Part | RoHS | Manufacturer | Resistor Type | Mounting Type | Resistance | Rated Power Dissipation (P) | Maximum Operating Temperature | Tolerance | Spacing (Lead) | Element Power Dissipation | Rated Temperature | No. of Functions | Technology | Shape (Package) | No. of Elements | Construction | Packing Method | Size Code | Network Type | Temperature Coef Tracking | No. of Terminals | Package Style (Meter) | Terminal Shape | Sub-Category | Dimensions | First Element Resistance | Minimum Operating Temperature | Temperature Coef (ppm/Cel) | Terminal Finish | Second or Last Element Resistance | Length (Lead) | Height (Package) | Manufacturer Series | Operating Voltage | Additional Features | Length (Package) | JESD-609 Code | Series | Reference Standard | Width (Package) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cts |
ARRAY/NETWORK RESISTOR |
SURFACE MOUNT |
100000 ohm |
1.5 W |
125 Cel |
2 % |
.2 W |
70 Cel |
8 |
RECTANGULAR PACKAGE |
1 |
Rectangular |
Tube |
2244 |
Isolated |
16 |
SMT |
GULL WING |
Array/Network Resistors |
100000 ohm |
-55 Cel |
100 |
TIN SILVER COPPER OVER NICKEL |
100000 ohm |
1.6 mm |
50 V |
11.18 mm |
5.59 mm |
|||||||||||
|
Cts |
ARRAY/NETWORK RESISTOR |
SURFACE MOUNT |
4700 ohm |
1.5 W |
125 Cel |
2 % |
.2 W |
70 Cel |
8 |
RECTANGULAR PACKAGE |
1 |
Rectangular |
Tube |
2244 |
Isolated |
16 |
SMT |
GULL WING |
Array/Network Resistors |
4700 ohm |
-55 Cel |
100 |
TIN SILVER COPPER OVER NICKEL |
4700 ohm |
2.16 mm |
50 V |
11.18 mm |
5.59 mm |
|||||||||||
|
Cts |
ARRAY/NETWORK RESISTOR |
SURFACE MOUNT |
3300 ohm |
1.5 W |
125 Cel |
2 % |
.1 W |
70 Cel |
1 |
RECTANGULAR PACKAGE |
15 |
Rectangular |
Tube |
2244 |
Bussed |
16 |
SMT |
GULL WING |
Array/Network Resistors |
3300 ohm |
-55 Cel |
100 |
TIN SILVER COPPER OVER NICKEL |
3300 ohm |
2.16 mm |
50 V |
11.18 mm |
5.59 mm |
|||||||||||
Vishay Intertechnology |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
22000 ohm |
1.5 W |
150 Cel |
1 % |
2.54 mm |
.3 W |
25 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
7 |
Molded Case |
TUBE |
7909 |
BUSSED |
50 ppm/Cel |
8 |
SIP |
FLAT |
ARRAY/NETWORK RESISTOR |
22000 ohm |
-55 Cel |
100 |
TIN LEAD |
3.43 mm |
4.95 mm |
100 V |
20.07 mm |
e0 |
2.29 mm |
||||||||
Vishay Intertechnology |
ARRAY/NETWORK RESISTOR |
THROUGH HOLE MOUNT |
22000 ohm |
1.5 W |
125 Cel |
2 % |
2.54 mm |
.1 W |
70 Cel |
1 |
METAL GLAZE/THICK FILM |
RECTANGULAR PACKAGE |
15 |
Epoxy Molded |
TUBE |
8525 |
BUSSED |
16 |
DIP |
FLAT |
22000 ohm |
-55 Cel |
100 |
3.3 mm |
3.05 mm |
100 V |
21.59 mm |
MIL-PRF-83401 |
6.35 mm |
Resistor networks and arrays are electronic components that are designed to combine multiple resistors into a single package. These components are commonly used in various electronic circuits and applications where multiple resistors are required in a small space. Resistor networks and arrays come in different configurations and types, including isolated and non-isolated networks, bussed and isolated bussed arrays, thick and thin film technologies, and more.
Isolated resistor networks and arrays consist of several isolated resistors that are enclosed in a single package. They are used in applications where separate biasing and matching of each resistor is required. Non-isolated resistor networks and arrays consist of resistors that share a common connection, and they are used in applications where multiple resistors are required for biasing or filtering.
Bussed resistor arrays are designed with a common connection between the resistors in a single package, which simplifies the wiring process and reduces the overall size of the circuit. Isolated bussed resistor arrays, on the other hand, offer the benefits of a bussed resistor array, but with the added isolation of the resistors from each other, which can be beneficial in certain applications.
Thick film resistor networks and arrays are made of a ceramic substrate on which a resistive film is deposited. Thin film resistor networks and arrays, on the other hand, are made by depositing a thin film of metal or metal oxide on a ceramic substrate. These technologies offer different performance characteristics, such as power handling, temperature coefficient, and noise performance.