Xilinx Programmable Logic Devices (PLD) 1,918

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

XC73108-20WB225I

Xilinx

UV PLD

Industrial

Ball

225

WBGA

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.5 V

108

CMOS

5

3.3/5,5 V

Grid Array, Window

BGA225,15X15

Programmable Logic Devices

No

Macrocell

4.5 V

1.5 mm

85 °C (185 °F)

12 Dedicated Inputs, 78 I/O

12

-40 °C (-40 °F)

Bottom

S-CBGA-B225

1

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops

35.7 MHz

No

78

XCR3032-8VQ44C

Xilinx

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

74 MHz

10 mm

32

XC95144-7PQG160C

Xilinx

Flash PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

144

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 133 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

3

4.1 mm

28 mm

No

e3

83.3 MHz

30 s

245 °C (473 °F)

28 mm

Yes

133

XC2C64-7PC44I

Xilinx

Flash PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

64

CMOS

1.8

1.5/3.3,1.8 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 33 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

Real Digital Design Technology

e0

30 s

225 °C (437 °F)

16.5862 mm

Yes

33

XA9572XL-10VQG64Q

Xilinx

Flash PLD

Automotive

Gull Wing

64

TFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

72

CMOS

AEC-Q100

3.3

2.5/3.3,3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP64,.47SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 52 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

1.2 mm

10 mm

No

e3

30 s

260 °C (500 °F)

10 mm

Yes

52

XC7354-12PC68C

Xilinx

OT PLD

Commercial

J Bend

68

QCCJ

Square

Plastic/Epoxy

27 ns

Yes

5.25 V

54

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC68,1.0SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 42 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J68

1

5.08 mm

24.2316 mm

No

54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 108 Flip Flops

66.7 MHz

24.2316 mm

No

42

XC95144-10PQG100

Xilinx

Flash PLD

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

5

Flatpack

Macrocell

.65 mm

0 Dedicated Inputs, 81 I/O

0

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable

e3

20 mm

81

XC2C32-6PCG44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

32

CMOS

1.8

1.5/3.3,1.8 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

1.27 mm

70 °C (158 °F)

1 Dedicated Inputs, 33 I/O

1

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

Real Digital Design Technology

e3

30 s

245 °C (473 °F)

16.5862 mm

Yes

33

XC95144XV-5TQ100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

4 ns

Yes

2.6 V

2.5

Flatpack, Low Profile, Fine Pitch

Registered

2.4 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 81 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

14 mm

81

XC2C64-5VQ44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

64

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

1.7 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 33 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

Real Digital Design Technology

e0

30 s

240 °C (464 °F)

10 mm

Yes

33

XC7336-12WC44C

Xilinx

UV PLD

Commercial

J Bend

44

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

19 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC44,.7SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-CQCC-J44

1

4.826 mm

16.51 mm

No

36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops

80 MHz

16.51 mm

No

32

XC9536F-10PCG44I

Xilinx

Flash PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e3

67 MHz

16.5862 mm

34

XC2C128-7CPGG132C

Xilinx

Flash PLD

Commercial

Ball

132

TFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

128

CMOS

100

PLA-TYPE

1.8

Grid Array, Thin Profile, Fine Pitch

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Matte Tin

Bottom

S-PBGA-B132

1.1 mm

8 mm

No

e3

119 MHz

100

8 mm

100

XC73108-7PQ100C

Xilinx

OT PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

18 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

No

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

12 Dedicated Inputs, 47 I/O

12

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops

e0

83.3 MHz

30 s

225 °C (437 °F)

20 mm

No

47

XC7354-12PC44C

Xilinx

OT PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

27 ns

Yes

5.25 V

54

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 25 I/O

8

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops

e0

66.7 MHz

30 s

225 °C (437 °F)

16.5862 mm

No

25

XC9572XL-7PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

72

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

72 Macrocells

e0

125 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XCR3256XL-7.5PQ208C

Xilinx

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Fine Pitch

Macrocell

3 V

.5 mm

70 °C (158 °F)

160 I/O

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e4

167 MHz

28 mm

160

XC7336Q-12PC44C

Xilinx

OT PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

19 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops

e0

80 MHz

30 s

225 °C (437 °F)

16.5862 mm

No

32

XC2C64-4PCG44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4 ns

Yes

1.9 V

64

CMOS

33

PLA-TYPE

1.8

Chip Carrier

Macrocell

1.7 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 33 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

Fast Zero Power Design Technology

e3

213 MHz

30 s

33

245 °C (473 °F)

16.5862 mm

33

XC9536XL-5VQG64C

Xilinx

Flash PLD

Commercial

Gull Wing

64

TFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

36

CMOS

36

3.3

2.5/3.3,3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP64,.47SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G64

3

1.2 mm

10 mm

No

e3

138.88 MHz

30 s

36

260 °C (500 °F)

10 mm

Yes

36

XCR3512XL-7PQ208C

Xilinx

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 180 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e4

135 MHz

28 mm

Yes

180

XC95108-20PCG84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e3

30 s

245 °C (473 °F)

29.3116 mm

Yes

69

XC9536XV-4VQG44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

4 ns

Yes

2.62 V

2.5

Flatpack, Thin Profile

Macrocell

2.37 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

30 s

260 °C (500 °F)

