Part | RoHS | Manufacturer | Relay Type | Mounting Feature | Relay Action | Relay Function | Coil or Input Supply Type | Reference Standard | Maximum Contact AC Rating (R Load) | Dielectric Strength Between Open Contacts | Relay Form | Operate Time | Maximum Input Power | Electrical Life | Maximum Contact DC Power Rating (R Load) | Release Time | Insulation Resistance | Coil Power (mW) | Packing Method | Body Length/Diameter | Body Width | Coil Resistance | Sealing | Weight | No. of Terminals | Characteristic Impedance | Physical Dimension | End Contact Plating | Body Height | Dielectric Strength Between Coil & Contacts | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Maximum DC Coil Current | Maximum AC Coil Voltage | Switching Time | Minimum Operating Temperature | DC Coil Release Voltage | Terminal Finish | Maximum DC Contact Current | Termination Type | Nominal Coil Voltage | DC Coil Operate Voltage | Manufacturer Series | Contact Resistance | Input Switching Control Type | End Contact Material | Maximum Insertion Loss | PCB Hole Count | Maximum Isolation | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Minimum Operating Frequency | Voltage Standing Wave Ratio | Terminal Length | Maximum DC Coil Voltage | Maximum Operating Frequency | Maximum Contact AC Power Rating (R Load) | Contact or Output Supply Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT-CO |
DC |
2 Form C |
1.003 W |
700 Ω |
Hermetically Sealed |
125 °C (257 °F) |
5 A |
38 mA |
-65 °C (-85 °F) |
5 A |
Solder/Quick Connect |
26.5 V |
AC/DC |
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|
Omron |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
0.3A@125VAC |
750 Vrms |
2 Form C |
3 ms |
1 W |
100000 Cycle(s) |
3 ms |
1 GΩ |
100 mW |
Tube |
0.524 in (13.3 mm) |
6.9 in (175.26 mm) |
237 Ω |
Sealed Type |
950 mg |
8 |
50 Ω |
0.524 x 0.272 x 0.217 in (13.3 x 6.9 x 5.5 mm) |
0.217 in (5.5 mm) |
750 Vrms |
1A@30VDC |
70 °C (158 °F) |
300 mA |
21 mA |
6 ms |
-40 °C (-40 °F) |
500 mV |
Tin |
1 A |
Solder |
5 V |
4 V |
100 mΩ |
Random |
0.2 dB |
12 |
30 dB |
30 V |
125 V |
e3 |
1.2 |
0.1339 in (3.401 mm) |
7.5 V |
1000 MHz |
AC/DC |
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|
Omron |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
0.3A@125VAC |
750 Vrms |
2 Form C |
3 ms |
1 W |
100000 Cycle(s) |
3 ms |
1 GΩ |
100 mW |
Tube |
0.524 in (13.3 mm) |
6.9 in (175.26 mm) |
194 Ω |
Sealed Type |
950 mg |
8 |
50 Ω |
0.524 x 0.272 x 0.217 in (13.3 x 6.9 x 5.5 mm) |
0.217 in (5.5 mm) |
750 Vrms |
1A@30VDC |
70 °C (158 °F) |
300 mA |
23 mA |
6 ms |
-40 °C (-40 °F) |
450 mV |
Tin |
1 A |
Solder |
4.5 V |
3.6 V |
100 mΩ |
Random |
0.2 dB |
8 |
30 dB |
30 V |
125 V |
e3 |
1.2 |
133.858 in (3399.993 mm) |
6.75 V |
1000 MHz |
AC/DC |
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|
Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPST |
DC |
1 W |
369.23 mW |
0.475 in (12.07 mm) |
9.53 in (242.062 mm) |
390 Ω |
Hermetically Sealed |
50 Ω |
0.475 x 0.375 x 0.28 in (12.07 x 9.53 x 7.11 mm) |
0.28 in (7.11 mm) |
85 °C (185 °F) |
308 mA |
4 ms |
-55 °C (-67 °F) |
Gold |
Solder |
9 V |
0.3 dB |
Low Level Contact Life 10,000,000 |
e4 |
0 pHz |
1.25 |
12 V |
3000 MHz |
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|
Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPST |
DC |
1 W |
372 mW |
0.475 in (12.07 mm) |
9.53 in (242.062 mm) |
390 Ω |
Hermetically Sealed |
50 Ω |
0.475 x 0.375 x 0.28 in (12.07 x 9.53 x 7.11 mm) |
0.28 in (7.11 mm) |
85 °C (185 °F) |
31 mA |
4 ms |
-55 °C (-67 °F) |
Gold |
Solder |
9 V |
A150 |
0.3 dB |
Low Level Contact Life 10,000,000 |
e4 |
0 pHz |
1.25 |
12 V |
3000 MHz |
DC |
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|
Omron |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
0.3A@125VAC |
750 Vrms |
2 Form C |
3 ms |
1 W |
100000 Cycle(s) |
3 ms |
1 GΩ |
100 mW |
Tube |
0.524 in (13.3 mm) |
6.9 in (175.26 mm) |
5.22 kΩ |
Sealed Type |
950 mg |
8 |
50 Ω |
0.524 x 0.272 x 0.217 in (13.3 x 6.9 x 5.5 mm) |
0.217 in (5.5 mm) |
750 Vrms |
1A@30VDC |
70 °C (158 °F) |
300 mA |
5 mA |
6 ms |
-40 °C (-40 °F) |
2.4 V |
Tin |
1 A |
Solder |
24 V |
19.2 V |
100 mΩ |
Random |
0.2 dB |
8 |
30 dB |
30 V |
125 V |
e3 |
1.2 |
133.858 in (3399.993 mm) |
36 V |
1000 MHz |
AC/DC |
||||||||||
Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
2 Form C |
6 ms |
3 ms |
1 GΩ |
200 mW |
0.37 in (9.4 mm) |
100 Ω |
Hermetically Sealed |
4.5 g |
8 |
0.37 x 0.385 in (9.4 x 9.78 mm) |
0.385 in (9.78 mm) |
1A@28VDC |
85 °C (185 °F) |
50 mA |
9 ms |
-55 °C (-67 °F) |
1 A |
Solder |
5 V |
3.6 V |
RF303 |
150 mΩ |
Random |
28 V |
Electrical Life For Low Level Ratings is 10,000,000 |
0.748 in (18.999 mm) |
5 V |
DC |
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|
Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
6 ms |
3 ms |
200 mW |
0.335 in (8.51 mm) |
850 Ω |
Hermetically Sealed |
0.385 in (9.78 mm) |
1A@28VDC |
85 °C (185 °F) |
14 mA |
9 ms |
-55 °C (-67 °F) |
Gold |
1 A |
Solder |
9 V |
28 V |
Electrical Life For Low Level Ratings is 10,000,000 |
e4 |
12 V |
DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; EN; ICEQ; IEC; UL |
2A@250VAC |
9 ms |
60 W |
500000 Cycle(s) |
9 ms |
80 mW |
Box; Tube |
0.588 in (14.93 mm) |
7.27 in (184.658 mm) |
313 Ω |
IP67 |
50 Ω |
0.588 x 0.286 x 0.421 in (14.93 x 7.27 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
16 mA |
18 ms |
-55 °C (-67 °F) |
500 mV |
2 A |
Solder |
3.75 V |
-0.03 dB |
-34 dB |
220 V |
Release Time with Diode |
250 V |
100 MHz |
1.45 |
5 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
SPDT |
DC |
UL |
4A@250VAC |
8 ms |
60 W |
100000 Cycle(s) |
4 ms |
140 mW |
Tube |
0.394 in (10 mm) |
6 in (152.4 mm) |
178 Ω |
IP67; RT5 |
0.394 x 0.236 x 0.222 in (10 x 6 x 5.65 mm) |
0.222 in (5.65 mm) |
4A@220VDC |
85 °C (185 °F) |
4 A |
28 mA |
12 ms |
-40 °C (-40 °F) |
500 mV |
4 A |
Solder |
3.75 V |
0.33 dB |
220 V |
Insertion Loss Max at 900 MHz, Isolation-Max at 900 MHz, VSWR Max at 900 MHz, Release Time Captured for with Diode in Parallel |
250 V |
1.49 |
5 V |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; IEC; UL |
2A@250VAC |
9 ms |
500000 Cycle(s) |
9 ms |
140 mW |
Box; Tube |
0.591 in (15 mm) |
7.3 in (185.42 mm) |
114 Ω |
IP67 |
0.591 x 0.287 x 0.421 in (15 x 7.3 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
35 mA |
18 ms |
-55 °C (-67 °F) |
400 mV |
2 A |
Solder |
2.8 V |
-0.6 dB |
-15.1 dB |
220 V |
Release Time with Diode in Parallel |
250 V |
100 MHz |
1.45 |
4 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; IEC; UL |
