Programmable Logic Devices (PLD)

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
LC4064ZC-75TN48C	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	64			36	PAD-TYPE	1.8		1.8 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	111 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
XCR3256XL-10TQ144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS				3.3		3/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 120 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	105 MHz				20 mm	Yes	120
5M2210ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	1700	CMOS		203		1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	247.5 MHz		203		17 mm	Yes	203
LC4032V-5TN44I	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	32			32	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	105 °C (221 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	156 MHz	40 s	30	260 °C (500 °F)	10 mm	Yes	30
LC4032V-75TN44I	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32			32	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	105 °C (221 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	111 MHz	40 s	30	260 °C (500 °F)	10 mm	Yes	30
LC4128V-75TN128I	Lattice Semiconductor	EE PLD		Gull Wing	128	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128			96	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.64SQ,16	Programmable Logic Devices	Yes	Macrocell	3 V	83	.4 mm	105 °C (221 °F)	4 Dedicated Inputs, 92 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G128	3	1.6 mm	14 mm	No		e3	111 MHz	40 s	92	260 °C (500 °F)	14 mm	Yes	92
XC2C32A-4VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	4 ns		Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3	450 MHz	30 s		260 °C (500 °F)	10 mm	Yes	33
5M2210ZF324C5N	Intel	Flash PLD	Other	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		271		1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	271 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e1	201.1 MHz		271		19 mm	Yes	271
ATF16V8B-15SU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	15 ns		Yes	5.5 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	1	2.65 mm	7.5 mm	No		e3	45 MHz	40 s	8	250 °C (482 °F)	12.8 mm		8
ATF750CL-15XU	Microchip Technology	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns		Yes	5.5 V	10	CMOS				5	Tube	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24		1.2 mm	4.4 mm	No		e3	44 MHz				7.8 mm	No	10
GAL22V10D-15LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	55.5 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
LC4064V-5TN48C	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	64			36	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	156 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
LC4128V-75TN100I	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128			74	PAD-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	10 Dedicated Inputs, 64 I/O	10	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	111 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
PALCE22V10-10JC	Cypress Semiconductor	Flash PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.572 mm	11.5316 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	76.9 MHz		10		11.5316 mm		10
SLG46121V	Renesas Electronics	OT PLD		No Lead	12	VQCCN	Square				Yes	1.89 V	12			9	PLA-TYPE	1.8			Chip Carrier, Very Thin Profile	LCC12,.06SQ,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 8 I/O	1	-40 °C (-40 °F)		Quad	S-XQCC-N12	1	.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				8		1.6 mm	No	8
SLG46620-AG	Renesas Electronics	OT PLD		Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy			Yes	3.6 V	1		AEC-Q100	18	PLA-TYPE	3.3			Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25		No	Macrocell	1.71 V		.65 mm	105 °C (221 °F)	1 Dedicated Inputs, 17 I/O	1	-40 °C (-40 °F)		Dual	R-PDSO-G20	1	1.2 mm	4.4 mm						17		6.5 mm	No	17
SLG46620G	Renesas Electronics	OT PLD																																		1
XC2C64A-5VQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5 ns		Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e4	333 MHz				14 mm	Yes	64
GAL16V8D-10LJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No	Programmable Output Polarity	e0	66.7 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
LC4032V-25TN44C	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	2.5 ns		Yes	3.6 V	32			32	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	90 °C (194 °F)	2 Dedicated Inputs, 30 I/O	2	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	250 MHz	40 s	30	260 °C (500 °F)	10 mm	Yes	30
5M240ZT144I5N	Intel	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	192	CMOS		114		1.8		1.8,1.2/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	114 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3	118.3 MHz		114		20 mm	Yes	114
ATF22LV10C-10JU	Microchip Technology	Flash PLD	Other	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No		e3	71.4 MHz		10		11.5062 mm		10
EPF10K100ARI240-3N	Intel	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V		CMOS		189		3.3		2.5/3.3,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			189		32 mm		189
EPM7032AETI44-7N	Intel	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32	CMOS		36	PLA-TYPE	3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	1024	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	138.9 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	36
EPM7064AETC44-10N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS				3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e3	100 MHz	30 s		260 °C (500 °F)	10 mm	Yes	36
LC4064V-25TN48C	Lattice Semiconductor	EE PLD		Gull Wing	48	TFQFP	Square	Plastic/Epoxy	2.5 ns		Yes	3.6 V	64			36	PAD-TYPE	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No		e3	250 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
XC2C256-7FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		184	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 184 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	108 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
XC2C64A-5CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	5 ns		Yes	1.9 V	64	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	333 MHz	30 s		260 °C (500 °F)	6 mm	Yes	45
5M240ZT100C5	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192			79		1.8			Flatpack, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	79 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e0	118.3 MHz		79		14 mm		79
ATF22V10CQZ-20SU-T	Microchip Technology	Flash PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	20 ns		Yes	5.5 V		CMOS		22		5	Tape and Reel		Small Outline	SOP24,.4			Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm				38.5 MHz		10		15.4 mm	No	10
EPM570T100C3N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5.4 ns		Yes	2.625 V	440	CMOS		76		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 76 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			76		14 mm	Yes	76
XC95108-15PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC95288XL-6TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6 ns		Yes	3.6 V	288	CMOS		117		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	208.3 MHz	30 s	117	260 °C (500 °F)	20 mm	Yes	117
5M40ZM64C4N	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V						1.8			Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	184.1 MHz				4.5 mm		30
5M40ZM64C5N	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V						1.8			Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V		.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B64	3	1.2 mm	4.5 mm	No		e1	118.3 MHz	30 s		260 °C (500 °F)	4.5 mm		30
EPM1270M256I5N	Intel	Flash PLD		Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS		212		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
ISPLSI2032E-110LJ44	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	13 ns		Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC2C32A-6VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	85 °C (185 °F)	33 I/O		-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e4	300 MHz				10 mm	Yes	33
ATF1502ASV-15JU44	Microchip Technology	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	3.6 V	32	CMOS				3.3	Tube	3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	100 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
ATF16V8BQL-15SU	Microchip Technology	Flash PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	15 ns		Yes	5.5 V		CMOS		18	PAL-TYPE	5	Tube	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	1	2.65 mm	7.5 mm	No		e3	45 MHz	40 s	8	250 °C (482 °F)	12.8 mm		8
EPM2210F324C3N	Intel	Flash PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	1700	CMOS		272		2.5		1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e1			272		19 mm	Yes	272
EPM3128ATC144-10N	Intel	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS				3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 96 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No		e3	98 MHz				20 mm	Yes	96
GAL16V8D-7LJN	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	100 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
GAL22V10D-5LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	5 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	142.8 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
XC2C32A-4CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	4 ns		Yes	1.9 V	32	CMOS				1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	450 MHz	30 s		240 °C (464 °F)	6 mm	Yes	33
5962-8984103LA	Microchip Technology	Flash PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns		No	5.5 V		CMOS	MIL-PRF-38535; MIL-STD-883	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin/Lead - hot dipped	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	50 MHz		10		32 mm		10
EPM7064AETC44-4N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	4.5 ns		Yes	3.6 V	64	CMOS		36	PLA-TYPE	3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	2048	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	222.2 MHz		36		10 mm	Yes	36
EPM7128SQI100-10	Intel	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns		Yes	5.5 V	128	CMOS		84		5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz		84		20 mm	Yes	84

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.