Programmable Logic Devices (PLD)

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PAL16R4AMFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

8

8.89 mm

No

4

SLG46824G

Renesas Electronics

OT PLD

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

5.5 V

19

13

PLA-TYPE

2.5

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Yes

Macrocell

2.3 V

.65 mm

85 °C (185 °F)

0 Dedicated Inputs, 13 I/O

0

-40 °C (-40 °F)

Dual

R-PDSO-G20

1

1.2 mm

4.4 mm

15

6.5 mm

No

13

XC2C128-7TQG144C

Xilinx

Flash PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

128

CMOS

100

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

119 MHz

30 s

100

260 °C (500 °F)

20 mm

Yes

100

XC2C64A-7VQ44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

64

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

1.7 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 33 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

Real Digital Design Technology

e4

200 MHz

10 mm

Yes

33

M4A5-64/32-7VNC48

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

64

CMOS

34

PAL-TYPE

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.6 mm

7 mm

No

e3

76.9 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

EPM3032ALC44-10N

Intel

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

32

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e3

103.1 MHz

16.5862 mm

Yes

34

LC4032V-25TN48C

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

2.5 ns

Yes

3.6 V

32

36

PAD-TYPE

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

90 °C (194 °F)

4 Dedicated Inputs, 32 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e3

250 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

LC4256ZE-7TN144C

Lattice Semiconductor

EE PLD

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

256

CMOS

1.8

1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

14 Dedicated Inputs, 96 I/O

14

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

111 MHz

40 s

260 °C (500 °F)

20 mm

Yes

96

ATF1504ASVL-20AU100

Microchip Technology

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

20 ns

Yes

3.6 V

3.3

Tray

Flatpack, Thin Profile, Fine Pitch

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 64 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e3

83.3 MHz

40 s

260 °C (500 °F)

14 mm

64

XC9536XL-10VQG64C

Xilinx

Flash PLD

Commercial

Gull Wing

64

TFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

36

CMOS

36

3.3

2.5/3.3,3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP64,.47SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G64

3

1.2 mm

10 mm

No

e3

138.88 MHz

30 s

36

260 °C (500 °F)

10 mm

Yes

36

ATF1502ASV-15AU44-T

Microchip Technology

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

3.3

Tape and Reel

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

100 MHz

10 mm

32

ATF750CL-15SU

Microchip Technology

EE PLD

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.5 V

10

CMOS

5

Tube

5 V

Small Outline

SOP24,.4

Programmable Logic Devices

No

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

e3

44 MHz

15.4 mm

No

10

EPM1270M256C5N

Intel

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

10 ns

Yes

2.625 V

980

CMOS

212

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

11 mm

No

It can also operate at 3.3 V

e1

212

11 mm

Yes

212

ATF1502AS-7AX44-T

Microchip Technology

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

5

Tape and Reel

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

1.2 mm

10 mm

e3

166.7 MHz

10 mm

32

ATF1504ASV-15JU44

Microchip Technology

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

64

CMOS

3.3

Tube

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.586 mm

No

e3

100 MHz

40 s

245 °C (473 °F)

16.586 mm

Yes

32

EPM3128ATC100-5N

Intel

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e3

192.3 MHz

14 mm

Yes

80

XC95144XL-10TQ100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

144

CMOS

81

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 81 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

144 Macrocells; Configurable I/O operation with 2.5 or 3.3 V

e4

81.3 MHz

81

14 mm

Yes

81

ATF1500A-10JU

Microchip Technology

Flash PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

32

5

Tube

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J44

3

4.572 mm

16.586 mm

No

e3

76.9 MHz

40 s

245 °C (473 °F)

16.586 mm

32

ATF22V10CQZ-20PI

Microchip Technology

Flash PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

20 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDIP-T24

5.334 mm

7.62 mm

38.5 MHz

31.877 mm

10

EPM7160STI100-10N

Intel

EE PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

160

CMOS

5

3.3/5,5 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 84 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

160 Macrocells; 10 Labs; Configurable I/O operation with 3.3 V or 5 V

e3

125 MHz

14 mm

Yes

84

LC4032ZE-7MN64C

Lattice Semiconductor

EE PLD

Ball

64

TFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

32

CMOS

1.8

1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA64,8X8,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

4 Dedicated Inputs, 32 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B64

3

1.1 mm

5 mm

No

e1

111 MHz

40 s

260 °C (500 °F)

5 mm

Yes

32

LC4064V-75TN100I

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

74

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

10 Dedicated Inputs, 64 I/O

10

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

111 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

5M160ZE64C4N

Intel

Flash PLD

Other

Gull Wing

64

HTFQFP

Square

Plastic/Epoxy

7.9 ns

Yes

1.89 V

128

CMOS

1.8

1.2/3.3,1.8 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP64,.35SQ,16

Programmable Logic Devices

Yes

Macrocell

1.71 V

.4 mm

85 °C (185 °F)