2A@250VAC |
1.8 kVrms |
2 Form C |
9 ms |
500000 Cycle(s) |
60W@220VDC |
9 ms |
1 GΩ |
140 mW |
Box; Tube |
0.591 in (15 mm) |
7.3 in (185.42 mm) |
178 Ω |
IP67 |
2.5 g |
8 |
0.591 x 0.287 x 0.421 in (15 x 7.3 x 10.7 mm) |
Gold |
0.421 in (10.7 mm) |
1.8 kVrms |
2A@220VDC |
85 °C (185 °F) |
2 A |
28 mA |
18 ms |
-55 °C (-67 °F) |
500 mV |
2 A |
Solder |
5 V |
3.5 V |
70 mΩ |
Random |
Palladium Ruthenium |
-0.6 dB |
8 |
-15.1 dB |
220 V |
Release Time with Diode in Parallel |
250 V |
100 MHz |
1.45 |
0.1299 in (3.299 mm) |
5 V |
900 MHz |
62.5VA@250VAC |
AC/DC |
|||||||
|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; IEC; UL |
2A@250VAC |
9 ms |
500000 Cycle(s) |
9 ms |
260 mW |
Box; Tube |
0.591 in (15 mm) |
7.3 in (185.42 mm) |
8.882 kΩ |
IP67 |
0.591 x 0.287 x 0.421 in (15 x 7.3 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
5 mA |
18 ms |
-55 °C (-67 °F) |
4.8 V |
2 A |
Solder |
36 V |
-0.6 dB |
-15.1 dB |
220 V |
Release Time with Diode in Parallel |
250 V |
100 MHz |
1.45 |
48 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; EN; ICEQ; IEC; UL |
2A@250VAC |
9 ms |
60 W |
500000 Cycle(s) |
9 ms |
200 mW |
Box; Tube |
0.588 in (14.93 mm) |
7.27 in (184.658 mm) |
2.88 kΩ |
IP67 |
50 Ω |
0.588 x 0.286 x 0.421 in (14.93 x 7.27 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
8 mA |
18 ms |
-55 °C (-67 °F) |
2.4 V |
2 A |
Solder |
16.8 V |
-0.03 dB |
-34 dB |
220 V |
Release Time with Diode |
250 V |
100 MHz |
1.45 |
24 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; EN; ICEQ; IEC; UL |
2A@250VAC |
9 ms |
60 W |
500000 Cycle(s) |
9 ms |
300 mW |
Box; Tube |
0.588 in (14.93 mm) |
7.27 in (184.658 mm) |
7.68 kΩ |
IP67 |
50 Ω |
0.588 x 0.286 x 0.421 in (14.93 x 7.27 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
6 mA |
18 ms |
-55 °C (-67 °F) |
4.8 V |
2 A |
Solder |
33.6 V |
-0.03 dB |
-34 dB |
220 V |
Release Time with Diode |
250 V |
100 MHz |
1.45 |
48 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
UL |
2A@250VAC |
9 ms |
500000 Cycle(s) |
9 ms |
140 mW |
Box; Tube |
0.589 in (14.95 mm) |
7.3 in (185.42 mm) |
145 Ω |
IP67/RT5 |
50 Ω |
0.589 x 0.287 x 0.421 in (14.95 x 7.3 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
31 mA |
18 ms |
-55 °C (-67 °F) |
450 mV |
2 A |
Solder |
3.15 V |
-0.03 dB |
-34 dB |
220 V |
Release Time with Diode |
250 V |
100 MHz |
1.45 |
4.5 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; EN; ICEQ; IEC; UL |
2A@250VAC |
9 ms |
60 W |
500000 Cycle(s) |
9 ms |
80 mW |
Box; Tube |
0.588 in (14.93 mm) |
7.27 in (184.658 mm) |
253 Ω |
IP67 |
50 Ω |
0.588 x 0.286 x 0.421 in (14.93 x 7.27 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
18 mA |
18 ms |
-55 °C (-67 °F) |
450 mV |
2 A |
Solder |
3.38 V |
-0.03 dB |
-34 dB |
220 V |
Release Time with Diode |
250 V |
100 MHz |
1.45 |
4.5 V |
900 MHz |
AC/DC |
||||||||||||||||||||
|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; EN; ICEQ; IEC; UL |
2A@250VAC |
9 ms |
60 W |
500000 Cycle(s) |
9 ms |
80 mW |
Box; Tube |
0.588 in (14.93 mm) |
7.27 in (184.658 mm) |
1.013 kΩ |
IP67 |
50 Ω |
0.588 x 0.286 x 0.421 in (14.93 x 7.27 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
9 mA |
18 ms |
-55 °C (-67 °F) |
900 mV |
2 A |
Solder |
6.75 V |
-0.03 dB |
-34 dB |
220 V |
Release Time with Diode |