10 mm

34

XC2C32-4VQG44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

4 ns

Yes

1.9 V

32

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

1.7 V

.8 mm

70 °C (158 °F)

1 Dedicated Inputs, 33 I/O

1

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

Real Digital Design Technology

e3

30 s

260 °C (500 °F)

10 mm

Yes

33

XC95144XV-7TQG100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

144

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

2.37 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 81 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

125 MHz

30 s

260 °C (500 °F)

14 mm

Yes

81

XC9572XL-10PC44I

Xilinx

Flash PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

72

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

72 Macrocells

e0

100 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XCR3064XL-7VQG44C

Xilinx

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

CMOS

3.3

3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

119 MHz

30 s

260 °C (500 °F)

10 mm

Yes

36

XC2C384-10PQ208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

384

CMOS

173

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 173 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e4

83 MHz

173

28 mm

Yes

173

XC95108-15TQ100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

HLFQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 81 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

30 s

225 °C (437 °F)

14 mm

Yes

81

XCR3064XL-7CPG56I

Xilinx

EE PLD

Industrial

Ball

56

LFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

CMOS

3.3

3/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA56,10X10,20

Programmable Logic Devices

Yes

Macrocell

2.7 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 48 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B56

3

1.35 mm

6 mm

No

e1

119 MHz

30 s

260 °C (500 °F)

6 mm

Yes

48

XC9572XL-7PCG44I

Xilinx

Flash PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

72

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

72 Macrocells

e3

125 MHz

30 s

245 °C (473 °F)

16.5862 mm

Yes

34

XC9572-15TQ100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

72

CMOS

5

3.3/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 72 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

55.6 MHz

30 s

225 °C (437 °F)

14 mm

Yes

72

XC95432-10HQG304

Xilinx

Flash PLD

Gull Wing

304

HFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

232 I/O

Matte Tin

Quad

S-PQFP-G304

4.5 mm

40 mm

No

3.3 or 5 V I/O Capability

e3

111 MHz

40 mm

232

XC7272A-25PG84I

Xilinx

UV PLD

Industrial

Pin/Peg

84

WPGA

Square

Ceramic, Metal-Sealed Cofired

40 ns

No

5.5 V

72

CMOS

5

5 V

Grid Array, Window

PGA84M,11X11

Programmable Logic Devices

No

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 42 I/O

12

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

PAL Blocks interconnected by PIA; 72 Macrocells

40 MHz

27.94 mm

No

42

XC9536F-5VQ44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

5 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

No

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

100 MHz

30 s

240 °C (464 °F)

10 mm

Yes

34

XCR3256XL-7FT256C

Xilinx

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

154 MHz

30 s

225 °C (437 °F)

17 mm

Yes

164

XC95108-7PCG84I

Xilinx

Flash PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.5 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 69 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V

e3

30 s

245 °C (473 °F)

29.3116 mm

Yes

69

XC7272-30PC84I

Xilinx

OT PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

48 ns

Yes

72

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

No

e0

30 s

225 °C (437 °F)

No

XC95108F-7PQ160C

Xilinx

Flash PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 108 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G160

3

4.1 mm

28 mm

No

e0

83 MHz

30 s

225 °C (437 °F)

28 mm

Yes

108

XC2C512-7PQG208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

512

CMOS

173

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 173 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

119 MHz

30 s

173

245 °C (473 °F)

28 mm

Yes

173

XC95216-15HQ208I

Xilinx

Flash PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

216

CMOS

5

3.3/5,5 V

Flatpack, Fine Pitch

HQFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.4 mm

85 °C (185 °F)

0 Dedicated Inputs, 166 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

e0

55.6 MHz

30 s

225 °C (437 °F)

28 mm

Yes

166

XC95144-15TQ100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

144

CMOS

81

5

3.3/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 81 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

55.6 MHz

30 s

81

225 °C (437 °F)

14 mm

Yes

81

XC95144-7PQ100

Xilinx

Flash PLD

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

5

Flatpack

Macrocell

.65 mm

0 Dedicated Inputs, 81 I/O

0

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable

e0

20 mm

81

XC7336Q-10VQ44C

Xilinx

OT PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

No

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops

e0

100 MHz

30 s

240 °C (464 °F)

10 mm

No

32

XH95432-10HQ304I

Xilinx

Mask PLD

Gull Wing

304

HFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

0 Dedicated Inputs, 232 I/O

0

Tin Lead

Quad

S-PQFP-G304

3

4.5 mm

40 mm

No

e0

40 mm

232

XCR5128-10VQ100C

Xilinx

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

128

CMOS

5

5 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e0

71 MHz

30 s

240 °C (464 °F)

14 mm

Yes

80

XC95144XV-5CSG144C

Xilinx

Flash PLD

Commercial

Ball

144

TFBGA

Square

Plastic/Epoxy

5 ns

Yes

2.62 V

144

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Programmable Logic Devices

Yes

Macrocell

2.37 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 117 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

222.2 MHz

30 s

260 °C (500 °F)

12 mm

Yes

117

XCR3384XL-7.5CS280C

Xilinx

EE PLD

Commercial

Ball

280

TFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Thin Profile, Fine Pitch

Macrocell

3 V

.8 mm

70 °C (158 °F)

216 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B280

3

1.2 mm

16 mm

No

e0

16 mm

216

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.