Xilinx Programmable Logic Devices (PLD) 1,918

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC9572-7PCG84	Xilinx	Flash PLD		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				Macrocell			1.27 mm		0 Dedicated Inputs, 69 I/O	0		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable	e3					29.3116 mm		69
XH95216-10PQ160I	Xilinx	Mask PLD		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack				Macrocell			.65 mm		0 Dedicated Inputs, 133 I/O	0		Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No		e0					28 mm		133
XC7372-15PG84I	Xilinx	OT PLD	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	33 ns	No	5.5 V	72	CMOS				5	3.3/5,5 V	Grid Array	PGA84M,11X11	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		52.6 MHz				27.94 mm	No	37
XC7372-15PC84C	Xilinx	OT PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	33 ns	Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 37 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops	e0	52.6 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	37
XC7336Q-15PQ44C	Xilinx	OT PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Flatpack	QFP44,.5SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	2.35 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	10 mm	No	32
XH95216-10HQ208C	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell			.5 mm		0 Dedicated Inputs, 168 I/O	0		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm		168
XC7272A-25WC84C	Xilinx	UV PLD	Commercial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.25 V	72	CMOS				5	5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 42 I/O	12	0 °C (32 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		40 MHz				29.21 mm	No	42
XA2C128-7CPG132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	112 MHz	30 s		260 °C (500 °F)	8 mm	Yes	100
XCR5128-7PC84C	Xilinx	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	128	CMOS				5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	95 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	64
XC95288XL-6BGG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V		CMOS				3.3		Grid Array, Low Profile				Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	288 Macrocells	e1	151.5 MHz	30 s		260 °C (500 °F)	35 mm		192
XC95108-15TQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HLFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm	Yes	81
XC2C384-10FG324C	Xilinx	Flash PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS		240	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 240 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	83 MHz	30 s	240	225 °C (437 °F)	23 mm	Yes	240
XC7272A-16WC84C	Xilinx	UV PLD	Commercial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.25 V	72	CMOS				5	5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 42 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells	e0	55 MHz				29.21 mm	No	42
XC9572XL-10VQG64Q	Xilinx	Flash PLD	Automotive	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm		52
XC95288XL-6CS280C	Xilinx	Flash PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	208.3 MHz	30 s	192	240 °C (464 °F)	16 mm	Yes	192
XC2C384-7TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	384	CMOS		118	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 118 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	112 MHz		118		20 mm	Yes	118
XH95288-10HQ208I	Xilinx	Mask PLD		Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell			.5 mm		0 Dedicated Inputs, 168 I/O	0		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0					28 mm		168
XC95108-10PQG160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm	Yes	108
XC73108-15WC84M	Xilinx	UV PLD	Military	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	36 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 37 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		45.5 MHz				29.21 mm	No	37
XC73108-12PG144C	Xilinx	UV PLD	Commercial	Pin/Peg	144	WPGA	Square	Ceramic, Metal-Sealed Cofired	30 ns	No	5.25 V	108	CMOS				5	3.3/5,5 V	Grid Array, Window	PGA144,15X15	Programmable Logic Devices	No	Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Perpendicular	S-CPGA-P144	1	3.683 mm	39.624 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		55.6 MHz				39.624 mm	No	78
XH95144-7PQ100C	Xilinx	Mask PLD		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5		Flatpack				Macrocell			.65 mm		0 Dedicated Inputs, 81 I/O	0		Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No		e0					20 mm		81
XC95216-20HQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS				5		Flatpack, Fine Pitch				Macrocell	4.75 V		.4 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	50 MHz	30 s		245 °C (473 °F)	28 mm		166
XC95180-10HQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	10 ns	Yes			CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell			.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm		166
XC9572F-10PQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS				5		Flatpack				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	67 MHz				20 mm		72
XC7272-25PG84C	Xilinx	UV PLD	Commercial	Pin/Peg	84	PGA	Square	Ceramic	40 ns	No		72	CMOS				5	5 V	Grid Array	PGA84M,11X11	Programmable Logic Devices	No				2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P84				No								No
XCR3512XL-10FG324C	Xilinx	EE PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS				3.3	3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 260 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	97 MHz	30 s		225 °C (437 °F)	23 mm	Yes	260
XC9572F-15PCG84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS				5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	56 MHz	30 s		245 °C (473 °F)	29.3116 mm		69
XC2C256-6CP132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	256	CMOS		106	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e0	139 MHz	30 s	106	240 °C (464 °F)	8 mm	Yes	106
XC9536XV-4CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V						2.5		Grid Array, Fine Pitch				Registered	2.4 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0					7 mm		36
XCR3128XL-7CSG144C	Xilinx	EE PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS				3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	119 MHz	30 s		260 °C (500 °F)	12 mm	Yes	108
XC95288XL-6PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	288	CMOS		168		3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	208.3 MHz	30 s	168	245 °C (473 °F)	28 mm	Yes	168
XCR3032XL-10CSG48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS				3.3	3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	95 MHz	30 s		260 °C (500 °F)	7 mm	Yes	36
XCR22LV10-10VO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS		22	PAL-TYPE	3.3	3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	3 V	132	.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24	1	1.2 mm	4.4 mm	No		e0	125 MHz		10		7.8 mm		10
XC2C128-4TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4.5 ns	Yes	1.9 V	128	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s		260 °C (500 °F)	20 mm	Yes	100
XC7236A-16PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V	36	CMOS				5	3/5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 30 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	60 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	30
XCR3064XL-6VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile				Macrocell	2.7 V		.8 mm	85 °C (185 °F)	32 I/O		-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	167 MHz				10 mm		32
XCR3256XL-10PQG208C	Xilinx	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS				3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	105 MHz	30 s		245 °C (473 °F)	28 mm	Yes	164
XC9572F-10PCG84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS				5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	67 MHz	30 s		245 °C (473 °F)	29.3116 mm		69
XCR3128A-10VQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	128	CMOS				3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	91 MHz	30 s		240 °C (464 °F)	14 mm	Yes	80
XC9536XV-4PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	4 ns	Yes	2.62 V	36	CMOS				2.5	1.8/3.3,2.5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.37 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0		30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC73108-15PQ160I	Xilinx	OT PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	36 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	45.5 MHz	30 s		225 °C (437 °F)	28 mm	No	78
XC9536-10CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	66.7 MHz	30 s		260 °C (500 °F)	7 mm	Yes	34
XC73108-20PQ100C	Xilinx	OT PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	45 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	12 Dedicated Inputs, 47 I/O	12	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	35.7 MHz	30 s		225 °C (437 °F)	20 mm	No	47
XCR3384XL-12TQG144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS				3.3	3/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	83 MHz	30 s		260 °C (500 °F)	20 mm	Yes	118
XC9536F-10VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS				5		Flatpack, Thin Profile				Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	67 MHz				10 mm		34
XCR3032A-10PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS				3		Chip Carrier				Macrocell	2.7 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	16.5862 mm		32
XC95288XL-10BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS				3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	288 Macrocells	e0	100 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XCR3064-15PQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	64	CMOS				3.3	3.3 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	2.97 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	58 MHz	30 s		225 °C (437 °F)	20 mm	No	64

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.