250 V |
100 MHz |
1.45 |
9 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; EN; ICEQ; IEC; UL |
2A@250VAC |
9 ms |
60 W |
500000 Cycle(s) |
9 ms |
80 mW |
Box; Tube |
0.588 in (14.93 mm) |
7.27 in (184.658 mm) |
1.8 kΩ |
IP67 |
50 Ω |
0.588 x 0.286 x 0.421 in (14.93 x 7.27 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
7 mA |
18 ms |
-55 °C (-67 °F) |
1.2 V |
2 A |
Solder |
9 V |
-0.03 dB |
-34 dB |
220 V |
Release Time with Diode |
250 V |
100 MHz |
1.45 |
12 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Latched |
DPDT |
DC |
CECC; CSA; EN; ICEQ; IEC; UL |
2A@250VAC |
9 ms |
60 W |
500000 Cycle(s) |
9 ms |
100 mW |
Box; Tube |
0.588 in (14.93 mm) |
7.27 in (184.658 mm) |
203 Ω |
IP67 |
50 Ω |
0.588 x 0.286 x 0.421 in (14.93 x 7.27 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
22 mA |
18 ms |
-55 °C (-67 °F) |
3.375 V |
2 A |
Solder |
3.375 V |
-0.03 dB |
-34 dB |
220 V |
Release Time with Diode |
250 V |
100 MHz |
1.45 |
4.5 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Latched |
DPDT |
DC |
CECC; CSA; EN; ICEQ; IEC; UL |
2A@250VAC |
1.8 kVrms |
2 Form C |
9 ms |
60 W |
500000 Cycle(s) |
60W@220VDC |
9 ms |
1 GΩ |
100 mW |
Box; Tube |
0.588 in (14.93 mm) |
7.27 in (184.658 mm) |
250 Ω |
IP67 |
2.5 g |
8 |
50 Ω |
0.588 x 0.286 x 0.421 in (14.93 x 7.27 x 10.7 mm) |
Gold |
0.421 in (10.7 mm) |
1.8 kVrms |
2A@220VDC |
85 °C (185 °F) |
2 A |
20 mA |
18 ms |
-55 °C (-67 °F) |
3.75 V |
2 A |
Solder |
5 V |
3.75 V |
70 mΩ |
Random |
Palladium Ruthenium |
-0.03 dB |
8 |
-34 dB |
220 V |
Release Time with Diode |
250 V |
100 MHz |
1.45 |
0.1299 in (3.299 mm) |
5 V |
900 MHz |
62.5VA@250VAC |
AC/DC |
|||||
|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; IEC; UL |
2A@250VAC |
9 ms |
500000 Cycle(s) |
9 ms |
140 mW |
Box; Tube |
0.591 in (15 mm) |
7.3 in (185.42 mm) |
1.028 kΩ |
IP67 |
0.591 x 0.287 x 0.421 in (15 x 7.3 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
12 mA |
18 ms |
-55 °C (-67 °F) |
1.2 V |
2 A |
Solder |
8.4 V |
-0.6 dB |
-15.1 dB |
220 V |
Release Time with Diode in Parallel |
250 V |
100 MHz |
1.45 |
12 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; IEC; UL |
2A@250VAC |
9 ms |
500000 Cycle(s) |
9 ms |
140 mW |
Box; Tube |
0.591 in (15 mm) |
7.3 in (185.42 mm) |
257 Ω |
IP67 |
0.591 x 0.287 x 0.421 in (15 x 7.3 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
23 mA |
18 ms |
-55 °C (-67 °F) |
600 mV |
2 A |
Solder |
4.2 V |
-0.6 dB |
-15.1 dB |
220 V |
Release Time with Diode in Parallel |
250 V |
100 MHz |
1.45 |
6 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; IEC; UL |
2A@250VAC |
9 ms |
500000 Cycle(s) |
9 ms |
140 mW |
Box; Tube |
0.591 in (15 mm) |
7.3 in (185.42 mm) |
574 Ω |
IP67 |
0.591 x 0.287 x 0.421 in (15 x 7.3 x 10.7 mm) |
0.421 in (10.7 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
16 mA |
18 ms |
-55 °C (-67 °F) |
900 mV |
2 A |
Solder |
6.3 V |
-0.6 dB |
-15.1 dB |
220 V |
Release Time with Diode in Parallel |
250 V |
100 MHz |
1.45 |
9 V |
900 MHz |
AC/DC |
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|
Panasonic |
RF Relay |
Through Hole-Straight Mount |
Latched |
SPDT |
DC |
10 ms |
1 W |
1000000 Cycle(s) |
6 ms |
200 mW |
Box |
0.551 in (14 mm) |
8.6 in (218.44 mm) |
720 Ω |
50 Ω |
