Programmable Logic Devices (PLD)

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
5M570ZT100I5N	Intel	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	440	CMOS			1.8		1.8,1.2/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	74 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e3	118.3 MHz				14 mm	Yes	74
XC9572XL-10VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	72	CMOS	34		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	72 Macrocells	e3	100 MHz	30 s	34	260 °C (500 °F)	10 mm	Yes	34
EPM570F100I5N	Intel	Flash PLD		Ball	100	LBGA	Square	Plastic/Epoxy	8.7 ns		Yes	2.625 V	440	CMOS	76		2.5		1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 76 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1		30 s	76	260 °C (500 °F)	11 mm	Yes	76
ATF22V10C-15JU	Microchip Technology	Flash PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V		CMOS	22	PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	2	4.572 mm	11.5062 mm	No		e3	55.5 MHz		10		11.5062 mm		10
XC2C256-7VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3	108 MHz	30 s	80	260 °C (500 °F)	14 mm	Yes	80
ATF22V10C-10PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns		No	5.5 V		CMOS	22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e3	90 MHz		10		31.877 mm		10
LC4032V-75TN48C	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32		36	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	111 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
M4A5-128/64-10VNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	128	CMOS		PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	62.5 MHz	40 s		260 °C (500 °F)	14 mm	Yes	64
5M80ZE64I5N	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	64	CMOS			1.8		1.8,1.2/3.3 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V		.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G64	3	1.2 mm	7 mm	No		e3	118.3 MHz	30 s		260 °C (500 °F)	7 mm	Yes	54
ATF22V10C-10JU	Microchip Technology	Flash PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS	22	PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No		e3	90 MHz		10		11.5062 mm		10
M4A5-64/32-10VNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	64	CMOS	34	PAL-TYPE	5		5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	62.5 MHz	40 s	32	260 °C (500 °F)	10 mm	Yes	32
5M240ZT100I5N	Intel	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192	CMOS	79		1.8		1.8,1.2/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	79 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e3	118.3 MHz		79		14 mm	Yes	79
ATF1508ASL-25AU100	Microchip Technology	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	25 ns		Yes	5.5 V	128				5	Tray	3.3/5,5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	33.3 MHz	40 s		260 °C (500 °F)	14 mm	Yes	80
M4A5-64/32-10VNC48	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	64	CMOS	34	PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	62.5 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
5M570ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	440	CMOS			1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	159 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	118.3 MHz	30 s		260 °C (500 °F)	17 mm	Yes	159
EPM570T144I5N	Intel	Flash PLD		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.7 ns		Yes	2.625 V	440	CMOS	116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 116 I/O	0	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3		30 s	116	260 °C (500 °F)	20 mm	Yes	116
LC4032V-75TN44C	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32		32	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	90 °C (194 °F)	2 Dedicated Inputs, 30 I/O	2	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	111 MHz	40 s	30	260 °C (500 °F)	10 mm	Yes	30
XC9572XL-10VQG64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	72	CMOS	36		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e3	100 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	52
ATF16V8BQL-15PU	Microchip Technology	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.5 V		CMOS		PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45 MHz		8		25.908 mm		8
ATF1504ASVL-20AU44	Microchip Technology	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	20 ns		Yes	3.6 V					3.3	Tray		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	83.3 MHz	40 s		260 °C (500 °F)	10 mm		32
XC2C128-7VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	128	CMOS	80	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	119 MHz	30 s	80	260 °C (500 °F)	14 mm	Yes	80
EPM2210F256I5N	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS	204		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	204	260 °C (500 °F)	17 mm	Yes	204
EPM240M100C5N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	192	CMOS	80		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1		30 s	80	260 °C (500 °F)	6 mm	Yes	80
LC4256V-75TN100C	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256		74	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	10 Dedicated Inputs, 64 I/O	10	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	111 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
ATF1508ASV-15AU100-T	Microchip Technology	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	15 ns		Yes	3.6 V					3.3	Tape and Reel		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm				100 MHz				14 mm		80
