THROUGH HOLE MOUNT RF/Microwave Mixers 14

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Part RoHS Manufacturer RF or Microwave Device Type Mounting Feature No. of Terminals Package Body Material Technology Screening Level Maximum Input Power (CW) Maximum Voltage Standing Wave Ratio Maximum Supply Current Construction Power Supplies (V) Package Equivalence Code Characteristic Impedance Sub-Category Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Maximum Conversion Loss Additional Features JESD-609 Code Minimum Operating Frequency Maximum Operating Frequency

CM-1

Qorvo

DOUBLE BALANCED

THROUGH HOLE MOUNT

8

METAL

23.01 dBm

COMPONENT

DIP8,.2,200

50 ohm

RF/Microwave Mixers

100 Cel

-54 Cel

Bright Tin (Sn)

8.5 dB

e3

.5 MHz

500 MHz

MC12002P

Motorola

DOUBLE BALANCED

THROUGH HOLE MOUNT

14

PLASTIC/EPOXY

ECL

16 mA

DIP14,.3

RF/Microwave Mixers

85 Cel

-30 Cel

Tin/Lead (Sn/Pb)

e0

TL442CJ

Texas Instruments

THROUGH HOLE MOUNT

14

CERAMIC

BIPOLAR

DIP14,.3

RF/Microwave Mixers

70 Cel

0 Cel

TL442CJP4

Texas Instruments

THROUGH HOLE MOUNT

14

CERAMIC

BIPOLAR

DIP14,.3

RF/Microwave Mixers

70 Cel

0 Cel

TL442CNP3

Texas Instruments

THROUGH HOLE MOUNT

14

PLASTIC/EPOXY

BIPOLAR

DIP14,.3

RF/Microwave Mixers

70 Cel

0 Cel

TL442CN3

Texas Instruments

THROUGH HOLE MOUNT

14

PLASTIC/EPOXY

BIPOLAR

DIP14,.3

RF/Microwave Mixers

70 Cel

0 Cel

TL442MJ

Texas Instruments

THROUGH HOLE MOUNT

14

CERAMIC

BIPOLAR

DIP14,.3

RF/Microwave Mixers

125 Cel

-55 Cel

TL442CJ4

Texas Instruments

THROUGH HOLE MOUNT

14

CERAMIC

BIPOLAR

DIP14,.3

RF/Microwave Mixers

70 Cel

0 Cel

TL442MJ/883B

Texas Instruments

THROUGH HOLE MOUNT

14

CERAMIC

BIPOLAR

MIL-STD-883 Class B (Modified)

DIP14,.3

RF/Microwave Mixers

125 Cel

-55 Cel

TL442CN

Texas Instruments

THROUGH HOLE MOUNT

14

PLASTIC/EPOXY

BIPOLAR

DIP14,.3

RF/Microwave Mixers

70 Cel

0 Cel

SA602AFE

NXP Semiconductors

THROUGH HOLE MOUNT

8

CERAMIC

BIPOLAR

2.8 mA

6

DIP8,.3

RF/Microwave Mixers

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

NE602AFE

NXP Semiconductors

THROUGH HOLE MOUNT

8

CERAMIC

BIPOLAR

2.8 mA

6

DIP8,.3

RF/Microwave Mixers

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

e0

NE602AN

NXP Semiconductors

THROUGH HOLE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

2.8 mA

6

DIP8,.3

RF/Microwave Mixers

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

e0

602/BPA

NXP Semiconductors

THROUGH HOLE MOUNT

8

CERAMIC

BIPOLAR

38535Q/M;38534H;883B

4 mA

6

DIP8,.3

RF/Microwave Mixers

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

e0

RF/Microwave Mixers

RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.

RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.

RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.