0.551 x 0.339 x 0.283 in (14 x 8.6 x 7.2 mm) |
0.283 in (7.2 mm) |
0.5A@30VDC |
70 °C (158 °F) |
17 mA |
16 ms |
-40 °C (-40 °F) |
9 V |
Gold |
500 mA |
Solder |
9 V |
ARS |
0.35 dB |
35 dB |
30 V |
e4 |
0 pHz |
1.4 |
12 V |
3000 MHz |
DC |
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|
Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
0.25A@115VAC |
2 Form C |
2 ms |
100000 Cycle(s) |
4 ms |
10 GΩ |
450 mW |
0.37 in (9.4 mm) |
50 Ω |
Hermetically Sealed |
2.55 g |
9 |
0.37 x 0.27 in (9.4 x 6.86 mm) |
0.27 in (6.86 mm) |
1A@28VDC |
125 °C (257 °F) |
250 mA |
90 mA |
6 ms |
-65 °C (-85 °F) |
140 mV |
Gold |
1 A |
Solder |
5 V |
3.5 V |
100 mΩ |
Random |
28 V |
With Internal Diode for Coil Suppression |
115 V |
e4 |
0.189 in (4.801 mm) |
5 V |
AC/DC |
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Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
4 ms |
3 ms |
450 mW |
0.335 in (8.51 mm) |
390 Ω |
Hermetically Sealed |
0.275 in (6.99 mm) |
1A@28VDC |
85 °C (185 °F) |
31 mA |
7 ms |
-55 °C (-67 °F) |
1 A |
Solder |
9 V |
28 V |
Electrical Life For Low Level Ratings is 10,000,000 |
12 V |
DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
SPDT |
DC |
CSA; EN; IEC; UL |
0.46A@150VAC |
5 ms |
30 W |
10000 Cycle(s) |
4 ms |
68 mW |
Box; Tube |
0.512 in (13 mm) |
7.6 in (193.04 mm) |
370 Ω |
IP7/RT3 |
0.512 x 0.299 x 0.272 in (13 x 7.6 x 6.9 mm) |
0.272 in (6.9 mm) |
1A@30VDC |
70 °C (158 °F) |
460 mA |
14 mA |
5 ms |
-40 °C (-40 °F) |
500 mV |
1 A |
Solder |
3.75 V |
1393774 |
-1.9 dB |
-18 dB |
30 V |
Polarized |
150 V |
100 MHz |
1.75 |
5 V |
900 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
CECC; CSA; UL |
2A@250VAC |
750 Vrms |
2 Form C |
9 ms |
100000 Cycle(s) |
60W@220VDC |
9 ms |
1 GΩ |
80 mW |
Box; Tube |
0.551 in (14 mm) |
9 in (228.6 mm) |
1.8 kΩ |
IP67 |
2 g |
10 |
0.551 x 0.354 x 0.197 in (14 x 9 x 5 mm) |
Gold |
0.197 in (5 mm) |
1 kVrms |
2A@125VDC |
85 °C (185 °F) |
2 A |
7 mA |
18 ms |
-55 °C (-67 °F) |
1.2 V |
2 A |
Solder |
12 V |
9 V |
50 mΩ |
Random |
Silver Nickel |
-0.25 dB |
10 |
-22.3 dB |
125 V |
Release Time with Diode in Parallel |
250 V |
100 MHz |
1.07 |
0.126 in (3.2 mm) |
12 V |
900 MHz |
62.5VA@250VAC |
AC/DC |
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|
Omron |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
0.3A@125VAC |
750 Vrms |
2 Form C |
3 ms |
1 W |
100000 Cycle(s) |
3 ms |
1 GΩ |
100 mW |
Tube |
0.524 in (13.3 mm) |
6.9 in (175.26 mm) |
91 Ω |
Sealed Type |
950 mg |
8 |
50 Ω |
0.524 x 0.272 x 0.217 in (13.3 x 6.9 x 5.5 mm) |
0.217 in (5.5 mm) |
750 Vrms |
1A@30VDC |
70 °C (158 °F) |
300 mA |
33 mA |
6 ms |
-40 °C (-40 °F) |
300 mV |
Tin |
1 A |
Solder |
3 V |
2.4 V |
100 mΩ |
Random |
0.2 dB |
8 |
30 dB |
30 V |
125 V |
e3 |
1.2 |
133.858 in (3399.993 mm) |
4.5 V |
1000 MHz |
AC/DC |
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Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
2 Form C |
4 ms |
3 ms |
1 GΩ |
500 mW |
0.375 in (9.53 mm) |
9.53 in (242.062 mm) |
50 Ω |
Hermetically Sealed |
2.55 g |
8 |
0.375 x 0.375 x 0.29 in (9.53 x 9.53 x 7.37 mm) |
0.29 in (7.37 mm) |
85 °C (185 °F) |
100 mA |
4 ms |
-55 °C (-67 °F) |
Solder |
5 V |
3.6 V |
RF100 |
100 mΩ |
Random |
Electrical Life: 10,000,000 at Low Level and Contact Voltage(DC)-Max: 0.01 mA at 10 mV |