XC2C64A-7QFG48C	Xilinx	Flash PLD	Commercial	No Lead	48	VQCCN	Square		7.5 ns		Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Chip Carrier, Very Thin Profile	LCC48,.27SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 37 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-XQCC-N48	3	1 mm	7 mm	No	Real Digital Design Technology	e3	200 MHz	30 s		260 °C (500 °F)	7 mm	Yes	37
XC9572XL-10TQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	72	CMOS	72		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	72 Macrocells	e3	100 MHz	30 s	72	260 °C (500 °F)	14 mm	Yes	72
ATF1504AS-10JU44-T	Microchip Technology	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V					5	Tape and Reel		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44		4.57 mm	16.5862 mm			e3	125 MHz				16.5862 mm		32
XC95288XL-10TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS	117		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	100 MHz	30 s	117	260 °C (500 °F)	20 mm	Yes	117
EPM1270F256I5N	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS	212		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	212	260 °C (500 °F)	17 mm	Yes	212
ATF1504ASL-25AU100	Microchip Technology	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	25 ns		Yes	5.5 V	64	CMOS	64		5	Tray	3.3/5,5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	40	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Power-Up Reset; Security Fuse	e3	60 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
5M160ZE64I5N	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	128	CMOS			1.8		1.2/3.3,1.8 V	Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch	TQFP64,.35SQ,16	Programmable Logic Devices	Yes	Macrocell	1.71 V		.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	118.3 MHz				7 mm	Yes	54
ATF750CL-15PU	Microchip Technology	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.5 V	10	CMOS			5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No		e3	44 MHz				31.877 mm	No	10
ATF22V10CQ-15JU	Microchip Technology	Flash PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V		CMOS	22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	No	Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28		4.572 mm	11.506 mm	No		e3	55.5 MHz		10		11.506 mm	No	10
5M40ZE64I5N	Intel	Flash PLD	Industrial	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V					1.8			Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V		.4 mm	100 °C (212 °F)	54 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e3	118.3 MHz				7 mm		54
EPM3128ATC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	98 MHz				14 mm	Yes	80
XC2C64A-5VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns		Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3	333 MHz	30 s		260 °C (500 °F)	10 mm	Yes	33
ATF1508ASVL-20AU100	Microchip Technology	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	20 ns		Yes	3.6 V	128				3.3	Tray	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	83.3 MHz	40 s		260 °C (500 °F)	14 mm	Yes	80
XC2C384-10TQG144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	384	CMOS	118	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	83 MHz	30 s	118	260 °C (500 °F)	20 mm	Yes	118
ATF1502AS-10JU44	Microchip Technology	EE PLD		J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	32		36	PAL-TYPE	5			Chip Carrier	LDCC44,.7SQ		Yes	Macrocell	4.5 V	40	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 32 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.586 mm				83.33 MHz	40 s	32	245 °C (473 °F)	16.586 mm	Yes	32
LC4064ZE-7TN48I	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64	CMOS			1.8		1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP48,.35SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm		4 Dedicated Inputs, 32 I/O	4		Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	111 MHz	40 s		260 °C (500 °F)	7 mm	Yes	32
EPM240T100C4N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6.1 ns		Yes	2.625 V	192	CMOS	80		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			80		14 mm	Yes	80
ATF1504AS-10AU44-T	Microchip Technology	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V					5	Tape and Reel		Flatpack, Thin Profile				Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	1	1.2 mm	10 mm		64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry	e3	125 MHz			260 °C (500 °F)	10 mm		32
LCMXO2-256HC-4TG100C	Lattice Semiconductor	Flash PLD	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.36 ns		Yes	3.462 V			55		2.5	Tray	2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 0 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	Also operates at 3.3 V nominal supply	e3		30 s	55	260 °C (500 °F)	14 mm		0
ATF22V10CQZ-20SU	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	20 ns		Yes	5.5 V		CMOS	22	PAL-TYPE	5	Tube	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		e3	38.5 MHz		10		15.4 mm		10
EPF10K10TI144-4N	Intel	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	576	Yes	5.25 V		CMOS	102		5		3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3			102		20 mm		102
ATF1504ASL-25AU44	Microchip Technology	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	25 ns		Yes	5.5 V	64	CMOS	32		5	Tray		Flatpack, Thin Profile	TQFP44,.47SQ,32		Yes	Macrocell	4.5 V	40	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Power-Up Reset; Security Fuse	e3	60 MHz	40 s	32	260 °C (500 °F)	10 mm	Yes	32
ATF1508AS-10JU84	Microchip Technology	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	128				5	Tube	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	2	4.572 mm	29.3115 mm	No		e3	125 MHz				29.3115 mm	Yes	64

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.