Xilinx Programmable Logic Devices (PLD) 1,918

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR3128A-12VQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	128	CMOS				3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	71 MHz	30 s		240 °C (464 °F)	14 mm	Yes	80
XC7318-5PQ44C	Xilinx	OT PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	8.5 ns	Yes	5.25 V	18	CMOS				5	3.3/5,5 V	Flatpack	QFP44,.5SQ,20	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	16 Dedicated Inputs, 17 I/O	16	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	2.35 mm	10 mm	No	18 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 18 Flip Flops	e0	167 MHz	30 s		225 °C (437 °F)	10 mm	No	17
XC9572XV-5PC44	Xilinx																														Tin Lead			3					e0		30 s		225 °C (437 °F)
XC73108-20WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	45 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V		1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		35.7 MHz					No	78
XC2C64-5CPG56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	5 ns	Yes	1.9 V		CMOS				1.8		Grid Array, Low Profile, Fine Pitch				Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 45 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e1		30 s		260 °C (500 °F)	6 mm		45
XC95288XV-7FG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	288	CMOS				2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	125 MHz	30 s		225 °C (437 °F)	17 mm	Yes	192
XCR3512XL-12PQ208Q	Xilinx	EE PLD	Automotive	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Fine Pitch				Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 180 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm		180
XCR3064XL-10VQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS				3.3	3/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	14 mm	Yes	68
XC9572F-15PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	56 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC9536XV-3VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	3.5 ns	Yes	2.62 V	36	CMOS				2.5	1.8/3.3,2.5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.37 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0		30 s		240 °C (464 °F)	10 mm	Yes	34
XC7272A-20WC84I	Xilinx	UV PLD	Industrial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	32 ns	Yes	5.5 V	72	CMOS				5	5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 42 I/O	12	-40 °C (-40 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		50 MHz				29.21 mm	No	42
XC95216-20PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	216	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 133 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	3.7 mm	28 mm	No		e0	50 MHz	30 s		225 °C (437 °F)	28 mm	Yes	133
XC2C64-5VQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e0		30 s		240 °C (464 °F)	14 mm	Yes	64
XC9536-6PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	6 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	100 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XCR3256XL-10CS280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS				3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	105 MHz	30 s		240 °C (464 °F)	16 mm	Yes	164
XC2C256-5VQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	256	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	14 mm	Yes	80
XC9572F-10PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	67 MHz				29.3116 mm		69
XC2C384-6PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	384	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm	Yes	173
XC9536XL-4PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	4 ns	Yes	3.6 V	36	CMOS				3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells	e0	200 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9572-10TQ100	Xilinx	Flash PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Low Profile, Fine Pitch				Macrocell			.5 mm		0 Dedicated Inputs, 72 I/O	0		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable	e0		30 s		225 °C (437 °F)	14 mm		72
XCR22LV10-15PC28I	Xilinx	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS		22	PAL-TYPE	3.3	3.3 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e0	65 MHz		10		11.5062 mm		10
XA2C32A-7VQG44Q	Xilinx	Flash PLD	Automotive	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	125 °C (257 °F)	0 Dedicated Inputs, 33 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	10 mm	Yes	33
XCR3256XL-10PQG208Q	Xilinx	EE PLD	Automotive	Gull Wing	144	FQFP	Square	Plastic/Epoxy		Yes	3.6 V		CMOS				3.3		Flatpack, Fine Pitch				Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	4.1 mm	28 mm	No		e3					28 mm		164
XC9536XL-5CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	36	CMOS		36		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	36 Macrocells	e0	178.6 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
XC7372-15WC68I	Xilinx	UV PLD	Industrial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	33 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 25 I/O	10	-40 °C (-40 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		52.6 MHz				24.13 mm	No	25
XC2C64-7VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	14 mm	Yes	64
XCR5064-10PQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS				5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	20 mm	No	64
XC95216-15HQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS				5		Flatpack, Fine Pitch				Macrocell	4.75 V		.4 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	28 mm		166
XC95144-7TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	144	CMOS				5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	83.3 MHz	30 s		225 °C (437 °F)	14 mm	Yes	81
XC95144XL-5CS144C	Xilinx	Flash PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	144	CMOS		117		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	138.88 MHz	30 s	117	240 °C (464 °F)	12 mm	Yes	117
XCR3384XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS				3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	102 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XC95216-15BGG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS				5		Grid Array, Low Profile				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e1	55.6 MHz	30 s		260 °C (500 °F)	35 mm		166
XC73108-12WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V		1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		55.6 MHz					No	78
XC95108F-15PQG160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Flatpack				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e3	56 MHz				28 mm		108
XC2C32A-4PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	4 ns	Yes	1.9 V	32	CMOS				1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		1.27 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e0	450 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	33
XC2C256-5PQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	256	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Real Digital Design Technology	e0		30 s		225 °C (437 °F)	28 mm	Yes	173
XCR3064-15PC68I	Xilinx	EE PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	64	CMOS				3.3	3.3 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No			58 MHz				24.2316 mm	No	48
XCR3032XL-5PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	32	CMOS				3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	175 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	36
XCR5032-7VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS				5		Flatpack, Thin Profile				Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			80 MHz				10 mm		32
XH95144-10PQ160I	Xilinx	Mask PLD		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack				Macrocell			.65 mm		0 Dedicated Inputs, 133 I/O	0		Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No		e0					28 mm		133
XC95432-10HQG304C	Xilinx	Flash PLD	Commercial	Gull Wing	304	HFQFP	Square	Plastic/Epoxy	10 ns	Yes			CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell			.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 232 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3					40 mm		232
XC7272-30WC84C	Xilinx	UV PLD	Commercial	J Bend	84	QCCJ	Square	Ceramic	48 ns	Yes		72	CMOS				5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No				1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-XQCC-J84				No								No
XC2C128-4TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4.5 ns	Yes	1.9 V	128	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0		30 s		225 °C (437 °F)	20 mm	Yes	100
XC95108F-20PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	50 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XCR5032C-7VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	32	CMOS				5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	80 MHz	30 s		240 °C (464 °F)	10 mm	Yes	32
XCR3512XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS				3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	97 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XC73108-12WC84C	Xilinx	UV PLD	Commercial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 37 I/O	12	0 °C (32 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		55.6 MHz				29.21 mm	No	37
XA9572XL-10VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	AEC-Q100			3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm	Yes	34

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.