0.748 in (18.999 mm) |
5 V |
DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
IEC; UL |
2A@250VAC |
750 Vrms |
2 Form C |
9 ms |
500000 Cycle(s) |
60W@220VDC |
9 ms |
1 GΩ |
140 mW |
Box; Tube |
0.551 in (14 mm) |
9 in (228.6 mm) |
1.028 kΩ |
IP67/RT3 |
2 g |
10 |
0.551 x 0.354 x 0.323 in (14 x 9 x 8.2 mm) |
Gold |
0.323 in (8.2 mm) |
1 kVrms |
2A@220VDC |
85 °C (185 °F) |
2 A |
10 mA |
-40 °C (-40 °F) |
1.2 V |
2 A |
Solder |
12 V |
8.4 V |
50 mΩ |
Random |
Silver Nickel |
-0.03 dB |
10 |
-40.2 dB |
220 V |
250 V |
0 pHz |
1.01 |
0.126 in (3.2 mm) |
12 V |
900 MHz |
62.5VA@250VAC |
AC/DC |
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|
Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
0.25A@115VAC |
2 Form C |
2 ms |
100000 Cycle(s) |
4 ms |
10 GΩ |
450 mW |
0.37 in (9.4 mm) |
39 Ω |
Hermetically Sealed |
2.55 g |
9 |
0.37 x 0.27 in (9.4 x 6.86 mm) |
0.27 in (6.86 mm) |
1A@28VDC |
125 °C (257 °F) |
250 mA |
128 mA |
6 ms |
-65 °C (-85 °F) |
600 mV |
Gold |
1 A |
Solder |
5 V |
3.9 V |
412 |
100 mΩ |
Random |
28 V |
With Internal Diode for Coil Transient Suppression |
115 V |
e4 |
0.189 in (4.801 mm) |
5 V |
AC/DC |
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TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
DPDT-CO |
DC |
2 Form C |
1.003 W |
700 Ω |
Hermetically Sealed |
125 °C (257 °F) |
2 A |
-65 °C (-85 °F) |
2 A |
Solder/Quick Connect |
26.5 V |
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|
Panasonic |
RF Relay |
Through Hole-Straight Mount |
Momentary |
SPDT |
DC |
500 Vrms |
1 Form C |
10 ms |
10 W |
300000 Cycle(s) |
5 ms |
100 MΩ |
200 mW |
Bulk |
0.795 in (20.2 mm) |
11.2 in (284.48 mm) |
720 Ω |
5 g |
9 |
50 Ω |
0.795 x 0.441 x 0.35 in (20.2 x 11.2 x 8.9 mm) |
Gold |
0.35 in (8.9 mm) |
1 kVrms |
0.5A@30VDC |
70 °C (158 °F) |
17 mA |
15 ms |
-40 °C (-40 °F) |
1.2 V |
500 mA |
Solder |
12 V |
9 V |
100 mΩ |
Random |
0.7 dB |
9 |
30 dB |
30 V |
Release Time without Diode |
900 MHz |
1.7 |
0.1181 in (3 mm) |
12 V |
2600 MHz |
DC |
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Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
4 ms |
3 ms |
450 mW |
0.335 in (8.51 mm) |
50 Ω |
Hermetically Sealed |
0.275 in (6.99 mm) |
1A@28VDC |
85 °C (185 °F) |
100 mA |
7 ms |
-55 °C (-67 °F) |
1 A |
Solder |
3.6 V |
28 V |
Electrical Life For Low Level Ratings is 10,000,000 |
5 V |
DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
IEC; UL |
0.5A@125VAC |
750 Vrms |
2 Form C |
9 ms |
60 W |
300000 Cycle(s) |
60W@220VDC |
8 ms |
1 GΩ |
200 mW |
Box; Tube |
0.552 in (14.02 mm) |
9.02 in (229.108 mm) |
2.88 kΩ |
IP67/RT3 |
2 g |
10 |
0.552 x 0.355 x 0.197 in (14.02 x 9.02 x 5 mm) |
Gold |
0.197 in (5 mm) |
1 kVrms |
2A@30VDC |
85 °C (185 °F) |
500 mA |
8 mA |
9 ms |
-55 °C (-67 °F) |
2.4 V |
2 A |
Solder |
24 V |
16.8 V |
50 mΩ |
Random |
Silver Nickel |
-0.25 dB |
10 |
-22.3 dB |
30 V |
125 V |
100 MHz |
1.07 |
0.126 in (3.2 mm) |
24 V |
900 MHz |
62.5VA@250VAC |
AC/DC |
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|
Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
0.25A@115VAC |
2 Form C |
2 ms |
100000 Cycle(s) |
1.5 ms |
10 GΩ |
450 mW |
0.37 in (9.4 mm) |
1.56 kΩ |
Hermetically Sealed |
2.55 g |
9 |
0.37 x 0.27 in (9.4 x 6.86 mm) |
0.27 in (6.86 mm) |