54 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G64

1.2 mm

7 mm

No

e3

184.1 MHz

7 mm

Yes

54

5M570ZT144C4N

Intel

Flash PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

9.5 ns

Yes

1.89 V

440

CMOS

1.8

1.8,1.2/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

114 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e3

184.1 MHz

20 mm

Yes

114

ATF16V8B-10JU

Microchip Technology

Flash PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

PAL-TYPE

5

Tube

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J20

4.572 mm

8.966 mm

No

e3

68 MHz

8

8.966 mm

8

GAL16V8D-15LPNI

Lattice Semiconductor

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T20

5.334 mm

7.62 mm

No

e3

45.5 MHz

8

260 °C (500 °F)

26.162 mm

8

GAL16V8D-25QJN

Lattice Semiconductor

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

37 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

GAL22V10D-15LPN

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

132

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T24

1

5.334 mm

7.62 mm

No

e3

55.5 MHz

30 s

10

260 °C (500 °F)

31.75 mm

10

GAL22V10D-15QPN

Lattice Semiconductor

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

10

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

No

Macrocell

4.75 V

132

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T24

1

5.334 mm

7.62 mm

No

e3

55.5 MHz

10

31.75 mm

No

10

LC4032ZE-7TN48I

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

32

CMOS

1.8

1.8 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

4 Dedicated Inputs, 32 I/O

4

Matte Tin

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e3

111 MHz

40 s

260 °C (500 °F)

7 mm

Yes

32

ATF1508AS-7JX84

Microchip Technology

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

128

5

Tube

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 64 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

2

4.572 mm

29.3115 mm

No

e3

166.7 MHz

29.3115 mm

Yes

64

M4A5-192/96-10VNC

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

192

CMOS

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

16 Dedicated Inputs, 96 I/O

16

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

62.5 MHz

40 s

260 °C (500 °F)

20 mm

Yes

96

XC2C512-10PQG208I

Xilinx

Flash PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

512

CMOS

173

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 173 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

91 MHz

30 s

173

245 °C (473 °F)

28 mm

Yes

173

XC2C64A-7CP56I

Xilinx

Flash PLD

Industrial

Ball

56

LFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

64

CMOS

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile, Fine Pitch

BGA56,10X10,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 45 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B56

3

1.35 mm

6 mm

No

Real Digital Design Technology

e0

200 MHz

30 s

240 °C (464 °F)

6 mm

Yes

45

5962-8867005LA

Defense Logistics Agency

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

Yes

e0

50 MHz

10

5M1270ZF256I5N

Intel

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

1.89 V

980

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

211 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

201.1 MHz

17 mm

Yes

211

EPM3064ATI100-10N

Intel

EE PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 66 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e3

100 MHz

14 mm

Yes

66

EPM3128ATC100-7N

Intel

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.27 mm

14 mm

No

e3

129.9 MHz

14 mm

Yes

80

LC4064V-75TN48I

Lattice Semiconductor

EE PLD

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

36

PAD-TYPE

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

4 Dedicated Inputs, 32 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.2 mm

7 mm

No

e3

111 MHz

40 s

32

260 °C (500 °F)

7 mm

Yes

32

LC4256V-5TN100I

Lattice Semiconductor

EE PLD

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

256

74

PAD-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

83

.5 mm

105 °C (221 °F)

10 Dedicated Inputs, 64 I/O

10

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

156 MHz

40 s

64

260 °C (500 °F)

14 mm

Yes

64

5M240ZT100I5

Intel

Flash PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

14 ns

Yes

1.89 V

192

79

1.8

Flatpack, Thin Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

100 °C (212 °F)

79 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

1.2 mm

14 mm

No

e0

118.3 MHz

79

14 mm

79

EPM2210F324I5N

Intel

Flash PLD

Ball

324

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

100 °C (212 °F)

0 Dedicated Inputs, 272 I/O

0

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

30 s

272

260 °C (500 °F)

19 mm

Yes

272

EPM240T100I5

Intel

Flash PLD

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

2.625 V

192

CMOS

80

2.5

1.5/3.3,2.5/3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

100 °C (212 °F)

0 Dedicated Inputs, 80 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

It can also operate at 3.3 V

e0

80

14 mm

Yes

80

EPM3032ATC44-7N

Intel

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

32

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e3

138.9 MHz

10 mm

Yes

34

EPM3256AQC208-10N

Intel

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 158 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

95.2 MHz

28 mm

Yes

158

M4A3-64/32-10VNC48

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

CMOS

PAL-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.6 mm

7 mm

No

e3

62.5 MHz

40 s

260 °C (500 °F)

7 mm

Yes

32

M4A5-64/32-10VNI

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

64

CMOS

34

PAL-TYPE

5

5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 32 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

62.5 MHz

40 s

32

260 °C (500 °F)

10 mm

Yes

32

EPF10K10ATI144-3N

Intel

Loadable PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.8 ns

576

Yes

3.6 V

CMOS

102

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 102 I/O

4

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

576 Logic Elements; 72 Labs

e3

80 MHz

102

20 mm

102

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.