Xilinx Programmable Logic Devices (PLD) 1,918

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR5064C-7VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	64	CMOS			5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	105 MHz	30 s		240 °C (464 °F)	14 mm	Yes	64
XC73108-12WC84I	Xilinx	UV PLD	Industrial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	108	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	55.6 MHz				29.21 mm	No	37
XC7372-12PC84I	Xilinx	OT PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	28 ns	Yes	5.5 V	72	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops	e0	62.5 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	37
XC7336-12WC44I	Xilinx	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	19 ns	Yes	5.5 V	36	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops		80 MHz				16.51 mm	No	32
XC7336-12PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	19 ns	Yes	5.5 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	80 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XCR3032XL-5CSG48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	32	CMOS			3.3	3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	213 MHz	30 s		260 °C (500 °F)	7 mm	Yes	36
XC9572XV-5VQ64	Xilinx																												Tin Lead			3					e0		30 s		240 °C (464 °F)
XC95144XV-5TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5 ns	Yes	2.62 V	144	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	222.2 MHz	30 s		260 °C (500 °F)	20 mm	Yes	117
XCR3128XL-10TQ144Q	Xilinx	EE PLD	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	128	CMOS			3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	95 MHz	30 s		225 °C (437 °F)	20 mm	Yes	108
XC95144XV-5CS144C	Xilinx	Flash PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	5 ns	Yes	2.62 V	144	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	222.2 MHz	30 s		240 °C (464 °F)	12 mm	Yes	117
XC95144XV-5TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5 ns	Yes	2.62 V	144	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	222.2 MHz	30 s		225 °C (437 °F)	20 mm	Yes	117
XCR3032C-10VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.63 V	32	CMOS			3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.97 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	58.8 MHz	30 s		240 °C (464 °F)	10 mm	Yes	32
XC7318-5PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	8.5 ns	Yes	5.25 V	18	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	16 Dedicated Inputs, 17 I/O	16	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	18 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 18 Flip Flops	e0	167 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	17
XC95288XV-10CS280C	Xilinx	Flash PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	2.62 V	288	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	100 MHz	30 s		240 °C (464 °F)	16 mm	Yes	192
XCR3032-10PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.6 V		CMOS			3.3		Chip Carrier				Macrocell	3 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 33 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			58.8 MHz				16.5862 mm		33
XC73108-20PG144C	Xilinx	UV PLD	Commercial	Pin/Peg	144	WPGA	Square	Ceramic, Metal-Sealed Cofired	45 ns	No	5.25 V	108	CMOS			5	3.3/5,5 V	Grid Array, Window	PGA144,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Perpendicular	S-CPGA-P144	1	3.683 mm	39.624 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		35.7 MHz				39.624 mm	No	78
XC2C32A-3VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	3 ns	Yes	1.9 V		CMOS			1.8		Flatpack, Thin Profile				Macrocell	1.7 V	.8 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	500 MHz				10 mm		33
XCR3128-12TQ128I	Xilinx	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.63 V	128	CMOS			3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.63X.87,20	Programmable Logic Devices	Yes	Macrocell	2.97 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			69 MHz				20 mm	Yes	96
XC9572-7PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	83.3 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
XC95108F-15PCG84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			5		Chip Carrier				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	56 MHz				29.3116 mm		69
XC95288XV-6FG256	Xilinx																												Tin Lead			3					e0		30 s		225 °C (437 °F)
XC95288-10HQG208	Xilinx	Flash PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes			CMOS			5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm		0 Dedicated Inputs, 167 I/O	0		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable	e3					28 mm		167
XC2C64A-4PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	4 ns	Yes	1.9 V		CMOS			1.8		Chip Carrier				Macrocell	1.7 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No		e0	454 MHz				16.5862 mm		33
XC7372-12PQ100C	Xilinx	OT PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	28 ns	Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	12 Dedicated Inputs, 42 I/O	12	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops	e0	62.5 MHz	30 s		225 °C (437 °F)	20 mm	No	42
XC2C256-7CP132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	256	CMOS	106	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e0	108 MHz	30 s	106	240 °C (464 °F)	8 mm	Yes	106
XCR3128XL-10VQG100Q	Xilinx	EE PLD	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS			3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	95 MHz	30 s		260 °C (500 °F)	14 mm		84
XC9536-7PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	83.3 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9572XL-7CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS	38		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 38 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e0	125 MHz	30 s	38	240 °C (464 °F)	7 mm	Yes	38
XC9536XL-4VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	4 ns	Yes	3.6 V		CMOS			3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	36 Macrocells	e3	200 MHz				10 mm		36
XCR5128-12PC84C	Xilinx	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	5.25 V	128	CMOS			5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	63 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	64
XCR3128XL-7CS144I	Xilinx	EE PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS			3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	12 mm	Yes	108
XC2C32-3PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	3 ns	Yes	1.9 V	32	CMOS			1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 33 I/O	1	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e0		30 s		225 °C (437 °F)	16.5862 mm	Yes	33
XC95216-20BGG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS			5		Grid Array, Low Profile				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 166 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e1	50 MHz	30 s		260 °C (500 °F)	35 mm		166
XC9536F-10VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS			5		Flatpack, Thin Profile				Macrocell	4.75 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	67 MHz	30 s		260 °C (500 °F)	10 mm		34
XA9572XL-15VQG64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	15.5 ns	Yes	3.6 V		CMOS			3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm		52
XC95288XV-6PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6 ns	Yes	2.62 V	288	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	208 MHz	30 s		245 °C (473 °F)	28 mm	Yes	168
XC2C384-10FT256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	83 MHz	30 s	212	225 °C (437 °F)	17 mm	Yes	212
XC95288XV-6TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6 ns	Yes	2.62 V	288	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	208 MHz	30 s		225 °C (437 °F)	20 mm	Yes	117
XCR5064-10PC84C	Xilinx	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS			5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	64
XCR3384XL-12FG324C	Xilinx	EE PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS			3.3	3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 220 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	83 MHz	30 s		225 °C (437 °F)	23 mm	Yes	220
XC95144XV-4CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	4 ns	Yes	2.6 V					2.5		Grid Array, Thin Profile, Fine Pitch				Registered	2.4 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1					12 mm		117
XC73108-20PC84C	Xilinx	OT PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	45 ns	Yes	5.25 V	108	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 37 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	35.7 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	37
XC9572XV-7CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	72	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	125 MHz	30 s		240 °C (464 °F)	7 mm	Yes	38
XC2C256-5FT256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	256	CMOS			1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e0		30 s		225 °C (437 °F)	17 mm	Yes	184
XC7272A-16WC68I	Xilinx	UV PLD	Industrial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	72	CMOS			5	5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 38 I/O	8	-40 °C (-40 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		55 MHz				24.13 mm	No	38
XC7272A-16PC68I	Xilinx	OT PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V	72	CMOS			5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 38 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		55 MHz				24.2316 mm	No	38
XCR3256XL-7TQG144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	256	CMOS			3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 120 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	154 MHz	30 s		260 °C (500 °F)	20 mm	Yes	120
XC9572F-7PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	83 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.