1A@28VDC |
125 °C (257 °F) |
250 mA |
17 mA |
3.5 ms |
-65 °C (-85 °F) |
890 mV |
Gold |
1 A |
Solder |
26.5 V |
18 V |
100 mΩ |
Random |
28 V |
115 V |
e4 |
0.189 in (4.801 mm) |
26.5 V |
AC/DC |
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Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Latched |
DPDT |
DC |
0.25A@115VAC |
2 Form C |
3.5 ms |
1000000 Cycle(s) |
10 GΩ |
290 mW |
0.37 in (9.4 mm) |
2 kΩ |
Hermetically Sealed |
10 |
0.37 x 0.305 in (9.4 x 7.75 mm) |
0.305 in (7.75 mm) |
1A@28VDC |
125 °C (257 °F) |
250 mA |
11 mA |
-65 °C (-85 °F) |
18 V |
Tin/Lead |
1 A |
Solder |
26.5 V |
18 V |
225 mΩ |
Random |
28 V |
115 V |
e0 |
0.185 in (4.699 mm) |
32 V |
AC/DC |
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|
Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Latched |
DPDT |
DC |
2 ms |
100000 Cycle(s) |
480 mW |
0.435 in (11.05 mm) |
8.51 in (216.154 mm) |
500 Ω |
Hermetically Sealed |
0.435 x 0.335 x 0.3 in (11.05 x 8.51 x 7.62 mm) |
0.3 in (7.62 mm) |
0.5A@28VDC |
85 °C (185 °F) |
30 mA |
2 ms |
-55 °C (-67 °F) |
9 V |
500 mA |
Solder |
9 V |
28 V |
16 V |
DC |
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Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Latched |
DPDT |
DC |
2 Form C |
2 ms |
100000 Cycle(s) |
7W@28VDC |
1 GΩ |
588 mW |
0.435 in (11.05 mm) |
8.51 in (216.154 mm) |
61 Ω |
Hermetically Sealed |
2.9 g |
10 |
0.435 x 0.335 x 0.3 in (11.05 x 8.51 x 7.62 mm) |
Gold |
0.3 in (7.62 mm) |
0.5A@28VDC |
85 °C (185 °F) |
98 mA |
2 ms |
-55 °C (-67 °F) |
3.5 V |
500 mA |
Solder |
5 V |
3.5 V |
RF180 |
150 mΩ |
Random |
10 |
28 V |
0.748 in (18.999 mm) |
6 V |
DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
IEC; UL |
0.5A@125VAC |
750 Vrms |
2 Form C |
9 ms |
60 W |
300000 Cycle(s) |
60W@220VDC |
8 ms |
1 GΩ |
80 mW |
Box; Tube |
0.552 in (14.02 mm) |
9.02 in (229.108 mm) |
313 Ω |
IP67/RT3 |
2 g |
10 |
0.552 x 0.355 x 0.197 in (14.02 x 9.02 x 5 mm) |
Gold |
0.197 in (5 mm) |
1 kVrms |
2A@30VDC |
85 °C (185 °F) |
500 mA |
16 mA |
9 ms |
-55 °C (-67 °F) |
500 mV |
2 A |
Solder |
5 V |
3.75 V |
50 mΩ |
Random |
Silver Nickel |
-0.25 dB |
10 |
-22.3 dB |
30 V |
125 V |
100 MHz |
1.07 |
0.126 in (3.2 mm) |
5 V |
900 MHz |
62.5VA@250VAC |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Latched |
DPDT |
DC |
IEC; UL |
0.5A@125VAC |
750 Vrms |
2 Form C |
9 ms |
60 W |
300000 Cycle(s) |
60W@220VDC |
9 ms |
1 GΩ |
100 mW |
Box; Tube |
0.552 in (14.02 mm) |
9.02 in (229.108 mm) |
1.44 kΩ |
IP67/RT3 |
2 g |
10 |
0.552 x 0.355 x 0.197 in (14.02 x 9.02 x 5 mm) |
Gold |
0.197 in (5 mm) |
1 kVrms |
2A@30VDC |
85 °C (185 °F) |
500 mA |
8 mA |
9 ms |
-55 °C (-67 °F) |
9 V |
2 A |
Solder |
12 V |
9 V |
50 mΩ |
Random |
Silver Nickel |
-0.25 dB |
10 |
-22.3 dB |
30 V |
125 V |
100 MHz |
1.07 |
0.126 in (3.2 mm) |
12 V |
900 MHz |
62.5VA@250VAC |
AC/DC |
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|
Omron |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
0.3A@125VAC |
750 Vrms |
2 Form C |
3 ms |
1 W |
100000 Cycle(s) |
3 ms |
1 GΩ |
100 mW |
Tube |
0.524 in (13.3 mm) |
6.9 in (175.26 mm) |
1.315 kΩ |
Sealed Type |
950 mg |
8 |
50 Ω |
0.524 x 0.272 x 0.217 in (13.3 x 6.9 x 5.5 mm) |
0.217 in (5.5 mm) |
750 Vrms |
1A@30VDC |
70 °C (158 °F) |
300 mA |
9 mA |
6 ms |
