops

62.5 MHz

24.13 mm

No

25

XC95108F-10PQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 81 I/O

0

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

67 MHz

30 s

245 °C (473 °F)

20 mm

81

XCR5128-15VQ100I

Xilinx

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

17.5 ns

Yes

5.5 V

128

CMOS

5

5 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e0

63 MHz

30 s

240 °C (464 °F)

14 mm

Yes

80

XCR3064XL-7PCG44C

Xilinx

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

CMOS

3.3

3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

2.7 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e3

119 MHz

30 s

245 °C (473 °F)

16.5862 mm

Yes

36

XC2C32-6VQG44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

32

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

1.7 V

.8 mm

70 °C (158 °F)

1 Dedicated Inputs, 33 I/O

1

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

Real Digital Design Technology

e3

30 s

260 °C (500 °F)

10 mm

Yes

33

XH95180-10HQ208I

Xilinx

Mask PLD

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

0 Dedicated Inputs, 168 I/O

0

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

28 mm

168

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.