-40 °C (-40 °F) |
1.2 V |
Tin |
1 A |
Solder |
12 V |
9.6 V |
100 mΩ |
Random |
0.2 dB |
12 |
30 dB |
30 V |
125 V |
e3 |
1.2 |
0.1339 in (3.401 mm) |
18 V |
1000 MHz |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Latched |
SPDT |
DC |
2A@250VAC |
140 mW |
Box; Tape and Reel |
0.587 in (14.9 mm) |
7.5 in (190.5 mm) |
145 Ω |
RT3 |
0.587 x 0.295 x 0.413 in (14.9 x 7.5 x 10.5 mm) |
0.413 in (10.5 mm) |
2A@220VDC |
85 °C (185 °F) |
2 A |
28 mA |
2 A |
Solder |
-0.12 dB |
-80 dB |
220 V |
250 V |
3 MHz |
1.45 |
5 V |
900 MHz |
AC/DC |
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TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
UL |
1A@125VAC |
11 ms |
60 W |
100000 Cycle(s) |
9 ms |
400 mW |
Box; Tube |
0.795 in (20.2 mm) |
10 in (254 mm) |
63 Ω |
IP67/RT3 |
0.795 x 0.394 x 0.433 in (20.2 x 10 x 11 mm) |
0.433 in (11 mm) |
1A@30VDC |
75 °C (167 °F) |
1 A |
79 mA |
11 ms |
-25 °C (-13 °F) |
250 mV |
1 A |
Solder |
3.5 V |
1393793 |
-0.97 dB |
-14.2 dB |
30 V |
125 V |
100 MHz |
1.31 |
5 V |
900 MHz |
AC/DC |
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|
Teledyne Technologies |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT |
DC |
0.1A@115VAC |
2 Form C |
3.5 ms |
1000000 Cycle(s) |
5.5 ms |
10 GΩ |
369.23 mW |
0.375 in (9.53 mm) |
9.53 in (242.062 mm) |
390 Ω |
Hermetically Sealed |
2.55 g |
9 |
0.375 x 0.375 x 0.275 in (9.53 x 9.53 x 6.99 mm) |
0.275 in (6.99 mm) |
1A@28VDC |
125 °C (257 °F) |
100 mA |
31 mA |
9 ms |
-65 °C (-85 °F) |
410 mV |
Gold |
1 A |
Solder |
12 V |
9 V |
200 mΩ |
Random |
28 V |
Low Profile, with Internal Diode |
115 V |
e4 |
0.187 in (4.75 mm) |
16 V |
AC/DC |
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|
TE Connectivity |
RF Relay |
Through Hole-Straight Mount |
Momentary |
DPDT-CO |
DC |
MIL-R-39016/6 |
0.3A@115VAC |
2 Form C |
6 ms |
100000 Cycle(s) |
6 ms |
900 mW |
0.81 in (20.57 mm) |
10.41 in (264.414 mm) |
160 Ω |
Hermetically Sealed |
0.81 x 0.41 x 0.41 in (20.57 x 10.41 x 10.41 mm) |
0.41 in (10.41 mm) |
2A@28VDC |
125 °C (257 °F) |
2 A |
75 mA |
6 ms |
-65 °C (-85 °F) |
500 mV |
2 A |
Solder/Quick Connect |
9 V |
0.4 dB |
23 dB |
28 V |
115 V |
100 MHz |
1.19 |
12 V |
1000 MHz |
AC/DC |
Radio Frequency (RF) relays are electromagnetic switches that are used to switch high-frequency signals in radio frequency circuits. They are designed to handle signals in the MHz to GHz range, making them suitable for use in a variety of applications, including telecommunications, aerospace, military, and medical equipment.
RF relays can be constructed using various technologies, including reed switches, electromechanical relays, and solid-state relays. Reed switches are the simplest type of RF relay, consisting of two ferromagnetic reeds that are encapsulated in a glass tube. Electromechanical relays use an electromagnetic coil to open and close a set of contacts. Solid-state relays use semiconductor devices to switch the signal.
RF relays can be classified based on their frequency range, power handling capability, and switching time. Some RF relays are designed for high-speed switching, while others are designed for high power applications. In addition, some RF relays are designed for use in harsh environments, such as high temperatures and high vibration environments.